Products
LMS6000 is a fully functional, closed loop, ytterbium-doped fiber laser system capable of marking a variety of flat label materials and direct marking on specific metallic and plastic substrates. Includes an in-line mark grading system with error detection capability. Features reel-to-reel transportation with integrated fume extraction and vacuum hold-down of the material being marked.
Ytterbium laser provides marking resolution up to 1000 dpi at a marking speed of 2000 mm/sec. Labeling applications include compact bar codes and 2D data-matrices. Effective marking area of 130 x 130 mm can be expanded to 185 x 185 mm for continuous applications; with optional direct part marking module, a 1m2 marking area is possible. Provides fast throughput for cutting, oxidizing, engraving and anodizing.
Specific materials suitable for the system include: AL-AN anodized aluminum tags, ACR Tamper Evident Acrylic, acrylic coated polyester, polyester, Poly-A200 and Poly-A400 Laser Markable Polyesters, NMX Aramid Tags, TTVF Polyvinyl Fluoride, RMK and RMK6 Raymark epoxy coated labels, Stainless Steel, Brown Steel, Duroplast, Copper, Titanium and Carbide as well as polyaramid, PVF, AlumaMARK laser markable aluminum and many others. Other materials can be optimized per application requirements or to specific industry specifications.
Weighs 35Kg and measures 150 x 25 mm, which allows for portability, sharing or on-site work. Integrated software package helps with label designs and connects with many production control software systems.
Tyco Electronics Corporation, www.tycoelectronics.com
Ytterbium laser provides marking resolution up to 1000 dpi at a marking speed of 2000 mm/sec. Labeling applications include compact bar codes and 2D data-matrices. Effective marking area of 130 x 130 mm can be expanded to 185 x 185 mm for continuous applications; with optional direct part marking module, a 1m2 marking area is possible. Provides fast throughput for cutting, oxidizing, engraving and anodizing.
Specific materials suitable for the system include: AL-AN anodized aluminum tags, ACR Tamper Evident Acrylic, acrylic coated polyester, polyester, Poly-A200 and Poly-A400 Laser Markable Polyesters, NMX Aramid Tags, TTVF Polyvinyl Fluoride, RMK and RMK6 Raymark epoxy coated labels, Stainless Steel, Brown Steel, Duroplast, Copper, Titanium and Carbide as well as polyaramid, PVF, AlumaMARK laser markable aluminum and many others. Other materials can be optimized per application requirements or to specific industry specifications.
Weighs 35Kg and measures 150 x 25 mm, which allows for portability, sharing or on-site work. Integrated software package helps with label designs and connects with many production control software systems.
Tyco Electronics Corporation, www.tycoelectronics.com
The electronics group of Henkel has introduced a new process, Accelerated Cooling (AC), to be used with its two flip-chip in package non-conductive paste (NCP) underfill encapsulants. The NCP materials, Hysol FP5000 and Hysol FP5001, provide moisture resistance, thermal cycling resistance, expedite the assembly process and are designed for Pb-free interconnects.
Provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process, eliminating the need for flux application, reflow and cleaning.
AC process heats the device while it is secured by the flip-chip bonder head and then is rapidly cooled during compression onto the NCP-coated substrate. This rapid cooling enables assembly completion prior to any excess heat exposure and, consequently, reduces package warpage, voids caused by moisture and assembly cycle time. Cuts typical cycle time in half (cycle times average 7 sec.).
Henkel, electronics.henkel.com
Provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process, eliminating the need for flux application, reflow and cleaning.
AC process heats the device while it is secured by the flip-chip bonder head and then is rapidly cooled during compression onto the NCP-coated substrate. This rapid cooling enables assembly completion prior to any excess heat exposure and, consequently, reduces package warpage, voids caused by moisture and assembly cycle time. Cuts typical cycle time in half (cycle times average 7 sec.).
Henkel, electronics.henkel.com
DataFlex Plus thermal transfer overprinter (TTO) provides on-line printing of variable and real-time data, such as expiration dates, batch/lot codes, ingredients/parts listings, bar codes and logos.
Direct-drive ribbon technology contains few wearable parts, increasing reliability and minimizing downtime and costs associated with ribbon breaks. Standard 1,000 meter ribbon means less frequent changes and higher production line efficiency. Features simple ribbon cassette
Has an intuitive 8.4” SVGA GUI and color touch screen with easy-to-learn, icon-based controls. The standard WYSIWYG job display features a zoom facility to reduce operator error and minimize printing incorrect codes. Has three levels of password protection.
Bi-directional ribbon drive allows unused ribbon to be recaptured following each print. This maintains a 1 mm gap between prints for the complete length of the ribbon, creating more prints per roll.
Direct-drive ribbon technology contains few wearable parts, increasing reliability and minimizing downtime and costs associated with ribbon breaks. Standard 1,000 meter ribbon means less frequent changes and higher production line efficiency. Features simple ribbon cassette
Has an intuitive 8.4” SVGA GUI and color touch screen with easy-to-learn, icon-based controls. The standard WYSIWYG job display features a zoom facility to reduce operator error and minimize printing incorrect codes. Has three levels of password protection.
Bi-directional ribbon drive allows unused ribbon to be recaptured following each print. This maintains a 1 mm gap between prints for the complete length of the ribbon, creating more prints per roll.
Videojet Technologies Inc., videojet.com
Press Releases
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- Keiron Technologies to Host LiFT Webinar Focusing on Solving Solder Paste Printing Challenges
- Express Manufacturing, Inc. Strengthens Test Capability with Acculogic Flying Probe System