Products
BP Microsystems will display the 4710 automated programming system, in Adaptsys’ booth at Nepcon UK .
Is designed for high density devices and longer programming times, making it the fastest at programming Flash, while also programming Microcontrollers, FPGAs, PLDs and other device types.
Has improved site hardware to program devices with densities up to 4 Gbits. Incorporates high-speed USB 2.0 standard bus for communications. By combining fast universal programming technology — 64 Mb in 15 sec. — and FX4 socket modules, which can program up to four devices simultaneously, it can program up to 44 devices at the same time.
BP Microsystems, www.bpmicro.com
Is designed for high density devices and longer programming times, making it the fastest at programming Flash, while also programming Microcontrollers, FPGAs, PLDs and other device types.
Has improved site hardware to program devices with densities up to 4 Gbits. Incorporates high-speed USB 2.0 standard bus for communications. By combining fast universal programming technology — 64 Mb in 15 sec. — and FX4 socket modules, which can program up to four devices simultaneously, it can program up to 44 devices at the same time.
BP Microsystems, www.bpmicro.com
Booth G30
Zestron, a supplier of high precision cleaning processes and services, will be exhibiting at Nepcon East on May 10 – 11.
The company will be feature its latest products and services for:
PCB Defluxing: Effectively removing all flux residues ranging from rosin-based to synthetic no-clean and from eutectic or lead-free based formulation.
Stencil Cleaning: MPC-based and solvent-based cleaning agents for the removal of solder pastes and SMT-adhesives in a single process.
MPC Technology: Water-based cleaning technology combining the benefits of traditional water as well as solvent-based cleaning agents.
Zestron America
Nepcon East Booth 2040
The company will be feature its latest products and services for:
PCB Defluxing: Effectively removing all flux residues ranging from rosin-based to synthetic no-clean and from eutectic or lead-free based formulation.
Stencil Cleaning: MPC-based and solvent-based cleaning agents for the removal of solder pastes and SMT-adhesives in a single process.
MPC Technology: Water-based cleaning technology combining the benefits of traditional water as well as solvent-based cleaning agents.
Zestron America
Nepcon East Booth 2040
Huntsman Advanced Materials has introduced two halogen-free laminating resins that comply with regulatory requirements for PCB manufacturing.
AZYRAL one- and two-component laminating systems combine versatile processing capabilities with good electrical characteristics and physical properties. Multilayer PCBs and other electrical components fabricated with the materials can withstand exposure to tough operating conditions.
Halogen-free AZYRAL XU8282-1 resin is RoHS compliant for Pb-free soldering operations. This and two-component AZYRAL XTW8291/XTW8293 laminating systems feature easy-to-process, low viscosities for use with FR4 processing. Are nondicy-curing products, meet UL 94 V-O specifications.
Said to produce PCBs with a low dielectric constant, low dissipation factor, good surface resistivity and good volume resistivity.
Resins are high-temperature resistant materials with low moisture absorption, good thermal stability with glass transition temperatures from 320-482ºF, low coefficient of thermal expansion and low shrinkage.
Huntsman, huntsman.com/electronics
AZYRAL one- and two-component laminating systems combine versatile processing capabilities with good electrical characteristics and physical properties. Multilayer PCBs and other electrical components fabricated with the materials can withstand exposure to tough operating conditions.
Halogen-free AZYRAL XU8282-1 resin is RoHS compliant for Pb-free soldering operations. This and two-component AZYRAL XTW8291/XTW8293 laminating systems feature easy-to-process, low viscosities for use with FR4 processing. Are nondicy-curing products, meet UL 94 V-O specifications.
Said to produce PCBs with a low dielectric constant, low dissipation factor, good surface resistivity and good volume resistivity.
Resins are high-temperature resistant materials with low moisture absorption, good thermal stability with glass transition temperatures from 320-482ºF, low coefficient of thermal expansion and low shrinkage.
Huntsman, huntsman.com/electronics
Press Releases
- Seika Machinery to Host Webinar on Wireless Strain Measurement for PCB Testing
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China