Products
Three semiconductor testing procedures for QFN, DFN, CSP and WLP semiconductor packages use “test on tape“ process, with MCT Tapestry Film Frame Handler. Said to test multiple package types and sizes without requiring mechanical conversion kits. “Test after singulation” process reportedly eliminates semiconductor defects caused by mechanical sawing after electrical testing. The “wafer to pocket die traceability” system is said to track every unit from the wafer through test and inspection to the specific pocket on a reel of taped units; allows customers to perform virtual retest of taped devices in the event of a specification change or new OEM requirement.
Best Electronics and US Export Authority, www.usea.com
CM10 has been specifically designed for simultaneous double-sided cleaning of large format substrates. Applications include PCBs, flat panel displays, screen printing, LCDs, lamination, packaging and glass manufacture. Has elastomer contact cleaning rollers and adhesive system. Four large-diameter elastomer rollers are said to remove unattached particles down to one µm and transfer them to a high coat weight, pre-sheeted, reverse-wound adhesive roll. Analysis and assessment of the source of contamination is made possible. Has cleaning module tilt system. Includes 7kv anti-static system. Operation up to 40 m/min.
Teknek, www.teknek.com
SJ7 Mini solder bars build on properties of the SJ7 solder alloy. Are approx. 110 mm long, 8 mm wide and 5 mm high; said to be ideal for small dipping pots and solder fountains. Yield results for applications involving harsh environments, thermal cycling and high strain. Said to feature improved tensile and creep strength, time to rupture, wetting capabilities and yield.
Almit Technology, www.almit.com
Almit Technology, www.almit.com
