Circuits Assembly Online Magazine - Current Issue

Products

HYDRA Speedmount 21k ER can hande component sizes from 0201 to15 x15 mm large ICs. New mounthead option facilitates multi-picking of a broader range of components.

Uses Linescan vision system for on-the-fly vision centering of the smallest chips up to complex mid-sized components. Mounthead is compatible with a range of tools as well as the automatic tool exchanger. Features the new H05 tool for large components and the H06 tool for ultra small chips.

Machine software (TPSys) optimizes operation, including pick-up sequences and tool changes.

Mydata Automation

Zestron Asia Pacific will exhibit solutions for PCB/ceramic hybrids, chip packaging and stencil/misprint cleaning applications at Nepcon Shanghai on April 12 - 15. The Asian technical and sales team can answer your latest questions on lead-free cleaning at booth 2H15.

www.zestron.com

The high-throughput IX-3000 is a Class 1 UV Excimer-based laser step and scan ablation system for micro-machining, drilling and laser processing.

The high-accuracy mask imaging system for large field of view (FOV) processing applications is also surrounded by a cleanroom enclosure with HEPA filtration.

Operates at 248 or 193nm UV wavelengths primarily; however, customer can choose different lasers, including: large-area patterning, microvia drilling, microelectronics micro-machining; general drilling; manufacture of inkjet nozzle arrays; flat panel displays, wafer-scale processing; sensors; microfluidics; and other applications, all with resolution down to 1 micron.

Optical resolution, repeatability and structural accuracies are sub-micron with 0.2 to 0.3 micron repeatability. Granite-based, vibration and thermal dampened for optimum stability.

Available with cassette-to-cassette wafer handling, panel-handling, robotics handling or tape and reel systems as options. Readily integrates with high-volume part handling systems.

J P Sercel Associates (JPSA), www.jpsalaser.com