Products
SIwave v3.5 is a full-wave electromagnetic field simulator optimized for signal-integrity, power-integrity, and electromagnetic interference analysis of high-speed PCBs and IC packages. Features a finite-element-based DC solver optimized for extraction of power rail geometry in low-voltage/high-current PCBs and packages. Engineers reportedly can view voltage and current distributions in all relevant geometry, including vias and bond wires; have access to voltage drop and current flow information through vias, bond wires, sources, resistors, inductors, etc. in tabular format. Said to simulate electromagnetic behavior of complex PCBs and IC packages, including multiple, arbitrarily shaped power and ground layers, and any number of vias and signal traces. Full-wave S-, Y- or Z-parameters or GHz-bandwidth circuit model is used in concert with time- and frequency-domain analyses within Nexxim and DesignerSI or third-party SPICE-compatible circuit tools. Highlights include 64-bit capability; frequency-dependent source implementation; linear interpolation; frequency-dependent material model (Djordjevic-Sarkar); visualization of near E and H fields, and clip design tool.
Ansoft Corp., www.ansoft.com/siwave
Ansoft Corp., www.ansoft.com/siwave
The SmartStream pump is said to eliminate striking of a piston to a seat or nozzle. Each cycle displaces a column of material, rather than a single sphere. Cycles at frequencies that create a stream of material that reportedly can deliver increased flow rates (greater than 70 ÿl/sec). The displacement piston, driven by a linear motor/encoder assembly, is carbide. Design allows for easy removal and cleaning of the fluidic module. Only three o-rings need to be replaced. Z travel of dispense head is said to be virtually eliminated, as material is released from a nozzle 2-3 mm above the PCB surface. Reduces number of height senses needed.
Speedline Technologies, www.speedlinetech.com
SMP300 screen printer has a three-stage conveyor to eliminate additional buffer units. Features a patented clamping process to ensure the board is in the proper plane. Uses two CCD cameras to view and teach fiducials for aligning the board to the stencil within ±0.025 mm. Has a closed-loop, pneumatically controlled print head, and comes with 2-D post print inspection and automatic wet or dry stencil cleaning. Prints for 01005 pads.
Samsung Techwin, www.samsumg-smt.com
Dynatech Technology, www.dynatechsmt.com
Samsung Techwin, www.samsumg-smt.com
Dynatech Technology, www.dynatechsmt.com
