Siplace X4i reportedly has a placement speed of more than 100,000 cph. Comes standard with a flexible dual-lane conveyor and four 20-nozzle heads. In dual-lane mode, it is said to achieve placement of 110,000 cph for board sizes up to 250 mm x 380 mm. Larger boards up to 436 mm x 380 mm can be processed when running in single conveyor mode. Has a footprint of 8 ft². Is designed to shorten gantry travel distance between feeders and board. A productivity lane enables parallel mode.
This solder delivery and inert atmosphere control system features a
flow monitor that uses nitrogen pressure levels to indicate the level of solder
in the solder pot, and a heated nitrogen path. Is said to provide accurate
solder pot capacity information. Replaces mechanical probes. Has a method to
‘super-heat’ the nitrogen supply. Reportedly enhances flowed solder
performance.
The Ribbon Spreader Tip is designed to apply a flat 1"
or 1.5" bead of adhesive. Snaps on the end of a static mixer. Is said to
be ideal for any application where a wide, flat ribbon of adhesive is
preferable to a bead shape.