caLogo

Products

Siplace X4i reportedly has a placement speed of more than 100,000 cph. Comes standard with a flexible dual-lane conveyor and four 20-nozzle heads. In dual-lane mode, it is said to achieve placement of 110,000 cph for board sizes up to 250 mm x 380 mm. Larger boards up to 436 mm x 380 mm can be processed when running in single conveyor mode.  Has a footprint of 8 ft². Is designed to shorten gantry travel distance between feeders and board. A productivity lane enables parallel mode.

Siemens, www.siemens.com

This solder delivery and inert atmosphere control system features a flow monitor that uses nitrogen pressure levels to indicate the level of solder in the solder pot, and a heated nitrogen path. Is said to provide accurate solder pot capacity information. Replaces mechanical probes. Has a method to ‘super-heat’ the nitrogen supply. Reportedly enhances flowed solder performance.

ACE Production Technologies, www.ace-protech.com

 

The Ribbon Spreader Tip is designed to apply a flat 1" or 1.5" bead of adhesive. Snaps on the end of a static mixer. Is said to be ideal for any application where a wide, flat ribbon of adhesive is preferable to a bead shape.

Sulzer Mixpac USA, www.sulzermixpacusa.com

Page 1569 of 2034

Don't have an account yet? Register Now!

Sign in to your account