Press Releases
PENANG, MALAYSIA – Integrated electronics manufacturing services (EMS) provider, ESCATEC, has promoted Lambert Schutters to the newly created role of Chief Procurement Officer (CPO) with the mandate to strengthen partnerships with suppliers and deliver better value to stakeholders.
Currently General Manager (GM) of ESCATEC’s business units located within the major electronics cluster of Bayan Lepas, Penang, Malaysia, Schutters will start his new role with immediate effect. Hailing from the Netherlands, Schutters remains based at ESCATEC’s corporate headquarters and will work closely with the rest of the C-Team and report directly to the CEO.
“We are delighted to promote Lambert to the role of CPO. His experience has been instrumental in helping the organisation navigate the Covid-19 component shortages. In his new role as CPO, Lambert will be at the forefront of addressing the intricate challenges and tapping into opportunities within our procurement strategies and supply chain processes. We believe his extensive experience and proven track record are perfectly suited to lift the performance of our procurement activities to a new level, effectively navigate our increasingly complex supply chain management and assist ESCATEC in improving customer service and competitiveness,” said Joe Lahra, Chairman of ESCATEC.
“I am happy to make this significant next step in my career journey. Beginning as a buyer in the Netherlands and progressing through diverse procurement and supply chain management roles worldwide, I was privileged to advance to a General Manager role in the electronics industry. Since 2018, I've served as General Manager of ESCATEC’s facilities in Penang,” noted Schutters.
“I am excited to take on the pivotal role of Chief Procurement Officer. This new chapter enables me to reorient toward my original career path while actively contributing to ESCATEC's ongoing growth and success. I am enthusiastic about leading our procurement team, shaping our future strategy, and ensuring our continued excellence in delivering high-quality products and services to our esteemed customers,” he said.
Schutters will be handing over the role of GM in Penang to Chua “JJ” Jin Jeong. JJ has been instrumental in managing the growth of ESCATEC’s medical business for the last 15 years as Business Unit Manager of ESCATEC Medical Sdn Bhd (“EDM”).
ESCATEC has been in rapid expansion mode over the past two years with the Group making major investments to acquire the latest technologies and capabilities, as well as significantly expanding its international production and design footprint via acquisition and partnerships.
Established in 1984, ESCATEC offers a fully integrated and complete range of electronics and box build manufacturing services, from D&D, prototyping, product certification, to cost-effective mass volume production and after-sales services. The Group’s current portfolio comprises advanced microelectronics and D&D capabilities in Switzerland and a network of modern production facilities in Malaysia, Switzerland, the United Kingdom, Bulgaria, and the Czech Republic. ESCATEC also has a long-standing partnership with Wisconsin-based SMT Corp that provides a base in the North American market.
MORRISVILLE, NC – iNEMI is organizing a series of webinars on issues and challenges related to counterfeit components in the supply chain. The objective is to help industry:
- Understand the issues and challenges counterfeit components pose along the value chain
- Identify key and credible reference sources and standards
- Identify current and potential best practices
- Identify any key gaps that need to be addressed
For additional details: https://www.inemi.org/content.asp?admin=Y&contentid=785
These webinars are open to industry; advance registration is required. See registration links on each of the event pages (listed below). If you are interested in a topic but unable to attend, please register and we will include you on the distribution list for the follow-up email which will include the presentation and a link to the recorded webinar.
Session 1 — Size and Breadth of Counterfeiting Risks
October 19, 2023 / 11:00 a.m. — 12:30 p.m. EDT (US)
https://www.inemi.org/content.asp?admin=Y&contentid=785#counter1
The series kicks off with a discussion about the overall size and breadth of counterfeiting risks facing the global electronics supply chain. This session will provide an overview of some of the ways counterfeit threats can manifest throughout various parts of the end-to-end supply chain and will conclude with a conversation on the unique challenges and perspectives of mitigating counterfeiting risks within the contract manufacturing sector. Speakers: Ben German (Intel), Michelle Lam (IBM) and Charles Woychik (SkyWater Technology Foundry).
Session 2 — Counterfeit Management and Best Practices
November 7, 2023 / 11:00 a.m. — 12:30 p.m. EDT (US)
https://www.inemi.org/content.asp?admin=Y&contentid=785#counter2
The second session focuses on standards that address issues related to counterfeits, such as detection, traceability, mitigation, reporting and more. Speakers: Michael Azarian (University of Maryland), Robert Smith (ERAI), Michael Ford (Aegis Software), plus Paul Hale (NIST) as moderator.
Session 3 — Emerging Trends in Counterfeit Detection and Mitigation
December 7, 2023 / 11:00 a.m. — 12:30 p.m. EDT (US)
https://www.inemi.org/content.asp?admin=Y&contentid=785#counter3
The third session will look at counterfeits in the automotive industry and emerging technologies for detection. We will also review results of an industry survey regarding experiences with counterfeit components and strategies used to mitigate risk. Speakers: Navid Asadi Zanjani (University of Florida), Terry Munson (Foresite) and Ben German (Intel).
If you have any questions or need additional information about this webinar series, please contact Mark Schaffer (marks@inemi.org).
CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Space Coast Expo & Tech Forum taking place on November 1, 2023, at the Melbourne Auditorium in Melbourne, Florida. AIM will highlight their newest halogen-free no clean solder paste, H10.
H10 offers exceptional fine feature printing, improved electrochemical reliability, and powerful wetting in AIM's brand-new halogen-free no clean solder paste. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours.
H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. Fit for automotive, LED and aerospace assemblies, H10 no clean solder paste is robust, stable, and easy to implement.
