Products
Non-Silicone Heat Transfer Compound (HTC) provides efficient thermal coupling of electrical and electronic components. Provides non-creep characteristics and thermal conductivity even at high temperatures: 0.9 W/m.K. Has a broad operating temperature range (-50º to +130º) and offers low toxicity. HTC Plus (HTCP) provides even higher thermal conductivity at 2.8 W/m.K with superior heat transfer characteristics.
Silicone Heat Transfer Compound (HTSP) is a thermally conductive paste for special applications where thermal management is critical. Operates from -50º to +200º, is a metal oxide filled silicone oil providing thermal conductivity at 3.0W/m.K.
The flame retardant ER 2074 epoxy resin exhibits thermal conductivity and is free of abrasive fillers such as alumina. Ensures less wear on mix and dispense and other processing equipment. Shows low viscosity when mixed and the exotherm temperature rise on curing is low.
Aquacoat Plus eliminates the need for extraction and other precautions normally required for the application of conventional solvent-based conformal coatings. The aqueous conformal coating is non-flammable, contains low levels of VOCs and no isocyanates, so it can be soldered through without fear of highly toxic gases being produced. Is phenol-free, so is non-corrosive to cadmium and zinc plate. Based on polymeric materials, offers adhesion on a variety of substrates and a wide operating temperature range. Available in two formulations: WBP is the standard product and WBPS (Sprayable) is for use in selective film coating equipment. Is DEF-STAN, MIL and IPC-CC-830 and RoHS compliant.
Flexible Lead-Free Conformal Coating (LFCC) is transparent and fast drying. Designed to protect electronic circuitry processed with lead-free soldering products, it provides adhesion to lead-free flux and fluoresces under UV light for ease of inspection. Can be soldered through without highly toxic gases being produced and is non-corrosive to cadmium and zinc plate.
Electrolube, electrolube.com
Silicone Heat Transfer Compound (HTSP) is a thermally conductive paste for special applications where thermal management is critical. Operates from -50º to +200º, is a metal oxide filled silicone oil providing thermal conductivity at 3.0W/m.K.
The flame retardant ER 2074 epoxy resin exhibits thermal conductivity and is free of abrasive fillers such as alumina. Ensures less wear on mix and dispense and other processing equipment. Shows low viscosity when mixed and the exotherm temperature rise on curing is low.
Aquacoat Plus eliminates the need for extraction and other precautions normally required for the application of conventional solvent-based conformal coatings. The aqueous conformal coating is non-flammable, contains low levels of VOCs and no isocyanates, so it can be soldered through without fear of highly toxic gases being produced. Is phenol-free, so is non-corrosive to cadmium and zinc plate. Based on polymeric materials, offers adhesion on a variety of substrates and a wide operating temperature range. Available in two formulations: WBP is the standard product and WBPS (Sprayable) is for use in selective film coating equipment. Is DEF-STAN, MIL and IPC-CC-830 and RoHS compliant.
Flexible Lead-Free Conformal Coating (LFCC) is transparent and fast drying. Designed to protect electronic circuitry processed with lead-free soldering products, it provides adhesion to lead-free flux and fluoresces under UV light for ease of inspection. Can be soldered through without highly toxic gases being produced and is non-corrosive to cadmium and zinc plate.
Electrolube, electrolube.com
Ovation Products has released the Quik-Lok PCB clamping system for MPM UP2000 and AP25-27 series printers. The device eliminates the conventional vacuum chamber board fixture common on most MPM printers and is field retrofitted in approx. one hour.
The clamp provides secure, “over the top” PCB clamping as well as a tool-less, hands-off product changeover.
Installation of this product enables the use of Ovation’s Grid-Lok automatic support tooling.
Ovation Products, grid-lok.com
Sonoscan was granted US Patent #6,895,820 covering the Virtual Rescanning Module (VRM).
The VRM technique permits engineers to acquire and save acoustic echo data from the entire volume of a part such as an integrated circuit package. The saved digital file can later be rescanned to make acoustic images as though the file were the physical IC package.
VRM is widely used to preserve data about parts before they go into production or into testing. After a part has been altered by heat, testing or other factors, it is no longer too late to examine the part in its original condition.
In advanced flip-chip production, VRM is used with the patented Sonoscan method for Frequency Domain Imaging (FDI) to perform high-resolution non-destructive analysis of critical flip-chip interfaces.
Sonoscan Inc., sonoscan.com
The VRM technique permits engineers to acquire and save acoustic echo data from the entire volume of a part such as an integrated circuit package. The saved digital file can later be rescanned to make acoustic images as though the file were the physical IC package.
VRM is widely used to preserve data about parts before they go into production or into testing. After a part has been altered by heat, testing or other factors, it is no longer too late to examine the part in its original condition.
In advanced flip-chip production, VRM is used with the patented Sonoscan method for Frequency Domain Imaging (FDI) to perform high-resolution non-destructive analysis of critical flip-chip interfaces.
Sonoscan Inc., sonoscan.com
Press Releases
- Seika Machinery to Host Webinar on Wireless Strain Measurement for PCB Testing
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China