Products
Aqueous Technologies will exhibit StencilWasher-ECO semi-automatic stencil cleaner for solder paste removal at the upcoming Nepcon East exhibition and conference on May 10-11 in Boston.
Part of the ultrasonic technology that uses precisely controlled sound waves to remove un-reflowed solder paste and uncured adhesives from stencils, screens and misprints. Ultrasonic energy is gentle, will not damage delicate parts, but is effective in removing even dried pastes on fine-pitch stencils.
Smi-automatic ultrasonic stencil cleaning system can accommodate stencils, screens or misprinted assemblies up to 29 x 29" (736 x 736 mm), and it features a 25" (63.5 cm) immersion depth.
Said to provide fast, efficient solder paste removal. Removes solder paste and provides wash, rinse and dry functions. Features a stainless steel wash and rinse tank, and a stainless steel deck.
Has a programmable wash cycle timer for consistent operation. Equipped with a handheld rinse wand and airknife.
Multiple side-mounted 40 kHz transducers target effective cleaning power onto the stencil or misprint.
Aqueous Technologies Corp., aqueoustech.com
Nepcon East booth 3004
Part of the ultrasonic technology that uses precisely controlled sound waves to remove un-reflowed solder paste and uncured adhesives from stencils, screens and misprints. Ultrasonic energy is gentle, will not damage delicate parts, but is effective in removing even dried pastes on fine-pitch stencils.
Smi-automatic ultrasonic stencil cleaning system can accommodate stencils, screens or misprinted assemblies up to 29 x 29" (736 x 736 mm), and it features a 25" (63.5 cm) immersion depth.
Said to provide fast, efficient solder paste removal. Removes solder paste and provides wash, rinse and dry functions. Features a stainless steel wash and rinse tank, and a stainless steel deck.
Has a programmable wash cycle timer for consistent operation. Equipped with a handheld rinse wand and airknife.
Multiple side-mounted 40 kHz transducers target effective cleaning power onto the stencil or misprint.
Aqueous Technologies Corp., aqueoustech.com
Nepcon East booth 3004
JPSA has begun shipping IX-1100 C2C UV 193nm excimer laser wafer processing systems equipped with cassette to cassette automated wafer loading/unloading systems and JPSA advanced factory automation software. These systems can process more than 80 wafers per hour, and are suited for a variety of materials such as: GaAs, silicon and sapphire.
Applications include flash-on-the-fly lithography, thin film patterning, annealing, doping, micromachining, microvia drilling, patterning, and more, down to 1 micron resolution. Includes fully automated machine vision alignment and inspection, sub-micron accuracy air bearing stages and large field of view (FOV) homogenized beam delivery systems.
IX-1100 C2C includes an industrial robot that can interface with a variety of cassette modules per customer requirements. Includes JPSA factory automation software, machine vision for fully automatic wafer alignment and automated laser calorimetry of multiple power and energy meters, plus multiple beam profilometers for laser beam size and shape, data archiving and QC.
Available with optional SQL database connectivity. Typical applications include tracking of process data by part number.
JPSA, www.jpsalaser.com
Applications include flash-on-the-fly lithography, thin film patterning, annealing, doping, micromachining, microvia drilling, patterning, and more, down to 1 micron resolution. Includes fully automated machine vision alignment and inspection, sub-micron accuracy air bearing stages and large field of view (FOV) homogenized beam delivery systems.
IX-1100 is an industrial excimer workstation, a compact integrated UV processing system with a built-in high- power excimer laser. Features automated mask control, step and scan and high-resolution imaging and workpiece viewing using the Chromacel line. Optional modules include beam attenuators and homogenizers and dielectric laser masks.
IX-1100 C2C includes an industrial robot that can interface with a variety of cassette modules per customer requirements. Includes JPSA factory automation software, machine vision for fully automatic wafer alignment and automated laser calorimetry of multiple power and energy meters, plus multiple beam profilometers for laser beam size and shape, data archiving and QC.
Available with optional SQL database connectivity. Typical applications include tracking of process data by part number.
JPSA, www.jpsalaser.com
The high-performance RC7M robot controller has a program processing speed five times faster than the previous RC5 model. Features user-friendly operation, light weight and compact size. Weighs under 50 lbs. and measures 440 x 425. x 157.5 mm.
Features an expanded range of communications interfaces, including 100 Base-T Ethernet, USB, RS-232C and Mini Parallel I/O. DeviceNet, Profibus and Parallel I/O ports are optional. The 3.25 MB memory (expandable to 5.5 MB) can hold up to 10,000 programming steps and 30,000 teach points. Fully compliant with the latest ISO, ANSI and CE safety standards.
Options include a new, improved teaching pendant with a large 7.5 in. color touchscreen and a lower-cost, high-functionality minipendant with a 128 x 64 pixel LCD display, as well as WINCAPS II 3-D simulation software, which allows offline programming and remote, real-time monitoring of robot operation.
DENSO Corp., densorobotics.com
Features an expanded range of communications interfaces, including 100 Base-T Ethernet, USB, RS-232C and Mini Parallel I/O. DeviceNet, Profibus and Parallel I/O ports are optional. The 3.25 MB memory (expandable to 5.5 MB) can hold up to 10,000 programming steps and 30,000 teach points. Fully compliant with the latest ISO, ANSI and CE safety standards.
Options include a new, improved teaching pendant with a large 7.5 in. color touchscreen and a lower-cost, high-functionality minipendant with a 128 x 64 pixel LCD display, as well as WINCAPS II 3-D simulation software, which allows offline programming and remote, real-time monitoring of robot operation.
DENSO Corp., densorobotics.com
Press Releases
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