Products
CyberOptics will display Process Insight statistical process control software in booth 2D21 at the Nepcon South China this week.
The SPC software package is based on an enterprise-level database and open computing standards. Provides complete analysis of process performance. Offers comprehensive SPC charting capabilities, is a common interface for SE 300 Ultra and Flex Ultra for data analysis and correlation. Features chart-specific alarms to signal out-of-control data and trends, and data output from an SQL database for connection into shop floor control software. Provides real-time information to operators and customers, can be integrated into a shop floor management system, allowing full traceability.
Features the ability to access password-protected databases, faster loading of databases from SE 300 and Flex with new XML file watcher, and improved database structure.
Provides updates within line cycle times to allow for real-time corrective action. Features tools to access and manage all system data to allow for historical analysis. Data output for shop floor management system integration allows users to identify trends and increase yields.
CyberOptics Corp., cyberoptics.com
The SPC software package is based on an enterprise-level database and open computing standards. Provides complete analysis of process performance. Offers comprehensive SPC charting capabilities, is a common interface for SE 300 Ultra and Flex Ultra for data analysis and correlation. Features chart-specific alarms to signal out-of-control data and trends, and data output from an SQL database for connection into shop floor control software. Provides real-time information to operators and customers, can be integrated into a shop floor management system, allowing full traceability.
Features the ability to access password-protected databases, faster loading of databases from SE 300 and Flex with new XML file watcher, and improved database structure.
Provides updates within line cycle times to allow for real-time corrective action. Features tools to access and manage all system data to allow for historical analysis. Data output for shop floor management system integration allows users to identify trends and increase yields.
CyberOptics Corp., cyberoptics.com
Nepcon Shenzhen booth 2D21
ADS 02M offline depaneling system is designed with an X/Y/Z gantry and features a rotary table, so the operator can load a panel while the system is cutting the next one. This is said to reduce overall cycle time.
Visit the EASi Line for a live demonstration of the High Speed Laser Marking System ALS 03. Features code verification with 1-D/2-D scanner, FIS dataconverter and repeatability +/- 100 micron at 6 sigma.
ASYS, asys-group.com
ATE Booth 5201
Visit the EASi Line for a live demonstration of the High Speed Laser Marking System ALS 03. Features code verification with 1-D/2-D scanner, FIS dataconverter and repeatability +/- 100 micron at 6 sigma.
ASYS, asys-group.com
ATE Booth 5201
X-Tek Group will announce the addition of Computerised Tomography (CT), a 3-D imaging capability, to the Revolution microfocus system at Nepcon Shenzhen. The system features true concentric imaging, the highest degree of off axis tilt available and NanoTech open tube technology for unparalleled resolution and magnification. Visitors can also find out more about the group’s new operation in Hong Kong.
CT produces high resolution 3-D data sets which can be viewed at any angle, sliced in any direction and measured to enable detailed analysis of the internal structure of a wide range of components and objects.
Offers a viewing angle of up to 75o, just 15o to the plane of the board. This allows for maximum magnification (up to 6000x) at all angles over the entire 16 x 16” (410 x 410mm) manipulator scan area, for 100% BGA, µBGA, multilayer board and PCB solder joint inspection, with quick analysis of BGA ball wetting, attachment, cracks and delaminations. NanoTech source offers improved defect detection due to feature recognition in the submicron range.
Has advanced triple-mode programming interface incorporating off-line, teach-repeat and high level library function for program building.
X-Tek, xtekxray.com
Nepcon Shenzhen Stand 2B73
CT produces high resolution 3-D data sets which can be viewed at any angle, sliced in any direction and measured to enable detailed analysis of the internal structure of a wide range of components and objects.
Offers a viewing angle of up to 75o, just 15o to the plane of the board. This allows for maximum magnification (up to 6000x) at all angles over the entire 16 x 16” (410 x 410mm) manipulator scan area, for 100% BGA, µBGA, multilayer board and PCB solder joint inspection, with quick analysis of BGA ball wetting, attachment, cracks and delaminations. NanoTech source offers improved defect detection due to feature recognition in the submicron range.
Has advanced triple-mode programming interface incorporating off-line, teach-repeat and high level library function for program building.
X-Tek, xtekxray.com
Nepcon Shenzhen Stand 2B73
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