Products
A new phase change tape extends the line of Thermacool thermal management products for the computer assembly market. Provides high thermal transfer between microelectronic components on circuit boards and heat sinks, allowing the replacement of thermal grease in rapid microelectronic assembly operations.
Available in many customized die cut formats for a range of applications.
The new line of phase change products include:
- C1055, with very high thermal conductivity; has been specified in many high performance processor applications.
- C1060, which has an integral reinforcement to provide more robust handling.
- C1095X01 thermally conductive polymeric interface material designed to avoid bondline adhesion between heat sink and the microprocessor metal surface for rework.
- C1100 phase change compound with room temperature self-adhering-properties and improved heat transfer that is said to rival the best thermal grease.
DEK 248 semi-automatic printers have a new PC-based user interface, allowing operators to view all machine parameters at a glance. A new keyboard features integrated trackball. Has integrated support for Simplified Chinese, Korean and Japanese. A 3.5-inch floppy disk drive is included.
Supports optional vision capabilities. Vision setup features are fully integrated, real-time image data is displayed on-screen. Vision information of the product is saved automatically with the product file.
The new UI resembles the interface available for DEK's high-end fully automatic platforms, enhancing commonality between machines in the range.
ALPHA OM-325 lead-free solder is said to simplify the transition to µ-fine feature printing in lead-free processes. Reportedly offers excellent print transfer efficiency, self-alignment properties with small components down to 0402 or 01005", joint cosmetics across challenging reflow profiles, low voiding performance and product stability.
"We developed ALPHA OM-325 in our Japanese R&D center in collaboration with leading global adaptors of lead-free technology for use in their high end consumer electronics products," said Valentijn Van Velthoven, global product manager. "Our rigorous product development work for OM-325 can be compared to what Formula One technology means for the automotive industry. We have achieved tomorrow's technology, and made it available today."
Made with Type 4 and 5 powder, the paste delivers excellent µ-fine feature print yield and works well in demanding high-soak reflow profiles.
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