Products
Custom ratios are now available for the DX dispensing system. Custom ratios are said to provide customers with a versatile solution for two-component material dispensing. The system includes a mobile handheld dispenser with a DXR refill station, offering the ability to dispense a variety of ratios for two-component reactive resins. Multiple handheld dispensers reportedly can be refilled with one DXR refill station. The refill station utilizes two transfer pumps that feed from five-gallon bulk containers of material, each equipped with follower plates.
Mixpac Equipment Inc., www.mixpacequipment.com
Mixpac Equipment Inc., www.mixpacequipment.com
The Hot-Bar reflow desktop soldering system has pneumatic force adjustment available with a SH500 bonding head. Replaces spring technology and is said to cover a range up to 500N. Force is set by a manual knob; displays set range on a digital screen on the head. Typical joining applications include flex to PCB, wires to PCB, ribbon cables, and SMT components.
Miyachi Unitek, www.muc.miyachi.com
Miyachi Unitek, www.muc.miyachi.com
These three pick-and-place machines offer head-mounted cameras and Cognex processing for non-contact vision placement of 0201 chips to 16 x 14 mm SMDs and fine-pitch QFPs. Include a bottom vision camera for larger components to 38 x 38 mm. Said to have placement accuracy of ± .002" (± .05 mm) by linear-encoded X-Y drive mechanisms. Reportedly have availability of advanced time pressure digital dispensing for application at dot sizes down to 0.015 mm diameter. Use MC-300 Series control software. The MC-384 has a single head and a reported placement area of 14.5" x 13.4" for a capacity of 128 smart tape feeders. Its throughput is 4,000 cph. The MC-391 includes a three-stage conveyor and is said to have a speed of 5,500 cph on a large 14.75" x 23.4" placement area that can accommodate 160 tape feeders. The MC-387 has a 39.4" x 12" work area; can contain 224 smart tape feeders. Placement speed is said to be 5,500 cph.
Manncorp, www.manncorp.com
