Surclean, a division of SMT, will showcase SMT USC400 at the upcoming Nepcon show and in Birmingham, U.K. The portable ultrasonic contact type stencil cleaning system can remove difficult high tack residues such as those found with Pb-free solder materials.
Suitable for offline and on-printer cleaning operations. Stencil cleaning can be carried out on the printer without removing the stencil frame. Can be easily moved between work areas or printers.
An optional ultrasonic mini-bath cleans machine accessories such as placement nozzles, glue dispensing needles, test probes, etc.
Is lightweight for portability, has rugged industrial construction for long service life and is suitable for all stencil materials, even plastic. Suitable for cleaning all printable materials, including paste, inks, resists and SMD adhesives. Surclean,surclean.co.uk Nepcon UK, Booth J73
Essemtec will display SP200-AV, a fine-pitch printer with automatic vision adjustment, at the upcoming Nepcon U.K. show.
The easy-to-operate semiautomatic printing machine controls and regulates all printing parameters. The only manual task is to slide the PCB into the machine. All other operations, including the positioning of the PCB, are fully automatic and reproducible. Designed for serial production but can also be used for small batches.
Benefits include a fast two-point vision system, automatic PCB positioning with vision, automatic printing process, automatic stencil cleanliness check and fast PCB loading with side drawer. Provides an unlimited number of printing programs, an integrated operation manual, simple changeover between jobs and Windows XP software. All printing parameters are programmable.
Xpress 25 SMT placement system combines high-speed and fine-pitch capabilities within a compact footprint. The twin headed system can place devices ranging from 0201 to 50 x 50 mm QFP (70 x 70 mm QFP and 100 mm connector optional) at a tact time of 0.144 sec (25,000 cph equivalent, IPC: 18,900 cph). Equipped with “smart nozzles” and on the fly vision.
Has feeder capacity of 92 x 8 mm and accuracy of ±0.06 mm (QFP) to ±0.1 mm (chip) at 4 sigma. Features a minimum pitch of 0.4 mm (0.3 mm optional) and a tape size range of 8 to 88 mm.