Products
Creative Materials, a supplier of electrically conductive inks, coatings, adhesives and encapsulants, announced an electrically conductive adhesive, GPC-251A/B, and a thermally conductive underfill epoxy, 123-38A/B187, designed for flip-chip assembly.
Flip-chip replaces wire bonding as the electrical connection of electronic components onto substrates or circuit boards. A process long used in the automotive industry, flip-chip assembly is growing in popularity among makers of cell phones, handheld electronic devices and microprocessors.
GPC-251A/B is a silver filled, electrically conductive, two-part, room-temperature curing adhesive used to connect the bumps on the underside of circuit boards. It cures in 24 hr. at 25°C, 60 min. at 65°C and in five min. at 120°C.
123-38A/B-187 is a thermally conductive underfill epoxy that strengthens the chip package, protecting it from moisture while adding mechanical strength. Is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. Low viscosity makes it ideal for underfilling applications.
Creative Materials, creativematerials.com
DEK will exhibit its latest product and process innovations from stand 7-205 at the SMT/Hybrid/Packaging exhibition in Germany.
DEK will demonstrate a range of solutions designed to boost productivity and performance in the modern manufacturing environment. On-stand exhibits will include Europa, Horizon 01i and 03i high accuracy mass imaging platforms in conjunction with a range of process enabling technologies.
The booth will host a demonstration of Europa with Rapid Transit Conveyor (RTC), a combination capable of reducing core cycle time to just 4 sec. Delivering speed regardless of other process variables, RTC high speed board transport option improves operator control for optimized print productivity. The company will also feature HawkEye, an automatic high speed print verification technology. It analyzes streamed 2-D board images in real-time to generate pass/fail indications at the line beat rate to deliver instant isolation of faulty boards.
The Lead-Free display will feature a range of high quality consumables, ProFlow and VectorGuard. VectorGuard Gold and Silver electro-formed and laser-cut nickel stencil technologies are designed to accommodate changing paste properties through enhanced aperture release and paste volume repeatability. ProFlow enclosed print head technology can extend the high accuracy mass imaging process window for improved throughput, yield and efficiency.
DEK, dek.com
DEK will demonstrate a range of solutions designed to boost productivity and performance in the modern manufacturing environment. On-stand exhibits will include Europa, Horizon 01i and 03i high accuracy mass imaging platforms in conjunction with a range of process enabling technologies.
The booth will host a demonstration of Europa with Rapid Transit Conveyor (RTC), a combination capable of reducing core cycle time to just 4 sec. Delivering speed regardless of other process variables, RTC high speed board transport option improves operator control for optimized print productivity. The company will also feature HawkEye, an automatic high speed print verification technology. It analyzes streamed 2-D board images in real-time to generate pass/fail indications at the line beat rate to deliver instant isolation of faulty boards.
The Lead-Free display will feature a range of high quality consumables, ProFlow and VectorGuard. VectorGuard Gold and Silver electro-formed and laser-cut nickel stencil technologies are designed to accommodate changing paste properties through enhanced aperture release and paste volume repeatability. ProFlow enclosed print head technology can extend the high accuracy mass imaging process window for improved throughput, yield and efficiency.
DEK, dek.com
Koy Young will introduce its KY8030 Solder Paste Inspection (SPI) system for the Chinese market during Nepcon Shanghai this week. Adding to the company’s portfolio of 3-D SPI equipment, this small footprint system offers a low cost of ownership. A dedicated Chinese GUI allows fast set-up and intuitive operation.
President and CEO Dr.Kwangill Koh said in a press release, “Test and Inspection is very cost sensitive, but vital for new process introduction. With the Chinese RoHS legislation, we believe that it will be inevitable for customers to use 3-D SPI during the Pb-free process introduction”.
3-D SPI Equipment delivers accuracy and repeatability for measurement of true paste height, area and volume at line speed. Strong SPC package contributes to better productivity and enhances the product by ensuring consistent solder paste volume.
Koh Young Technology, kohyoung.com
President and CEO Dr.Kwangill Koh said in a press release, “Test and Inspection is very cost sensitive, but vital for new process introduction. With the Chinese RoHS legislation, we believe that it will be inevitable for customers to use 3-D SPI during the Pb-free process introduction”.
3-D SPI Equipment delivers accuracy and repeatability for measurement of true paste height, area and volume at line speed. Strong SPC package contributes to better productivity and enhances the product by ensuring consistent solder paste volume.
Koh Young Technology, kohyoung.com
Nepcon Shanghai booth 1F15 (WKK)
Press Releases
- Seika Machinery to Host Webinar on Wireless Strain Measurement for PCB Testing
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China