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Products

Series 2600 System SourceMeter instruments reportedly combine the highest throughput source-measure unit (SMU) in the industry with a scalable instrument form factor to allow integration into systems from 1 to 16 SMU channels. The single-channel Model 2601 and the dual-channel Model 2602 are modular, scalable instruments for building ATE systems to perform precision DC, pulse, and low-frequency AC source-measure tests.

A new embedded Test Script Processor (TSP) lets users program a sequence of test commands and execute high-speed automated test sequences independently of a PC operating system. Features an intuitive intelligence that lets the instrument stand alone as a complete measurement automation solution for component testing. Can control sourcing, measuring, pass/fail decisions, test sequence flow control, component binning and data storage.

Equipped with Test Script Builder development software, a simple GUI lets users develop, modify and debug high-speed TSP programs. Each unit also features a built-in suite of pre-written TSP programs that can be modified for specific applications. LabTracer 2.0 software enables easy instrument control, data acquisition and curve tracing in lab or device characterization applications.

The high throughput, flexible and scalable instruments are suitable for a range of applications in functional test and R&D environments. Units can perform I-V functional test and I-V characterization of a range of integrated devices and components including discrete and passive devices, and SSI and LSI devices such as ASICs, SOCs, and RFICs. In R&D environments, units can perform device characterization to aid in materials research for device development.

Keithley Instruments, keithley.com

Multicore MF210 no clean, halide-free sustained activity flux is formulated to work over a range of solder resists and is compatible with rosin- and OSP-based surface preservatives.

Said to offer a maximum process window without resin, which satisfies the demand for applications requiring high performance and reliability. Allows for high-speed soldering on conventional leaded and surface-mount components, good through-hole penetration and optimum wetting of surfaces.

For use in foam, spray or wave fluxes similar to ordinary fluxes on standard wave soldering machines.

Meets or exceeds the IPC-TM-650 2.3.32 Copper Mirror Test standard, and meets specifications for J-STD-004 SIR and Bellcore GR-78-CORE electromigration testing.

Henkel, loctite.com

Isola Group, SARL has successfully tested IS620 under simulated lead-free assembly conditions. The boards, built at Merix, went through the reflow assembly simulation six times without any delamination. The peak temperatures were over 262°C. The 14-layer capability board was tested before and after eight reflow simulations and the results did not show any thermal degradation, the T-26's were over 60 min. and the decomposition temperatures and the T-288s were also unchanged.

"We are really pleased with the results, IS620 is rapidly gaining momentum as the low-loss product of choice for very high speed applications due to excellent thermal cycling and low loss attributes," said Tarun Amla, VP and CTO.

"The Merix lead free testing program is aggressive and materials that successfully pass are robust. These results are very encouraging..." said Doug Trobough, CTO of Merix.

The epoxy is currently manufactured in the Isola high performance and quick turn facility in Fremont, CA.

isola-group.com