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PENANG, MALAYSIA — X-ray Inspection (AXI) equipment has become increasingly prominent in the circuit board industry with the emergence of intelligent terminal equipment and intelligent automotive electronic products. Electronic components are developing towards miniaturisation, refinement, and complexity. Therefore, manufacturers use AXI equipment for their production inspections to ensure reliable detection ability to pursue high product yields with high-quality final products.

To address these needs, ViTrox’s V810i Advanced 3D X-Ray Inspection (AXI) solution provides full board test coverage with the latest vision technologies and advanced inspection capabilities for accomplishing the testing of hidden joints on printed circuit boards within the required inline cycle time. With the V810i AXI solution, manufacturers can optimise production throughput and enjoy speedy and precise inspection capabilities.

Our smart V810i AXI solution offers world-class board inspection capabilities and Industry 4.0- compliant software for quality-assured inspection results. The V810i AXI solution provides full board test coverage with the latest vision technologies and advanced inspection capabilities for accomplishing the testing of hidden joints on printed circuit boards within the required inline cycle time. Besides, it is capable of handling the largest and heaviest PCB (size up to 52"x52" and weighing up to 25kg) in the market.

The latest V810i Series 3 (S3) AXI comes with a new ergonomic outlook that saves space capacity for users. By embedding its RRS Server (3DCT) and Supermicro (System Server) in the machine while eliminating the location of the external servers at the system’s exterior, the new design allows users to easily incorporate the solution into production lines while saving up more floor space. Additionally, equipped with an in-house developed Algebraic Reconstruction Technique (ART) with a model of sharp geometric 3D computed tomography, the V810i S3 AXI simplifies the process of performing accurate defect failure analysis results for further improvement.

    The V810i AXI solution is equipped with a powerful test algorithm that provides automated and full-board 100% test coverage for PCB assemblies, hidden joint-related components, and more:
  • Integrated power electronic components (i.e. IGBT) for high-power applications,
  • Discrete components (i.e. transistor, resistor, capacitor),
  • Connectors (i.e. SMT connector, variable height BGA connector, etc),
  • RNet, SMT Connector, Gullwing,
  • BGA (collapsible, non-collapsible, etc)
  • PTH, Single Pad,
  • Backdrill, and many more.

Furthermore, the V810i AXI solution integrates artificial intelligence (A.I.) capabilities to expand the opportunity for AXI inspection, enabling our unique A.I. inspection model to detect defects/abnormalities of specific joint types and further improve the inspection accuracy for both challenging and common pads, including pads consisting of multiple grayscales or unique profiles and characteristics.

JENA, GERMANY — GOEPEL electronic extends its strategic partnership program GATE (GOEPEL Associated Technical Experts) by adding OiTec, finnish expert in electronics testing, as a new member. Focus of the cooperation is on the development and practical implementation of new solutions, products and modules based on JTAG/Boundary Scan instrumentation as well as enhancements in the local support. Furthermore, an important component of the partnership is the integration of GOEPEL electronic’s JTAG/Boundary Scan hardware and software components into OiTec’ systems.

“The cooperation with OiTec has added another highly specialized technology enterprise into our GATE program”, says Frank Amm, Corporate GATE Program Manager with GOEPEL electronic. “Our new cooperation meets the needs of our customers to provide them with access to the latest options for Embedded JTAG Solutions, complete with extensive application support. By OiTec’ excellent know how and long-term experience we find us optimally positioned in this segment in the future.”

“At OiTec, we are constantly trying to expand our range of services. Through our service expansion in the area of test development and through the partnership with GOEPEL electronic, we can offer our customers even more efficient solutions”, says Pekka Oinonen, CEO at OiTec. “The Embedded System Access (ESA)-based technologies of GOEPEL electronic enable us to design future test solutions even more economically, and to offer even better fault diagnosis “, he adds.

“We are very happy to welcome OiTec Oy as new member of the Nordic/Baltic GOEPEL GATE Partner team” says Lars Kongsted-Jensen, Director, at GOEPEL electronic distributor EP-TEQ. “With their broad experience in both functional test, advanced adaptors and fixtures as well as GOPEL Embedded JTAG Solutions for, they are a true asset for our joint applications team”.

TOKYO– Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting its latest high-speed, premium accuracy in-line inspection solutions at the 37th NEPCON JAPAN in Tokyo, Japan. From January 25 - 27, visitors are invited to chat with the Saki team on Booth #15-1, East Hall 2, where Saki’s industry-leading inspection machines will be available for hands-on demonstrations. Booth highlights will include Saki’s 3D automated optical inspection equipment (3D-AOI) equipped with the latest optional functions and Saki’s innovative X-ray inspection solution (3D-AXI) that enables high-speed, high-precision in-line inspection for high-density mounting boards and ultra-small parts.

Saki’s booth will feature three 3D inspection machines, allowing booth visitors to experience the solutions up-close and gain an in-depth understanding of their performance directly from the Saki technical team at the show:

< New 3D-AOI >

3Di-LS3 and 3Di-MS3 – From Saki's new 3D-AOI 3Di series lineup, the 3Di-LS3 and 3Di-MS3 will be exhibited. The new 3Di series enables high-speed and high-performance inspection while achieving both high resolution and expanded height measurement with an upgraded high-resolution camera system. It offers a wide variety of features that can be selected according to the customer's production environment and product requirements. These optional functions enhance scalability and contribute to greater quality assurance and improved productivity. Equipped with an 8μm high-resolution camera system, the 3Di-LS3 supports assembly inspection of SMT-mounted parts, including extremely small and tall parts, with the industry's fastest cycle time. The 3Di-MS3 has a compact design suitable for medium size board inspection. It will be introduced at NEPCON JAPAN on the Saki booth together with the latest options that permit on-site upgrades.

