The Medalist x6000 AXI reportedly reduces manufacturing conversion costs without compromising defect-detection capability. Is said to more than double the throughput of market-leading 3D solutions. Reportedly the only one to deliver high-throughput 3D coverage that can be used to inspect the entire board. Said to reduce implementation barriers caused by high employee turnover in outsourced regions by providing a new development environment that incorporates several automatic test development features that help new users to develop high-quality programs in half the time previously required. Ready to ship in May 2007.
 
Agilent Technologies, www.agilent.com