AlphaPREP PC-7030 oxide replacement system produces a highly bondable brown conversion coating on copper innerlayers using horizontal equipment by removing minimal amounts of copper.
Specially formulated for low-etch/high capacity operations, offers up to 60% reduction in consumption and waste treatment. Featuring a low copper etch factor of 0.9 - 1.1u, copper loss from fine lines and thin copper is reduced, improving performance on controlled impedance.
Other benefits include: Reduction in consumption and waste treatment; Increased peel strengths on High Tg dielectrics; Less frequent bath changes with increased up-time; Improved yields and reliability.
New control and hardware capabilities are available for the Power Column 2 vertical lift module (VLM).
Hardware capabilities include an increase in vertical travel speed from 29 in./sec. to 55 in./sec.; specialty trays in widths up to 157" (98" standard) and weight capacities up to 1100 lbs (880 lbs standard).
An integrated parts lookup table enables the operator to search for a part number and then have the module automatically retrieve the tray where the part is stored.
Other control modifications include new screen designs on the unit's touch-screen keypad. Additional software control choices are also available.
Rack-and-pinion drive allows pinpoint retrieval of item trays without adjustment. Available in heights from 10 to 50', features options such as a tilt-tray up to 45°, a lift system that adjusts the height of the pick tray and a lockable powered door.
Soder-Wick Lead-Free Desoldering Braid is engineered for high-temperature, lead-free solder removal. Maximizes heat transfer to the solder joint, melting the solder faster and more efficiently than conventional desoldering braids. Designed and optimized for all lead-free solders, said ton prolong the tip life on soldering irons.