Products
The S3X48 Series halide-free no-clean solder pastes from Koki Company Ltd. are said to demonstrate excellent performance across a wide range of Pb-free processing applications. Developed originally for fine-pitch BGA and CSP applications. Perform well at high reflow temperatures; rapid wetting of commonly used Pb-free alloys. Have a wide process window and six-month shelf life. Are said to eliminate “pillow” defects on BGA and CSP devices.
Christopher Associates Inc., www.christopherweb.com
Christopher Associates Inc., www.christopherweb.com
The ShareGen SPA 1000 solder paste analyzer provides testing to help control and manage solder paste in the production process. Is said to help reduce defects, including missing components, tombstoning, component misalignment and non-wetting. Is a 6-in-1 solder paste test system that reportedly can perform up to six separate tests that previously would have been performed by separate instruments, in accordance to IEC 61189-5 and IPC-TM-650 standards. Can be used to conduct solder paste "open time" testing.
Ascentech LLC, www.ascentechllc.com
Ascentech LLC, www.ascentechllc.com
The OUC-500 wave unload flat belt conveyor now has three banks of cooling fans. Unloads and cools PCBs exiting the wave soldering process machine. Is variable speed controlled. Has 500-mm wide flat belt and is said to be capable of handling PCBs up to 17.7" in width. Open framing system can be adjusted to meet most wave exit and off-load heights. Three fans per bank (nine fans total) provide cooling for higher temperature Pb-free products.
Promation Inc., www.Pro-mation-Inc.com
Promation Inc., www.Pro-mation-Inc.com
Press Releases
- Aven Welcomes Max Ramos to Strengthen Distribution Partner Operations
- ubersmt Expands SMT Line with Juki G-Titan Printer and RS-1R Placement System
- Keiron Technologies to Host LiFT Webinar Focusing on Solving Solder Paste Printing Challenges
- Express Manufacturing, Inc. Strengthens Test Capability with Acculogic Flying Probe System