< 3D-AXI >

3Xi-M110 – with Saki’s optimized Planar CT software, developed in-house for incredible cycle-time improvements, this compact and lightweight 3D-AXI system provides impressive quality assurance with highly accurate void measurement and detection for both PCBs and components. It contributes to quality assurance with high-precision inspection by capturing solder joint defects and minute shape deformities in high-density circuit boards and components. Visitors to the Saki booth will personally witness the significant inspection speed enhancements the 3Xi-M110 provides, as well as being among the first to glimpse the exciting improvements of the latest M110 model.

Ken Katsumi, Chief Sales Manager of Saki's Sales Headquarter, said "Saki's high-quality in-line inspection technology, which realizes advanced automatic 100% inspection, is the perfect choice for customers who seek highest reliability, including those in the automotive industry. We will introduce the latest solutions that meet the quality requirements that our clients demand. We are looking forward to your visit."

For more information about Saki visit www.sakicorp.com/en/

JENA, GERMANY — GÖPEL electronic intensifies its work on smart factory solutions and networked electronics manufacturing. The inspection systems (AOI-AXI-SPI) now have been added to the IPC-CFX-2591 Qualified Products List. IPC-CFX (Connected Factory Exchange) is an IIoT technology standard for the assembly industry and basis for Industry 4.0 and Smart-Digital-Factory Solutions in order to optimize production processes.

With IPC-CFX, the GÖPEL electronic inspection solutions now have a unique interface for the acquisition of all operating data. The AOI, AXI and SPI systems thus can be integrated into manufacturing execution systems via IPC-CFX. Specifically, the inspection systems for checking the solder paste, the solder joints and the component placement are networked with each other and communicate with other machines in the entire electronics production line. Not only is the final quality of the produced electronic assemblies themselves becoming more and more important, but the quality of the manufacturing processes is also becoming more and more demanding.

IPC-CFX is a plug-and-play, industry-developed solution that simplifies and standardizes machine-to- machine communication while also facilitating machine-to-business and business-to-machine applications, forming the foundation for Factory of the Future applications. IPC-CFX is supported by IPC-2591, Connected Factory Exchange (CFX), which sets IPC-CFX message requirements by equipment type. Successful utilization of IPC-CFX on the shop floor requires confidence and trust that equipment has been qualified to IPC-CFX by an independent third party. The IPC-CFX-2591 QPL provides electronics manufacturers and OEMs assurance that the equipment they are buying meets their IPC-CFX implementation plans.

GÖPEL electronic develops and manufactures innovative electrical and optical measuring and testing technology as well as test and inspection systems for electronic components, assembled printed circuit boards as well as industrial electronics and automotive electronic systems. GOEPEL electronic is divided into four business units:

  • Automotive Test Solutions
  • Embedded JTAG Solutions
  • Industrial Function Test
  • Inspection Solutions AOI-AXI-SPI-IVS

and is active worldwide with its own subsidiaries and distributors.

The company generated sales of approximately 40 million euros in 2022 with about 230 employees.

Further information: www.goepel.com

INDIANAPOLIS – Specialty Coating Systems’ (SCS) Indianapolis coating facility has achieved Nadcap ® accreditation for conformal coating of electronics – printed board assemblies, demonstrating their continued commitment to quality.

The Nadcap audit, conducted by industry experts, is a rigorous technical assessment and demands the highest standards of critical process control and validation. SCS Indianapolis achieved the elite Nadcap accreditation as a result of the company’s efforts and investment in meeting stringent industry and customer requirements.

“SCS is dedicated to offering our customers world-class coating services and technologies, and our recent Nadcap accreditation is in line with our strategic initiatives to ensure industry standards and customer needs are met,” said President and CEO Tim Bender. “I am extremely proud of our Indianapolis coating center and their dedication to achieve this goal as well as our global teams who are all committed to ensuring the highest quality standards are met at SCS.”

Created in 1990 by SAE International, Nadcap is an unprecedented, industry-managed supply chain oversight program that improves quality, while reducing costs, by assessing process capability for compliance to industry standards and customer requirements. Nadcap is administered by the not-for- profit Performance Review Institute® (PRI), a global provider of customer-focused solutions designed to improve processes and product quality.

For more information about SCS, our conformal coating solutions and services, or our commitment to quality, please visit www.scscoatings.com.

TOKYO — Test Research, Inc. (TRI), the leading Test and Inspection systems provider for the electronics manufacturing industry, will join NEPCON Japan 2023, held at Tokyo Big Sight from January 25 – 27, 2023, to showcase state-of-the-art Test and Inspection Solutions for the Smart Factory. Visit booth #14-38 to experience the latest test and inspection innovations for the PCBA Industry. TRI welcomes you to join us at NEPCON Japan to learn how TRI's AI algorithms and metrology help boost your production intelligence.

TRI will showcase the newly released high-speed multi-angle 3D AOI, TR7500QE Plus, equipped with four 20MP side cameras and 1 top high-resolution camera. Also, TRI will unveil the 3D AOI TR7700QM SII for high-reliability industries with superior specifications of a 25MP camera, 2.5 um high- resolution, AI-Powered, and Metrology Ready.

Also presenting at NEPCON Japan will be the 3D SPI TR7007QI and the world-class High-Speed 3D CT AXI TR7600 SIII for multiple industry applications. The most compact ICT in the market, TR5001T SII Tiny, will be showcased. The AI solutions from TRI include AI Smart Programming, AI Repair Station, and more. TRI's test and inspection solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX. Join us at NEPCON Japan 2023 booth #14-38 to discover why the leading EMS companies choose TRI as their Test and Inspection Partner.

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