Products
The X3 3-D x-ray system inspects PCBs with BGAs and other hidden solder joints. Gathers multiple oblique images to construct a rendering used in identifying solder and component-related defects on both single and double-sided boards. Selectively uses 2-D or 3-D to inspect specific regions. Permits discrimination between top and bottom sides of boards. A typical inspection program is said to be created in fewer than 45 min. Reportedly is suited for inline or offline applications. Has remote programming and real-time SPC software.
YESTech Inc., www.yestechinc.com
Slic Blade line squeegee blades are said to form a surface with low surface energy. Provide 100% electroformed nickel. Solid electroformed nickel reportedly will not chip or flake. Are said to provide lowest wiping pressure and longest blade life; enhanced stencil life and the least stencil damage. Eliminate solder paste sticking and shearing against the blade.
Fine Line Stencil, www.finelinestencil.com
Fine Line Stencil, www.finelinestencil.com
ElectroLaser stencils
offer the precision of laser-cut apertures and
paste release properties of 100% electroformed nickel. Do not contain the trace elements that are liberated to the
aperture walls, causing increased surface roughness. Offer the natural
lubricity of electroformed nickel, which improves fine-pitch print consistency. Have a thickness tolerance of ±8% of material thickness selected, and
are suitable for applications with surface area ratios to 0.55. Feature
positional accuracy of ±0.008% and an aperture dimensional tolerance
of ±8 µm (0.0003"). Come in standard material thicknesses of 0.003, 0.004, 0.005 and 0.006". Additional thicknesses available upon request.
Fine Line Stencil, a division of FCT Assembly, www.finelinestencil.com
Fine Line Stencil, a division of FCT Assembly, www.finelinestencil.com
Press Releases
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- Aven Welcomes Max Ramos to Strengthen Distribution Partner Operations
- ubersmt Expands SMT Line with Juki G-Titan Printer and RS-1R Placement System
- Keiron Technologies to Host LiFT Webinar Focusing on Solving Solder Paste Printing Challenges