Products
The 15th version of GerbTool has a host of new features and technology, such as HyperNETLIST generation, that have been handed down from VisualCAM. It increases netlist generation performance over competitive tools by 5 to 10X.
• HyperNETLIST Comparison performance has been increased 5X over previous releases, while Draw-to-Flash Conversion has been increased 5-10X.
• Pin-Point Error feature reduces user effort when trying to locate a Short or Open condition.
• Automatic Draw-to-Flash conversion function reduces “hands-on” user time.
• Improvements to Paste Mask Stencil Enhancement offer more control during shape replacement. Increased control minimizes the iterations required to achieve desired mask results.
• For Release May 15th, 2006
Includes 100+ additional enhancements to existing features, ranging from improvements to Gerber file handling to better handling of previous users’ settings when upgrading.
Has revised product configurations for GT-Communicator, GT-Inspector, and GT-Designer to include support for ODB++, ODB++ (X) and IPC-2581. All of these interfaces will cover both importing and exporting.
WISE Software Solutions, wssi.com
This release contains a series of enhancements to help users increase throughput.
• HyperNETLIST Comparison performance has been increased 5X over previous releases, while Draw-to-Flash Conversion has been increased 5-10X.
• Pin-Point Error feature reduces user effort when trying to locate a Short or Open condition.
• Automatic Draw-to-Flash conversion function reduces “hands-on” user time.
• Improvements to Paste Mask Stencil Enhancement offer more control during shape replacement. Increased control minimizes the iterations required to achieve desired mask results.
• For Release May 15th, 2006
Includes 100+ additional enhancements to existing features, ranging from improvements to Gerber file handling to better handling of previous users’ settings when upgrading.
Has revised product configurations for GT-Communicator, GT-Inspector, and GT-Designer to include support for ODB++, ODB++ (X) and IPC-2581. All of these interfaces will cover both importing and exporting.
WISE Software Solutions, wssi.com
Universal Instruments will demonstrate its latest platform placement system, the AdVantis XS, at Semicon West. Designed for the convergence of semiconductor and standard surface-mount assembly, the system deploys Universal’s VRM linear motors for accuracy and repeatability.
The linear-motor-driven system has high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types. Is Class 1000 clean room compatible.
Universal Instruments, uic.com
Semicon West Booth 7039
AdVantis XS evolved from the GSMxs, delivering similar accuracies of +/-9 microns at +/- 3 sigma, but with a 25% increase in feeder capacity for on-machine inventory and a 15% speed improvement. Advanced materials engineering and optimized design offers customers a price some 25% lower than its predecessor, with backward compatibility, shared resources and common interfaces.
The linear-motor-driven system has high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types. Is Class 1000 clean room compatible.
Universal Instruments, uic.com
Semicon West Booth 7039
Practical Components Inc., a distributor of dummy SMD and thru-hole components, test boards, training/setup kits and supplies, has added Thin Array Plastic Package (TAPP) to its selection.
Packaging companies Amkor Technology and ASAT Holdings entered into a multi-year cross-licensing agreement to provide Amkor with a license for its TAPP semiconductor package technology.
“Over the past few years, the semiconductor industry has seen an extensive adoption of QFN packages, fueled in part by the success of Amkor’s proprietary MicroLeadFrame package technology and ASAT’s Leadless Plastic Chip Carrier package. We look forward to integrating ASAT’s TAPP with our MicroLeadFrame family of packages to support our growing base of customers requiring innovative QFN package solutions,” said Jim Fusaro, Amkor’s corporate VP for product management, in a statement.
Available TAPP solder finishes are eutectic Sn/Pb and Pb-free with lead counts from 28 to 208. The very thin, fine-pitch package with an exposed die attach pad allows for improved thermal performance and a power/ground ring option for enhanced electrical characteristics.
Practical Components is the exclusive distributor of mechanical samples for Amkor Technology as well as distributing components from most other manufacturers.
Practical Components Inc., practicalcomponents.com
Packaging companies Amkor Technology and ASAT Holdings entered into a multi-year cross-licensing agreement to provide Amkor with a license for its TAPP semiconductor package technology.
“Over the past few years, the semiconductor industry has seen an extensive adoption of QFN packages, fueled in part by the success of Amkor’s proprietary MicroLeadFrame package technology and ASAT’s Leadless Plastic Chip Carrier package. We look forward to integrating ASAT’s TAPP with our MicroLeadFrame family of packages to support our growing base of customers requiring innovative QFN package solutions,” said Jim Fusaro, Amkor’s corporate VP for product management, in a statement.
Available TAPP solder finishes are eutectic Sn/Pb and Pb-free with lead counts from 28 to 208. The very thin, fine-pitch package with an exposed die attach pad allows for improved thermal performance and a power/ground ring option for enhanced electrical characteristics.
Practical Components is the exclusive distributor of mechanical samples for Amkor Technology as well as distributing components from most other manufacturers.
Practical Components Inc., practicalcomponents.com
Press Releases
- Trilogy-NET Adds Second Vapor Phase Reflow System to Expand High-Precision Manufacturing
- Federal Electronics Invests in HydroJet Inline Cleaning Technology at Hermosillo Facility
- Seika Machinery to Host Webinar on Wireless Strain Measurement for PCB Testing
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities