Products
Vigon RC 101 is an MPC technology-based cleaning agent for removing baked-on flux residues from reflow ovens and in wave solder processes. Does not have a flash point. Removes lead-free and eutectic flux residues. Said to reduce solder flakes from fingers. Reportedly reduces consumption losses up to 20x. Meets RoHS and WEEE guidelines.
Zestron America, www.zestron.com
Dyne-A-Mite IT CO2 Plasma is said to provide superior surface treatment to improve adhesion on a wide variety of materials. The use of gas or liquid-phase CO2 with atmospheric plasma discharge surface pretreatment technology can remove micron and submicron particulates and hydrocarbon-based contaminations on plastics and metals. Increases surface tension of base substrates. Bonding strength is said to be improved. Is suitable for either initial or final cleaning, and for cleaning applications.
Enercon, www.enerconind.com/treating
The OUC-500 Wave Unload Flat Belt conveyor station provides a means to unload PCBs from the wave. The ESD flat belt is said to be 500 mm and can handle PCBs up to 17" in width. Comes standard with variable speed control and three topside fan arrays. Framing system can be adjusted.
Promation, www.pro-mation-inc.com
