Press Releases
NEW DELHI – The Union Cabinet chaired by Prime Minister Shri Narendra Modi was apprised of a Memorandum of Cooperation (MoC) signed in July, 2023 between the Ministry of Electronics and Information Technology of the Republic of India and the Ministry of Economy, Trade and Industry of Japan on Japan-India Semiconductor Supply Chain Partnership.
The MoC intends to strengthen cooperation between India and Japan towards enhancement of semiconductor supply chain, recognizing the importance of semiconductor for the advancement of industries and digital technologies.
The MoC shall come into effect from the date of signature of the Parties and shall be remain in force for a period of five years.
Both G2G and B2B bilateral Cooperation on opportunities to advance resilient semiconductor supply chain and leverage complementary strengths.
MoC envisages improved collaboration leading to employment opportunities in the field of IT.
Background:
MeitY has been actively working to create a conducive environment for electronics manufacturing. Programme for Development of Semiconductor and Display Manufacturing Ecosystem in India was introduced with a view to ensure the development of a robust and sustainable semiconductor and display ecosystem in India. The said program aims to extend fiscal support for establishment the Semiconductor Fabs, Display Fabs, Fabs for Compound Semiconductors/Silicon Photonics/Sensors/Discrete Semiconductors and Semiconductor Assembly, Testing, Marking, and Packaging (ATMP)/Outsourced Semiconductor Assembly and Test (OSAT) facilities. Further, India Semiconductor Mission (ISM) has been established under Digital India Corporation (DIC) to drive India's strategies for development of semiconductor and display manufacturing ecosystem in the country.
MeitY has also been mandated to promote international cooperation in the emerging and frontier areas of Information Technology under bilateral and regional frameworks. With this objective, MeitY has entered into MoUs/MoCs/Agreements with counterpart organizations/agencies of various countries to promote bilateral cooperation and exchange of information and also to ensure supply chain resilience enabling India emerge as trusted partner. Enhancing mutual collaboration between Japan and Indian companies through this MoU is a another such step towards mutually beneficial semiconductor related business opportunities and partnerships between India & Japan.
In view of synergies and complementarities between the two nations, "India-Japan Digital Partnership" (IJDP) was launched during the visit of PM Modi to Japan in October 2018 furthering existing areas of cooperation as well as new initiatives within the scope of cooperation in S&T/ICT, focusing more on "Digital ICT Technologies". Based on the ongoing IJDP and India-Japan Industrial Competitiveness Partnership (IJICP), this MoC on Japan-India Semiconductor Supply Chain Partnership would further broaden and deepen the cooperation in the field of electronics ecosystem. Recognizing the importance of semiconductor for the advancement of industries and digital technologies, this MoC would provide for the enhancement of semiconductor supply chain resilience.
REDDITCH, UK – Altus Group, a leading distributor of electronics assembly equipment in the UK and Ireland, is enabling manufacturers to adopt advanced semiconductor packaging techniques with Koh Young's Meister D automated optical inspection (AOI) systems.
As electronics devices demand increasingly sophisticated functionality, they rely on advanced packaging methods such as System-in-Package (SiP), Fan-out wafer-level packaging (FOWLP), and 3D stacking to integrate components in less space while increasing density. However, these innovative configurations also create new inspection challenges. Traditional 2D AOI systems struggle to reliably detect microscopic defects on miniaturised parts.
The Meister D series from Koh Young delivers unprecedented production-speed 3D inspection capabilities tailored for these challenges. This advanced AOI system combines high-resolution 3D measurement with AI-powered defect analysis for precision results. With 25-megapixel camera and 3.5m-micron resolution, it can accurately inspect tiny components down to 0201 metrics, highly reflective and shiny die surfaces, and gaps down to 50 μm to identify micro cracks, chipping and foreign material.
Anthony Oh, Technical Applications Manager at Altus Group, said: "In an era where electronics devices demand increasingly sophisticated functionality and miniaturisation is the norm, the Meister D exceptional true 3D inspection capabilities provide our customers with the precision they need for advanced semiconductor packages. By adopting this cutting-edge AOI, manufacturers gain the process control to confidently implement new techniques that not only enhance their products but also help make devices smarter and more compact."
The Meister D eight-projector inspection probe provides images from different angles to build a complete 3D profile, overcoming issues like shadowing and compensating for reflective surfaces. The 3D data also enables height and tilt measurement for components, critical for inspection. All these capabilities deliver repeatable, autonomous defect identification, providing significant advantages over traditional 2D AOI.
In addition to the Meister D, Altus also offers the Meister D+ with extra optics innovations designed for highly reflective components. By providing the full Meister series, Altus Group ensures that manufacturers in the UK and Ireland have access to world-class inspection tools tailored for the latest assembly advances.
For more information about the Meister D series and its pioneering capabilities in semiconductor packaging inspection, please visit www.altusgroup.co.uk
NEW BRITAIN, CT – MicroCare LLC, a leading global manufacturer of critical cleaning, coating, and lubrication solutions, is proud to announce its 40th anniversary. Since its founding in October 1983, MicroCare has grown from humble beginnings into a trusted world-class company with facilities and distribution centers across the United States, Europe, and Asia.
