AlSiC (Aluminum Silicon Carbide) metal matrix composite for optoelectronic housings and lids enables a tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies. Unlike traditional housing materials, the isotropic CTE value of AlSiC can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. CTE matching capabilities ensure alignment and precision.

Exhibits high thermal conductivity for thermal dissipation, prevents bowing and flexing of packaging and substrate material that can lead to failure. Traditional housing materials with lower thermal dissipation can cause delamination, leading to air gaps and poor reliability.

The near and net-shape fabrication process produces the composite material and fabricates the product geometry, allowing rapid prototyping for high-volume thermal management solutions. Unrestricted geometry enables the inclusion of design features such as septums, walls and radial features. Casting process allows integration of high thermal conductivity inserts (>1000 W/mK) or cooling tubes.

CPS Corp., alsic.com