Fineplacer CRS 10 compact rework system is designed for customers needing a fixed configuration. Said to have quick set up and easy operation. Most useful for small- to medium-scale series assembly or highly precise rework of soldered components on medium to large SMD boards. Applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components (such as 0201, 0402, 0603 and connectors), RF-shields, shielding frame, flip-chip rework as well as customized applications. Features a Plug-and-Work design, Vision Alignment System with stationary beam splitter, controlled z-height during reflow, proven soldering head technology, Pb-free compatible rework and an automated component place and lift-off function. Also equipped with a Controlled Mixed Soldering System (COMISS) reflow module for top heating and full-area bottom heating. High accuracy (better than 10 µm placement accuracy) allows use with components with pitches down to 100 µm. Large field of view can align large components, e.g. super BGAs with side lengths of up to 45 mm, without additional optics. Finetech, finetechusa.com
A-Tek has added the Drytech range of controlled humidity storage systems for electronics packages and sensitive devices. Drytech manufactures systems for all components and sensitive devices storage demands. A large range of standard products are available, customization is available. Meet IPC/JEDEC Standard J-STD-033A. Sizes vary from 100 to 1700 L in capacity.
During packing, shipping and storage, parts are often exposed to many fluctuations in temperature and humidity; an ideal environment for the hygroscopic nature of plastic encapsulants to take effect, and moisture to be absorbed into the device. Moisture will directly impact product quality, final product reliability, customer satisfaction and manufacturing costs. The smallest amount of moisture, when subject to elevated temperatures, creates vapor pressure that can induce stress cracks and fractures in devices. These may show as failures in test or in a worse case, as field failures. Storing sensitive devices in an environment of less than 5% relative humidity will protect the parts and assist in stabilizing the devices prior to manufacture.
SEFAR PCF is a pre-coated mesh engineered for the stencil parameters and frame sizes of the CD/DVD market segment. Said to provide consistent coating tolerances, stencil durability, wide exposure window and optimal emulsion thickness (EOM) to surface roughness (Rz) combination.
Sefar is now launching a fully-coated version, “SEFAR PCF FC” (Pre-Coated Fabric, Fully-Coated). The addition allows additional screen printing market segments access to the benefits of the stencil system. In addition to improving print quality, it also offers process improvement by removing degreasing, coating, block-out and multiple drying steps that are required to prepare a screen.
By providing a fully-coated mesh, customers with virtually any size frame can use it: bottle and container manufacturers, pen printers, tube manufacturers, ad specialty companies, membrane switch or industrial product printers, and any small format graphics printer concerned with image quality. Currently available in fine mesh specifications (ie. 305 threads/in. and higher). The coated fabric can be purchased as a roll to stretch in-house, or as a stretched screen from a screen fabrication location.