"Reaching the 40-year milestone is a remarkable achievement and a testament to the company’s employees, customers, and partners who have contributed to the company's success," said Tom Tattersall, CEO of MicroCare LLC. "It's been an incredible journey since our founder, Chris Jones, first started the company with a single aerosol filling line. MicroCare has come a long way since those early days while still maintaining its commitment to product quality, customer service, integrity and continuous innovation."
Since its modest beginnings in a 10,000 square foot facility in Bristol, CT, MicroCare has steadily grown over the decades into a global enterprise. Today, the company comprises state-of-the-art production facilities, distribution centers, and international sales offices spanning three continents.
Major milestones for MicroCare over the past four decades include establishing its pioneering Critical Cleaning Lab in 2007 to ensure the highest standards of quality control, opening strategically located distribution centers in the U.S., Europe and Asia to provide superior customer service, acquiring Certol International (now known as MicroCare Medical) and ICT (infection Control Technologies) to expand its production capabilities, and continually developing cutting-edge cleaning, coating, and lubrication fluids.
NEWMAN LAKE, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that AGS Devices has purchased a Pulsar solderability testing system.
The Pulsar system utilizes the highly proven dip-and-look test method that is a qualitative type test performed by comparative analysis after specimens are dipped in a bath of flux and molten solder. An advantage of the dip-and-look method is since it is based on comparative analysis it can be performed rapidly by shop floor personnel with minimal training as well as requiring significantly lower capital investment compared to a wetting balance test system. The Pulsar solderability testing system complies with all applicable solderability test standards including MIL-STD-883 Method 2003, IPC J-STD- 002 and MIL-STD-202 Method 208.
STEINACH, SWITZERLAND – Fast, efficient, and reliable: the VARIOincubator from Swiss electronics service partner Variosystems consolidates all of the activities that take the customer from the initial idea to mass production, and then ensures long-term availability via life-cycle management. By integrating the company Kubeg into the group, Variosystems is now able to produce functional prototypes in just one week, massively shortening time to market. The company plans to further expand the new site in Zizers for rapid prototyping and small batch production in the coming years and to already grow by roughly 20 percent in 2024.
Rapid production of electronic solutions – Variosystems expands its expertise as a global service partner and enhances its portfolio with rapid prototyping. Through the introduction of the VARIOincubator, the internationally active Swiss technology company with headquarters in Steinach covers all activities involved in the development, procurement, and production of electronic products. By integrating the rapid prototyping specialist Kubeg from Zizers into the group, Variosystems is able to produce functional samples for rapid validation of development results after just one week.
“By joining projects from the development stage, providing support during the prototyping phase, and offering coordinated workflows, shorter lines of communication, and fewer iterations, we significantly reduce time to market and therefore cut costs. Depending on the project, we can shorten the duration by several weeks to months,” emphasizes Julian Specker, Head of VARIOincubator. The VARIOincubator partner network consists of more than 100 engineers. Variosystems also offers its own development services via Solve Engineering. While development and industrialization are underway, the electronics service partner ensures the availability of all components early on via life-cycle management, identifies alternatives, and thus guarantees long-term mass production.
Investments in the Zizers Site
The site for prototyping and small batch production in Zizers (in the Swiss canton of Grisons) plays a central role in the company’s strategic orientation as a partner for innovators. The Zizers site currently has around 50 employees. The team, structure, and contacts remained unchanged after the takeover. “The high level of trust has paid off for everyone. We contribute our expertise to the VARIOincubator and combine our strengths with the global competence of Variosystems. In this way, we support innovators in reducing development times and enable companies to make a seamless transition from small batch to mass production during the scaling phase,” says Silvan Wüthrich, site manager in Zizers.
Through its integration into the group and the launch of the VARIOincubator, Variosystems plans to increase sales in the prototype and small batch segment by roughly 20 percent in 2024. “The model has proven to be a win-win for all sides in just a few months and can also become a success story in our other global customer organizations in the future. We are already noticing that processes are speeding up significantly and we are benefiting from early involvement in projects. This is also reflected in the wealth of positive feedback we have received from customers, potential customers, and market experts,” reports Julian Specker.
WASHINGTON – The U.S. Partnership for Assured Electronics (USPAE) today announced that the Defense Business Accelerator (DBX) Microelectronics Challenge received twice the number of entries expected. Nearly two-thirds of the entrants are startups, and one-third are small- to medium-sized businesses.
All are vying for a chance at awards between $500,000 and $2 million to advance commercially viable microelectronics solutions.
“We are very excited by the quantity and quality of the DBX entries for innovative electronic technologies and materials,” said Nathan Edwards, USPAE executive director. “This program helps advance solutions that will have commercial and defense applications while further strengthening the U.S. electronics industry.”
In a few weeks, finalists will be notified and invited to pitch their solutions at the Defense TechConnect Innovation Summit & Expo in late November.
“Defense TechConnect draws leaders from private industry, investment and government to accelerate state-of-the-art technology solutions,” said Matt Laudon, vice president of the TechConnect Division at ATI. “The DBX project is a great example of how new approaches can leverage innovation hubs to achieve great success.”
The innovative DBX program brings together the electronics industry expertise of USPAE with the Department of Defense’s (DoD’s) Manufacturing, Capability Expansion, and Investment Prioritization Directorate (MCEIP) to award funding through a process meant to accelerate the development of commercial solutions that the DoD can then leverage.
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