Products
Select Technomelt hot melt adhesives are offered in finger-sized, ready-to-use packets. Load directly into the dispensing tank; the dry outer casing melts with the adhesive. Designed to replace sticky cavity packaging and plastic waste. Are available in 28 lb. boxes. Available in ethylene-vinyl-acetate, polyolefin and pressure sensitive technologies. Are used to manufacture filters, packaging, pressure sensitive adhesive films, insulation, textiles, vehicles, and structures.
Henkel Corp., http://www.henkelna.com
The ‘First-Time-Right’ NPI Stencils Initiative for the Alpha product line is said to reduce NPI cycle times. Provides design recommendations for accurate paste volumes and locations; automated application of preprogrammed customer and OEM/product-specific design rules; means to apply a single set of design rules across multiple sites; PCB scaling service that optimizes stencils to better correct for board stretch; regular monitoring and control of the positional accuracy of lasers; stepped stencils and aperture designs to permit single stencils designed for range of deposit volumes.
Cookson Electronics Assembly Materials, www.cooksonelectronics.com
Indium9.32 Die-Attach Solder Paste is a halogen-free, no-clean, die-attach solder paste. Is used in high-volume manufacturing for Pb-free die-attach applications. Is said to exhibit low voiding (<5% total voiding achievable in most instances), as well as ultra-low residue.
Indium, www.indium.com
Press Releases
- Aven Welcomes Max Ramos to Strengthen Distribution Partner Operations
- ubersmt Expands SMT Line with Juki G-Titan Printer and RS-1R Placement System
- Keiron Technologies to Host LiFT Webinar Focusing on Solving Solder Paste Printing Challenges
- Express Manufacturing, Inc. Strengthens Test Capability with Acculogic Flying Probe System