Products
Adding to its series of recently introduced optimized material sets, Henkel has announced a materials combination designed for stacked CSP (SCSP) devices. Uniting die attach material Hysol QMI536NB with mold compound Hysol GR9820, this material set reportedly delivers JEDEC Level 1/260° reflow performance.
Both materials perform well in Pb-free environments, with a high resistance to elevated temperatures and demanding manufacturing conditions. GR9820 is a versatile epoxy molding compound with adhesion properties that can be optimized for varying leadframe metallizations. The low-stress, “green” mold compound exhibits ultra low warpage in a matrix package format, with the ability to alter the mold compound resin components to counter-correct “smiling face” or “crying face” warpage in a range of package types.
QMI536NB is one-material solution for thin stacked die applications. Traditionally, different die attach materials are used for each of the various layers of a stacked package so as to avoid damage to the die passivation of the first die. This protective and low-bleed formulation can be used for both mother and daughter die, enabling packaging specialists to qualify a single material.
Henkel, www.electronics.henkel.com
Both materials perform well in Pb-free environments, with a high resistance to elevated temperatures and demanding manufacturing conditions. GR9820 is a versatile epoxy molding compound with adhesion properties that can be optimized for varying leadframe metallizations. The low-stress, “green” mold compound exhibits ultra low warpage in a matrix package format, with the ability to alter the mold compound resin components to counter-correct “smiling face” or “crying face” warpage in a range of package types.
QMI536NB is one-material solution for thin stacked die applications. Traditionally, different die attach materials are used for each of the various layers of a stacked package so as to avoid damage to the die passivation of the first die. This protective and low-bleed formulation can be used for both mother and daughter die, enabling packaging specialists to qualify a single material.
Henkel, www.electronics.henkel.com
CTS Connect air-actuated internal or external connectors for effective sealing on smooth, rough or threaded circular features of a part create a tight, long-lasting seal. New leak test accessory products include:
Digital Vacuum Gauge
Portable Leak Finder
Digital Vacuum/Pressure Gauge
Calibrated Leak/Flow Standards
Calibrated Helium Leak Standards
The company will also exhibit the Sentinel M24 and Sentinel C-20. M24 is a compact, multi-station leak test instrument that provides repeatable, high-resolution tests, fast cycle times, a VFD graphic display and an enhanced operator interface.
C-20 pressure decay leak test instrument is a compact device for simple, fast, economical verification of product leak integrity. “Quik Test” feature enables a shorter test cycle time, as much as 80%, by detecting obvious accept or reject parts early in the test cycle.
Cincinnati Test Systems, cincinnati-test.com
ATE booth 540
Digital Vacuum Gauge
Portable Leak Finder
Digital Vacuum/Pressure Gauge
Calibrated Leak/Flow Standards
Calibrated Helium Leak Standards
The company will also exhibit the Sentinel M24 and Sentinel C-20. M24 is a compact, multi-station leak test instrument that provides repeatable, high-resolution tests, fast cycle times, a VFD graphic display and an enhanced operator interface.
C-20 pressure decay leak test instrument is a compact device for simple, fast, economical verification of product leak integrity. “Quik Test” feature enables a shorter test cycle time, as much as 80%, by detecting obvious accept or reject parts early in the test cycle.
Cincinnati Test Systems, cincinnati-test.com
ATE booth 540
Eunil H.A. Americas has added the PARMI SPI 3-D paste inspection system to its product line.
The in-line solder paste inspection system reportedly provides reliable, accurate, 100% inspection at high speeds. Inspects numerous kinds of solder paste defects after screen printing by measuring height, area and volume in conjunction with the system’s fast and accurate 3-D data.
Can detect printing faults (volume, height, area, registration, bridge) and monitor the printing process, which helps the operator find the printing status quickly on the line. Uses SPC, providing printing process monitoring and control both on- and off-line.
Increases first pass yield by preventing faulty PCBs from going through the next process. Prevents in-circuit test and outdoor failure, provides control of the printing process.
The in-line solder paste inspection system reportedly provides reliable, accurate, 100% inspection at high speeds. Inspects numerous kinds of solder paste defects after screen printing by measuring height, area and volume in conjunction with the system’s fast and accurate 3-D data.
Can detect printing faults (volume, height, area, registration, bridge) and monitor the printing process, which helps the operator find the printing status quickly on the line. Uses SPC, providing printing process monitoring and control both on- and off-line.
Increases first pass yield by preventing faulty PCBs from going through the next process. Prevents in-circuit test and outdoor failure, provides control of the printing process.
Eunil H.A. Americas, parmi.com
Press Releases
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- ubersmt Expands SMT Line with Juki G-Titan Printer and RS-1R Placement System
- Keiron Technologies to Host LiFT Webinar Focusing on Solving Solder Paste Printing Challenges
- Express Manufacturing, Inc. Strengthens Test Capability with Acculogic Flying Probe System