Products
Model 40366 surface-mount accelerometer is said to have capabilities ideal for implantable medical device applications. Is a variable capacitance, silicon MEMS device designed to meet the requirements for use in implantable devices. Hermetically sealed with a shear bond strength of 1 kg; delivers repeatability of less than 0.035 pF in an SMT footprint of 2.05 x 2.90 mm configured as a three-terminal half-bridge. Features include frequency response of 40 Hz, linearity of less than 1%, transverse sensitivity of less than 1%, a +/-2g full scale for measurement of fractional-g accelerations in the presence of earth’s gravity, and over-range stops with provisions to eliminate electrostatic sticking when the accelerometer is over-ranged.
Endevco Corporation, www.endevco.com
The Dow Corning DA-6534 high-performance thermal adhesive addresses the issue of overheating in advanced flip-chip BGA devices. Combines silicone-based chemistries with a silver filler to achieve high thermal conductivity and elasticity at high and low temperatures. Achieves thermal resistance of 0.09 cm2 C/W at 24µ. Said to offer good dispensability. Bondline thickness can be controlled through pressure and time.
Dow Corning Corporation, www.dowcorning.com
Universal Cover Tape reportedly provides optimal performance regardless of width, carrier material and equipment. The UCT peel features permit removal of the middle portion above component pockets, while adhesive edges remain adhered to the carrier. Said to simplify sealing parameters associated with current heat-activated and pressure-sensitive adhesive cover tapes, in addition to increasing productivity, reducing sealing complaints and eliminating adhesive contamination.
3M, www.3m.com
