Products
NEW YORK -- Investors may want to be cautions when approaching shares of Sanmina-SCI, said Cowen and Company analysts Louis R. Miscioscia told Forbes. Apparently the company has had some suspicious timing of its stock options awards.
At a time when more and more technology companies are coming under investigation by the Securities and Exchange Commission for irregular stock options granting practices, Miscioscia said Sanmina's story is the "most interesting" out of all the EMS companies he covers.
LPKF recently released the bench-top ProtoFlow Oven for Pb-free reflow soldering. The new design has been influenced by the stringent process requirements of Pb-free technology, and by the prior oven model, the ZelFlow R04.
Maximum process temperature is 320°C/608°F; it incorporates four internal temperature sensors and a multiprocessor controller board, which ensure even heat distribution over PCBs up to 9 x 12”. Has several software zones between preheating and final reflow to process most reflow profiles, as well as prototyping, technology research and even pre-production testing.
An optional four additional sensors can also be freely mounted on the PCB by the operator, enabling on-board temperature to be recorded and displayed in real time on a PC through a standard USB connection. Reflow process can be observed through a large window.
Has pre-programmed process profiles, which can be easily selected using four navigation keys. Custom profiles may also be created on your PC and uploaded to the oven. Includes an LCD display and intuitive software interface. Process parameters can be exchanged with a PC, managed and archived. Microsoft Excel can be used monitor and document progress parameters for complete quality management documents.
LPKF Laser & Electronics, lpkfusa.com
Maximum process temperature is 320°C/608°F; it incorporates four internal temperature sensors and a multiprocessor controller board, which ensure even heat distribution over PCBs up to 9 x 12”. Has several software zones between preheating and final reflow to process most reflow profiles, as well as prototyping, technology research and even pre-production testing.
An optional four additional sensors can also be freely mounted on the PCB by the operator, enabling on-board temperature to be recorded and displayed in real time on a PC through a standard USB connection. Reflow process can be observed through a large window.
Has pre-programmed process profiles, which can be easily selected using four navigation keys. Custom profiles may also be created on your PC and uploaded to the oven. Includes an LCD display and intuitive software interface. Process parameters can be exchanged with a PC, managed and archived. Microsoft Excel can be used monitor and document progress parameters for complete quality management documents.
LPKF Laser & Electronics, lpkfusa.com
SCOTTSDALE, AZ -- The Field-Programmable Gate Array (FPGA) market, with a quickly expanding array of uses, is on a roll, according to a report from In-Stat. The value of worldwide FPGA shipments will increase from $1.9 billion in 2005 to $2.75 billion by 2010, the high-tech market research firm said. Much of this revenue will come from low-volume shipments.
"In large part, low-volume use of this product relates directly to price, which directly correlates to complexity, and prices can run from less that $100 per unit to several thousand dollars per unit," said Jerry Worchel, senior analyst. "End-use applications will determine the viability of using FPGAs for the long haul."
In-Stat predicts that the largest two end-use segments will be communications and industrial, whose combined market share will increase from 73.8% in 2005 to 76.8% by 2010.
"In large part, low-volume use of this product relates directly to price, which directly correlates to complexity, and prices can run from less that $100 per unit to several thousand dollars per unit," said Jerry Worchel, senior analyst. "End-use applications will determine the viability of using FPGAs for the long haul."
In-Stat predicts that the largest two end-use segments will be communications and industrial, whose combined market share will increase from 73.8% in 2005 to 76.8% by 2010.
Press Releases
- ViTrox’s HITS 5.0 Empowers Global Partners with Innovative Solutions and Stronger Bonds
- Trilogy-NET Adds Second Vapor Phase Reflow System to Expand High-Precision Manufacturing
- Federal Electronics Invests in HydroJet Inline Cleaning Technology at Hermosillo Facility
- Seika Machinery to Host Webinar on Wireless Strain Measurement for PCB Testing