EnviroMark 919G Pb-free solder paste is reportedly 100% halide- and halogen-free. Said to offer ultra-low voiding characteristics, lighter flux residue color, easier residue penetration, shiny joints and excellent solderability on all components and board finishes. Prints to 0.4 mm pitch. Said to reduce potential defects such as bridging, solder balls and tombstoning.
The S3088-II high-speed AOI system includes 8M sensor technology and EasyPro3D user interface. Is said to provide reliable post-reflow, post-print or post-placement inspection. Offers inspection on PCBs up to 450 x 350 mm. Reportedly provides a resolution of 11.7 or 23.4 µm/pixel at the same image size to be chosen for each analysis and permits inspection of components as small as 01005. Offers color evaluation as standard. Operator interface comes equipped with automatic parameter optimization and LIB2007 inspection library that contains more than 1,600 component types and takes into account IPC standards. ‘ValidCompare’ mode provides the operator with an archived image as a good-board reference. ‘TrustedChange’ integrated verification is said to simplify the reduction of false calls and ensures a zero-escape strategy.
This centralized pallet product line reportedly provides customers the opportunity to procure all assembly tooling from a single source using existing data from the Gerber files. Now includes ESD-safe process carriers for wave solder and SMT assembly. The carriers, said to be ideal for use with lead-free solder, allow masking of specific areas. Boards and components are protected from thermal shock and ESD. Utilizes materials said to be ideally suited to the soldering process, including Durapol and Delmat.