To discover all of AIM’s products and services, visit the company at the SMTA Space Coast Expo & Tech Forum taking place on November 1, or visit www.aimsolder.com
MILWAUKIE, OR – Since the launch of the first-ever touch control thermal profiler, M.O.L.E.™ EV6, ECD’s new tool has enjoyed wide industry uptake and has recently integrated additional features like Bluetooth® wireless connectivity. The company announced today that during productronica 2023 in Hall A4, Booth 246/3, visitors can experience M.O.L.E. EV6 first-hand, see a preview of soon-to-be-launched profilers, demo OvenSENTINEL™ reflow monitoring technology, and learn more about the scalable RIDER soldering equipment verification portfolio.
“Maximum productivity and expansive data are the keys to process efficiency and product quality,” says ECD Electronics Division Manager, Mark Waterman. “ECD’s objective from its founding has been to deliver on these elements through robust measurement, monitoring, and analysis technologies. As the market has evolved and data acquisition and presentation made more seamless, our product line has followed suit. The ability to view and act on information immediately through M.O.L.E. EV6’s touchscreen visibility and OvenSENTINEL’s real-time reflow monitoring are two examples that have demonstrated measurable improvements in yield, quality, and cost-efficiency. For ECD, this is a journey, and we continue to add features to existing technologies and bring new solutions to the industry. We’re excited to showcase many of these at productronica 2023.”
Expanding on M.O.L.E. EV6’s feature set, ECD has integrated Bluetooth wireless technology to enable remote data acquisition of real-time profile conditions through its M.A.P. software. This Bluetooth capability, ECD’s scalable WaveRIDER™, OvenRIDER™, and SelectiveRIDER™ sensor products, and the company’s OvenSENTINEL reflow soldering continuous monitoring software will be demonstrated throughout the four-day productronica event.
With the M.O.L.E. EV platform exceeding expectations, ECD has accelerated its planned rollout of additions to the EV-generation profiler portfolio. Currently in development, new high channel count tools will offer more flexibility for the demanding process needs of each customer and address market-specific requirements. Visitors to ECD’s productronica exhibit can see a preview of the new technologies, which are set to be commercialized in early 2024.
“Particularly for high-value, high-reliability PCBs destined for mission-critical applications like automotive, aerospace, alternative energy, and high-performance computing, expanded thermal profile data points are required to ensure compliant, fail-safe manufacturing,” says Waterman. “Our newest EV-series M.O.L.E.s will offer this capability, and we look forward to sharing them with the market soon!”
To schedule time with ECD’s technology team at productronica 2023, email mike.hayward@ecd.com. Learn more about ECD’s electronic process control technologies by visiting www.ecd.com
MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is excited to announce an upcoming webinar titled "Cleaning Performance Evaluations and Best Practices for Novel Jettable Pastes for Advanced Packaging and SMT Assembly Process" on October 19th, 2023, at 2:00 PM EST.
This informative webinar will feature Evan Griffith, Product Specialist for Semiconductor at Indium Corporation, discussing the growing trend of solder paste jetting in the electronics manufacturing industry. Mr. Griffith will cover the benefits of solder paste jetting and how it compares to traditional printing methods. At the same time, ZESTRON's Application Engineer, Kalyan Nukala, will discuss an analysis of the cleaning compatibility for both jetting and printing pastes.
The webinar will provide participants with a comprehensive understanding of the entire process, including assembly, cleaning, and visual inspection according to IPC standards. Participants will also learn about the latest innovations in jettable solder pastes and how to optimize cleaning processes for superior performance and reliability. This webinar is necessary for engineers, quality control personnel, and other professionals involved in advanced SMT assembly processes. Participants will have the opportunity to ask questions, receive expert guidance from Mr. Griffith, and gain valuable insights into the latest cleaning technologies and best practices for optimal performance.
Registration is free and available HERE. Don't miss this opportunity to learn from one of the industry's leading experts on advanced SMT assembly processes and jettable solder pastes.
LAKEVILLE, MN – ITW EAE will be showcasing its latest developments at Productronica, November 14-17 in Munich, Germany. The ITW EAE booth will have MPM, Camalot, Electrovert and Vitronics Soltec Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.
MPM will be presenting live demonstrations of the Edison II ACT (Automated Changeover Technology). This patented innovation technology provides a simple, cost-effective solution for factory automation. It is designed to be easy to use and simple to adopt and requires no additional skills to operate. The solution utilizes an Edison printer with an automated changeover of the solder paste cartridges, support tooling, squeegees, and stencils.
Camalot will be demonstrating their Advanced Tilt and Rotate option on the Prodigy dispensing system. This innovative and patented feature reduces wet out areas and improves capillary flow for underfill by accurately dispensing on the side walls of packages. State-of-the-art rotary actuators provide a fast, high precision, zero backlash mechanism that allows proprietary motion and controls allow articulation of the dispense pump in sub-degree increments for both axes as many times as you need, in other words total flexibility.
Electrovert will feature the new Heavy-Duty Conveyor. The Heavy-Duty Finger Conveyor option being introduced by Electrovert is designed to address the increasing demands of PCB production in terms of throughput capability and process flexibility. Electrovert will also feature the patented Auto Exit Wing which provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing.
Vitronics Soltec will feature ZEVA Selective Soldering solutions with the patented Bridge Prevention Technology acts as a hot nitrogen knife to prevent bridging for small pitch up to 1mm (40mil) pin to pin distance even with longer leads and increased drag speed. This design is only feasible with the design freedom of 3D metal printing technology. Vitronics Soltec will also showcase the new Centurion+ Reflow Oven. The Centurion+ is a robust upgrade to the Centurion designed for heavy solder paste users with unique features that further minimize maintenance and keep the process chamber cleaner.
ITW EAE will also share advancements they have made on interface solutions for Industry 4.0/MES that will lead to improvements in yield, data collection and overall equipment effectiveness.
