‘Advantage X’ enhancement package is said to boost placement rates by 15%. The retrofittable upgrade is suitable for all MIMOT pick-and-place machines; it combines hardware and software advances. Beneficial for high-mix pick-and-place systems, bringing the cph rate to 24,000 for devices from chip components to fine pitch.
Features an intelligent nozzle vacuum sensor, automatic polarity checks for feeder setup and other software help tools.
Will be a standard feature on all new Advantage Systems.
Blue Thunder Technologies will distribute Loctite Multicore product line. The company has been supplying consumables such as GREEN MONSTER! stencil wiping rolls, lint-free wipes, pre-saturated wipes, ESD items, gloves and more to the electronics industry for several years.
Blue Thunder is now distributing Loctite’s electronic products including but not limited to solder paste, Pb-free solder paste, solder bar, solder wire, underfills, encapsulants, flux materials, surface-mount adhesives, circuit board protection and low-pressure molding.
BP Microsystems will highlight the latest addition to its Helix automated device programmer at the upcoming NEPCON South China exhibition and conference in Shenzhen.
As a desktop automated system, the Helix comes with two precision-designed tray input and output handling systems with a reject location. The updated system is designed to have the same dph and is based on the Helix-TU-10 design. The tray version uses the same core programming technology, as well as the same socket modules as the standard BP Microsystems automated line. The pressure plates are exchangeable between the tray version and the Helix-TU-10 units.
Integrated in the handler are two Enhanced 7th Generation programming sites with FX4 socket module capability. This allows for programming up to four devices simultaneously per site. Designed to handle a range of packages including MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date.
BP Microsystems, www.bpmicro.com Nepcon Shenzhen booth 52C01