Products
The ShareGen SPA 1000 solder paste analyzer provides testing to help control and manage solder paste in the production process. Is said to help reduce defects, including missing components, tombstoning, component misalignment and non-wetting. Is a 6-in-1 solder paste test system that reportedly can perform up to six separate tests that previously would have been performed by separate instruments, in accordance to IEC 61189-5 and IPC-TM-650 standards. Can be used to conduct solder paste "open time" testing.
Ascentech LLC, www.ascentechllc.com
Ascentech LLC, www.ascentechllc.com
The OUC-500 wave unload flat belt conveyor now has three banks of cooling fans. Unloads and cools PCBs exiting the wave soldering process machine. Is variable speed controlled. Has 500-mm wide flat belt and is said to be capable of handling PCBs up to 17.7" in width. Open framing system can be adjusted to meet most wave exit and off-load heights. Three fans per bank (nine fans total) provide cooling for higher temperature Pb-free products.
Promation Inc., www.Pro-mation-Inc.com
Promation Inc., www.Pro-mation-Inc.com
Surveyor monitors the thermal performance of a reflow oven every hour, day and shift. Features include SPC analysis and out-of-tolerance condition identification. Is said to eliminate the need for test boards, while simplifying profiling. Consists of fixed sensors that reportedly eliminate variables associated with thermocouple attachment, an adjustable frame that rides on the oven’s rail or mesh belt, and new surveyor software that automatically stores profiles.
Datapaq, www.datapaq.com
Datapaq, www.datapaq.com
Press Releases
- Libra Industries Expands Precision Fabrication Capabilities in Guaymas with Advanced Amada Laser System
- Distron Adds Second Juki Selective Soldering System to Support Growing Production Demand
- Amtech’s New Process Upgrades Elevate Transparency, Speed, and Manufacturing Readiness
- FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot