Products
FLX2010 SMD pick-and-place offers 190 feeders and the possibility of feeder changeover during operation. Said to reach a placement rate of 5,000 cph. Places components such as 0201 or ultra fine pitch 0.3 mm. Features a combination of laser and vision centering systems. Component range includes tall condensators (height up to 15 mm), large connectors and BGAs with 50-mm side length. LEDs show feeder status and notify the operator if a min. quantity is reached. The feeder setup control system is based on barcode identification. Programming can be prepared offline during running production. CAD data in any format can be imported; the board is graphically displayed before production. Placement can be controlled virtually.
Essemtec, www.essemtec.com
Free simulation design kits assist with the integration of Altera’s Arria GX FPGAs onto PCBs. Arria GX FPGA transceiver-based devices are said to be ideal for applications where the technology is moving rapidly with short design cycles, such as communications, computer, storage and industrial.
A set of topology templates makes routing to JEDEC-defined signaling standards such as SSTL 1.8V a straightforward process. The kit reportedly makes it easy to compare real-board performance against the theoretical ideal, using waveform and eye pattern analysis, in addition to simulation models. It allows users to view results in both time and frequency domain, displaying both voltage and current.
Zuken, www.zuken.com/linkz
Hysol QMI5100 and Hysol QMI5200 are dicing die attach films designed to streamline the die attach process, particularly for stacked die applications. Combine properties and functions of die attach film and dicing tape into one product; dual structured materials. Reportedly only need to laminate film to backside of wafer; dice the wafer; pick the die and move to die placement; leave no burrs after dicing; eliminate common bleed issues. Said to remove the need for dispensing or curing equipment or process steps. QMI5100 is 10 µm thick material. QMI5200 is available in a thickness of 20 µm; approved for use on DA1 and/or DAX. Primarily for flash and DRAM devices. Die placement down to 0.1 sec. Formulated as pressure sensitive release materials.
Henkel Corp., www.henkel.com/electronics
