Alphasem has introduced a tape applicator module for the Swissline 9022 die bonder series. Offers process control and high productivity. In a recent benchmark test conducted by a leading Korean chipmaker, the new tape applicator outperformed its competitors. The general manager responsible for the manufacturing plant at which the evaluation took place, said: "The new Alphasem tape applicator module really exceeded our expectations. Its unparalleled performance ideally suits our requirements and helps us to secure our leadership in manufacturing stacked-die devices."
Allows simple, fast adaptation to varying production needs. The possible combination of tape applicator module and epoxy dispenser on one die bonder eliminates time-consuming exchange of modules. Inspection capabilities guarantee product integrity.
Available with factory-built Swissline 9022 die bonders. Field upgrades for recently installed Swissline 9022 die bonders available on request.
GÖPEL electronic introduces the SFX-5704 as additional component to the JTAG/Boundary Scan hardware platform Scanflex. The I/O Module (SFX Module) was developed for the production test of mixed-signal applications and provides four parallel and independent channels.
Can be freely combined with controllers on PCI, PXI, USB, FireWire or LAN basis as well as TAP transceivers with distances up to five metres.
Each of the four channels features a fully-fledged driver/sensor pin electronic combined with an analog measuring function. For digital tests each channel can be switched to Input, Output, Bidir or Tri State (interposing relay). Individually programmable parameters such as input-voltage (±10V), output-voltage (±10V), maximum driver current up to 300mA and programmable Pull Up and Pull Down resistors enable an application oriented test channel adaptation to the signals to be tested.
Safety measures for the Unit Under Test include automated overcurrent recognition with subsequent current limit (fold back), dynamic driver current gain adaptation (backdriving) as well as a specific clip switching for freely programmable oppression of overshoots on the connected signal lines.
The analog measuring function has an input range of ±10V at a 12 bit resolution. Analog and digital functions can simultaneously be operated at active clip switching.
B300 tabletop ultrasonic cleaner includes a stainless steel cleaning tank using industrial-style ultrasonic transducer technology, at 40KHz. Includes an automatic 15 min. timer and comes with a cover and perforated stainless steel basket.
Inside tank dimensions are 11.8 x 3.9 x 2.9”, with half-gallon capacity, in either a 115 or 230 volt unit.
Applications include difficult soils or contaminations, removing brazing fluxes, polishing compounds, lens cleaning. Ideal markets include jewelry, optical and veterinarian markets.