Uni-form epoxy preforms are available in M5-82, a linear epoxy system that remains flexible under temperature changes. Post-cure flexibility said to improve adhesion to component materials with dissimilar coefficients of thermal expansion. Developed for under-the-hood automotive applications and other environments that require seal integrity under adverse temperature conditions. Are one-part epoxy resins solid at room temperature. Melt and cure when heated, forming a seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings, and other contaminants. Close tolerances on preform dimensions; consistent pre-mixed ratios of resin to catalyst; and consistent viscosity from beginning to end of batch ensure uniform. Available with outside diameters from 0.035" to 0.720". Can be dispensed as rapidly as 200 to 600 parts per minute. Said to eliminate pot-life concerns and cleanup procedures.
Medalist i1000 offers the VTEP v2.0 vectorless test suite, which comprises iVTEP and network parameter measurement technology. Reportedly offers unparalleled coverage of micro ball grid arrays and flip chips, as well as power and ground pins for connectors found in digital consumer products and desktop PCs. Is compatible with most MDA fixtures. An AutoDebug feature slashes debugging time to a few hours. Comes with an automatic node-guarding feature that is said to eliminate the need for manual checks of schematics for guard points. Offers two fixture options. Provides fast fixture-swapping time while maintaining high signal integrity. Available in June.
Offset Placement After Solder Screen (OPASS) printing addresses solder paste alignment errors. With the technology, the placement machine reportedly can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of prior process errors. Addresses placing small components centered on the paste and not the pad, which reduces defect rate. Said to eliminate the need for other equipment such as AOI machines.