Products
FEINFOCUS, a business unit of COMET, announces the HDX-ray 16-bit Imaging Chain for FOX x-ray inspection systems. Captures high-resolution images with film-like quality, even in real-time. Provides sharp digital images for thorough inspection of applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, high-density interconnects, hybrids and encapsulants.
Fully-integrated 2.6 mega pixel imaging subsystem features more than 65,000 grey scales with freely-selectable frame rates from 1 to 30 fps, for imaging of low-contrast, low-density and high-contrast, high-density structures and materials at the same time. Powered by the Feinfocus GUI.
FOX nanofocus x-ray inspection system provides xy feature recognition of 300 nm (0.3 µm) and asmallest focal spot size (less than 1 µm). Employs a modular concept, available in multiple configurations. Offers geometric magnification up to 2,720x (total magnification up to 8,120x).
COMET, comet.ch
Xpert3 kit works with the SuperM.O.L.E. Gold thermal profiler to automate convection reflow oven process development. Distills recipe development into three steps: Create Signature; Plan Target; and Set & Verify.
Signature Wizard helps create an oven signature file for your reflow oven at a given convection rate. With that oven selection in place you plan robust target profiles, choosing from the 400 solder paste formulations in the database. Entering Assembly Properties information completes the planning stage and Set & Verify delivers the oven recipe.
A solder paste specification may be set to your choice of Ramp-Soak-Spike or a Ramp-to-Spike profile. Converting an existing process to a Pb-free paste is quick and easy. Qualify your oven's Pb-free capability by observing if the required zone setpoints per conveyor speed exceed the oven's maximum capability. The Transpose command immediately converts a profile to your new oven, and the system works with any reflow oven.
ECD, www.ecd.com
ProFlow enclosed print head is a key element of the lead-free portfolio DEK has created to help the transition to high-quality, repeatable lead-free processing. When implementing lead-free assembly, high accuracy mass imaging using the print head reportedly maximises the process window, compared to conventional squeegee blades.
Reduces the number of variables – such as paste rheology and ambient humidity – that need to be controlled for lead-free utilisation. The result is a simplified paste evaluation process and confident vendor selection, supported by repeatable results to justify procurement decisions.
In operational use, the greater transfer force maximises stencil aperture fill and paste release efficiency. Has repeatable aperture filling, low paste wastage and high throughput.
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