Products
FLO/PCB Version 4.1 thermal design software includes the ability to model potting compounds, probe temperature values interactively, provide user-defined temperature ranges and search component libraries. Is said to make it possible to perform board-level thermal simulation early in the design process. Includes a SmartPart object used to represent epoxy type solid cured potting compounds; can be placed over all or part of either side of the PCB. Multiple potting compound regions reportedly can be defined. Provides the ability to move the cursor over a temperature plot in the results visualization mode and report the point temperature. Using legend scaling options, users can define minimum and maximum values for the upper and lower bounds of the scale. Also includes an advanced search capability. Maintains bi-directional connectivity with Version 7.1 of Flotherm.
Flomerics, www.flopcb.com and www.flomerics.com
The 6-Pack Analysis Package is a sampling service designed to define the cleaning bath loading capacity for inline and batch cleaning processes. Consists of a set of sample bottles for regular sampling directly from the cleaning tank. Each sample is subsequently returned to the analytical center for detailed analysis. A bath-loading report is provided to users, including recommendations on how to further extend the cleaning agent’s bath life.
Zestron America, www.zestron.com
The RO300FC full convection reflow oven has four zones (three heating and one cooling), for all soldering and curing tasks. An inert gas model is also available, and changeovers between air and nitrogen are said to take less than 5 minutes.
The unit is 78.8 x 28 x 47.2". Solder width is 11.8", transport speed is 4 - 31.5".min.
Between heating zones is a "stream seal" that permits temperature differences between two zones up to 90°C (194°F).
Comes with optional RO-CONTROL software, which simulates new processes prior to soldering and graphically compares temperature profiles.
Essemtec, www.essemtec-usa.com
The unit is 78.8 x 28 x 47.2". Solder width is 11.8", transport speed is 4 - 31.5".min.
Between heating zones is a "stream seal" that permits temperature differences between two zones up to 90°C (194°F).
Comes with optional RO-CONTROL software, which simulates new processes prior to soldering and graphically compares temperature profiles.
Essemtec, www.essemtec-usa.com
