Products
I&J7900-LF, an RoHS-compliant, compact three-axis dispensing robot, has a work area of 8 x 8" and a z-axis of 2".
Is said to be simple to program, with step-by-step point-and-click instructions. Resolution is said to be 20 mm. Up to 100 programs can be stored in the robot’s data memory or flash card. Can apply dots, lines, circles, and ellipses in any point-to-point or continuous path configuration.
I&J Fisnar, www.ijfisnar.com
Hysol FP5110 is specially formulated for flip-chip image sensor modules and is said to provide adhesion to both 2- and 3-layer flexible printed circuits by bonding to both polyimide and epoxy adhesive material.
Bonds bumps to substrates by means of a Pb-free-compatible thermal compression process. Compatible with thermal compression and ultrasonic bonding processes; low temperature 10-sec. SnapCure at 180°C; storage requirement of -15°C.
Bonds bumps to substrates by means of a Pb-free-compatible thermal compression process. Compatible with thermal compression and ultrasonic bonding processes; low temperature 10-sec. SnapCure at 180°C; storage requirement of -15°C.
Henkel, www.henkelelectronics.com
The MX high-speed component placement system is said to be capable of placement rates up to 80,000 cph. Features cascading modularity, with 216 feeder slots per segment; full-range component capability; double placement areas in each module, and a multilevel transport system reported to eliminate “local head-downtimes.”
Mimot, www.mimot.com
Mimot, www.mimot.com
Press Releases
- SisTech Manufacturing Leads the Charge Against Electronic Component Obsolescence with Innovative Solutions
- CE3S Announces Strategic Partnership with Ideal-tek to Expand Precision Tools Offering
- Bittele Electronics’ Malaysia Facility Achieves ISO 9001:2015 Certification
- Bittele Electronics’ Malaysia Facility Achieves ISO 9001:2015 Certification