Products
Finetech will highlight the Fineplacer Pico system in booth E1A02 during Nepcon China/EMT China on April 4-7.
The base module can be used in a wide field of applications for rework and different kinds of micro assembly, e.g. flip chip bonding. For micro assembly, it offers 5 µm (0.2 mil) placement accuracy, allowing die with a pitch down to 50 µm to be bonded. The rework configuration offers accessibility for nearly all large standard surface-mount components.
It is capable of both rework and assembly. It can be configured with a small passive rework application package that includes all rework steps: component removal, residual solder removal, paste dispensing and new component soldering. This configuration makes it possible to see 0201 or 01005 components using high-magnification optics. The optional integrated solder paste dispenser can dispense solder paste dots small enough for 01005 rework and can also be configured to dispense epoxy and underfill.
A second application package is available for mobile device rework. Comes equipped with a motorized placement module and can perform the entire rework process for the smallest of devices up to RF shield cans.
The flip chip bonding configuration includes additional process modules: a chip contact heating module, special heating plate and a bonding force module. Many flip chip applications can be supported, including eutectic and AuSn soldering, thermo compression and thermo/ultrasonic bonding, adhesive technologies, ACP (Anisotropic Conductive Paste), and Chip On Glass (ACF).
Features "WinCOMISS" software that controls bond force during placement and soldering.
Finetech, finetechusa.com
The base module can be used in a wide field of applications for rework and different kinds of micro assembly, e.g. flip chip bonding. For micro assembly, it offers 5 µm (0.2 mil) placement accuracy, allowing die with a pitch down to 50 µm to be bonded. The rework configuration offers accessibility for nearly all large standard surface-mount components.
It is capable of both rework and assembly. It can be configured with a small passive rework application package that includes all rework steps: component removal, residual solder removal, paste dispensing and new component soldering. This configuration makes it possible to see 0201 or 01005 components using high-magnification optics. The optional integrated solder paste dispenser can dispense solder paste dots small enough for 01005 rework and can also be configured to dispense epoxy and underfill.
A second application package is available for mobile device rework. Comes equipped with a motorized placement module and can perform the entire rework process for the smallest of devices up to RF shield cans.
The flip chip bonding configuration includes additional process modules: a chip contact heating module, special heating plate and a bonding force module. Many flip chip applications can be supported, including eutectic and AuSn soldering, thermo compression and thermo/ultrasonic bonding, adhesive technologies, ACP (Anisotropic Conductive Paste), and Chip On Glass (ACF).
Features "WinCOMISS" software that controls bond force during placement and soldering.
Finetech, finetechusa.com
DEK will attend the Nepcon UK show, held May 9-11 at the National Exhibition Centre, Birmingham. Sop by stand C30 to find information and exhibits of the HawkEye print verification system operating on a Europa high-accuracy SMT printer equipped with Instinctiv; VectorGuard stencil technologies; and consumables.
Visitors can witness DEK’s HawkEye print verification system in action, live on the Europa platform. It enables high-speed verification of 100% of printed boards at line beat rate. The system analyzes streamed 2-D board images in real-time to generate a pass/fail indication. Any faulty board can be immediately isolated before component placement and returned for cleaning and re-printing, thereby minimizing scrap.
The Instinctiv user interface provides intuitive graphical features and on-board help to streamline new product introduction, facilitate process monitoring and optimization, and reduce stoppages.
VectorGuard stencil technologies address the need for accuracy in the Pb-free environment. The Gold electro-formed stencils and Silver nickel laser-cut stencils reportedly deliver enhanced aperture release and paste volume repeatability.
DEK, dek.com
Visitors can witness DEK’s HawkEye print verification system in action, live on the Europa platform. It enables high-speed verification of 100% of printed boards at line beat rate. The system analyzes streamed 2-D board images in real-time to generate a pass/fail indication. Any faulty board can be immediately isolated before component placement and returned for cleaning and re-printing, thereby minimizing scrap.
The Instinctiv user interface provides intuitive graphical features and on-board help to streamline new product introduction, facilitate process monitoring and optimization, and reduce stoppages.
VectorGuard stencil technologies address the need for accuracy in the Pb-free environment. The Gold electro-formed stencils and Silver nickel laser-cut stencils reportedly deliver enhanced aperture release and paste volume repeatability.
DEK, dek.com
Bonding Source LLC, a reseller of specialty materials, enters the microelectronics and RF/Microwave market with a family of epoxies and bonding wire. It will provide immediate delivery of electrically conductive and non-conductive pastes and films manufactured by Ablestik, Emerson & Cuming and Epoxy Technology. Epoxy film pre-forms will be available with a lead-time of one week. An array of gold bonding wire and ribbon manufactured by SPM will be available for immediate delivery. The company will offer next-day delivery of epoxy paste syringes, film sheets and spools of wire/ribbon.
Scott MacKenzie, president, said, “We decided to start this new concept in providing specialty materials because we were always frustrated with how long it took to get a quote, lead-times on delivery and minimum charges. In our manufacturing business, a 4-6 lead-time on material isn’t acceptable to our customers. Also, we were constantly buying more epoxy than we could use up before the expiration date. Every year we were tossing out or reclaiming thousands of dollars worth of epoxy and wire. We thought that there must be other microelectronics and RF/Microwave companies experiencing the same pain, and approached the epoxy and wire manufacturers with the idea. They have been fully supportive, and the response from the industry has been tremendous. Bonding Source takes all the risk by purchasing the epoxy and wire, and the customers just call up and get what they need the next day.”
Bonding Source, bondingsource.com
Scott MacKenzie, president, said, “We decided to start this new concept in providing specialty materials because we were always frustrated with how long it took to get a quote, lead-times on delivery and minimum charges. In our manufacturing business, a 4-6 lead-time on material isn’t acceptable to our customers. Also, we were constantly buying more epoxy than we could use up before the expiration date. Every year we were tossing out or reclaiming thousands of dollars worth of epoxy and wire. We thought that there must be other microelectronics and RF/Microwave companies experiencing the same pain, and approached the epoxy and wire manufacturers with the idea. They have been fully supportive, and the response from the industry has been tremendous. Bonding Source takes all the risk by purchasing the epoxy and wire, and the customers just call up and get what they need the next day.”
Bonding Source, bondingsource.com
Press Releases
- Seika Machinery to Host Webinar on Wireless Strain Measurement for PCB Testing
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China