Products
i-Cube10 (YRH10) hybrid placer has surface mounter functions for electronic components and a die bonder for wafer components.
Double-sided, molded ball grid array is for 5G RF module design, characterization and packaging technology.
UV500-2 high solids UV dual-cure elastomeric acrylate conformal coating is for automotive applications.
Press Releases
- Trilogy-NET Adds Second Vapor Phase Reflow System to Expand High-Precision Manufacturing
- Federal Electronics Invests in HydroJet Inline Cleaning Technology at Hermosillo Facility
- Seika Machinery to Host Webinar on Wireless Strain Measurement for PCB Testing
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities