Press Releases
TOKYO – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting for the first time at Smart SMT & PCB Assembly 2023 to be held from April 5 to 7, 2023 in Suwon, Korea. Saki’s latest automated inspection solutions for SMT processes that contribute to the realization of Smart Factories will be exhibited on Booth #I 102.
Show visitors will be invited to discover the latest 3D-AOI and 3D-AXI inspection solutions including the 3Xi-M110 V3 ultra-high-speed X-ray automated inspection system (AXI) that enables in-line operation, and the award-winning 3Di-LS3 3D automated optical inspection system (AOI) with 8µm resolution that achieves the fastest cycle time in the industry.
Alongside its partners JS TECH and H&J Corporation, the Saki technology team will also present a 2D-AOI benchtop model BF-Sirius. To demonstrate its Full SMT Line, Smart Factory and M2M capabilities, Saki’s QD-Analyzer Software Suite completes the show line-up.
Saki’s booth will allow visitors to experience the company’s latest hard- and software innovations up-close, including：
3Xi-M110 V3
True-Inline Operation with the high-speed 3D-CT X-ray Inspection System
3Di-LS3 (with 8μm resolution camera system)
Revolutionary 3D-AOI for the industry's fastest, highest-performance inspection and easy on-site upgrades and interchangeability
3Di-LS2 (with 18μm resolution camera system)
High-speed 3D-AOI with a height measurement range of 20mm and an imaging speed of 5,700 mm2/s for improved productivity
BF-Sirius
Benchtop 2D-AOI for L-size substrates
QD Analyzer
The SPC software suite offers a data-driven approach to continuous productivity improvement by collecting and statistically analyzing the operating status and inspection results of all equipment in the production line.
"We are very pleased to be exhibiting at Smart SMT & PCB Assembly for the first time and introducing Saki's latest solutions for SMT processes to our customers in Korea and around the world,” said Mr. Kim Kyu Seob, General Manager of Saki Corporation Korea Representative Office. “Visitors to Saki's booth will be able to see our latest technology that contributes to the realization of Smart Factories through in-line automated inspection. We look forward to welcoming show visitors to our booth."
For more information about Saki visit www.sakicorp.com/en/
CLINTON, NY – Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch is set to present as part of the upcoming IMAPS Spring Seminar, March 23, in Ilmenau, Germany. The 2023 Spring Seminar will focus on sustainability in electronics production.
Andreas’ presentation will address energy efficiency in reflow soldering processes enabled by a new, low-temperature composite alloy. Additionally, he will cover its desirable mechanical properties also confirmed in multiple verticals.
Andreas provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. Products include solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Andreas is an ECQA-certified integrated design engineer and earned his Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforce Indium Corporation’s commitment to providing world-class service to our customers in Europe.
MADISON, AL – STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototype development and contract PCB assembly, announces Randy Baumgarden’s 35-year anniversary.
Baumgarden’s anniversary was celebrated with a cake shared with all of his colleagues at STI. David Raby, President/CEO, presented him with a certificate in appreciation of his 35 years and a monetary bonus for his dedicated service.
Baumgarden is responsible for procurement for the manufacturing operations of the Engineering Services Division.
“Randy’s loyalty and willingness to take on different tasks has been demonstrated many times over the last 35 years,” said David Raby, President/CEO. “Randy is the only employee (without the Raby name) to have achieved this significant milestone and we are honored to recognize this fact.”
CLINTON, NY – Indium Corporation’s Brian O’Leary, global head of e-Mobility and infrastructure, will present at EV Charging Infrastructure USA 2023. The event, which will take place March 29–30 in Anaheim, CA, is the only event of its kind to deliver leading market intelligence and industry presentations on the latest EV charging infrastructure projects to support the expansion of electric vehicles.
O’Leary’s presentation, scheduled for 11:40 a.m.–12:05 p.m. on March 29, is titled U.S. Charging 2.0: Building a More Reliable Public Infrastructure. The presentation will address the main issues causing the current 70–80% of public uptime performance for EV chargers, while defining what 97% uptime performance means. O’Leary will also review best practices for building a more reliable public charging infrastructure.
O’Leary is responsible for promoting Indium Corporation’s full range of products and services for e-Mobility, which includes electric cars, trucks, eVTOLs, charging stations, and battery energy storage systems. He joined Indium Corporation in 2014 and has more than 20 years of experience in the electronics industry. He authored two books on electronics manufacturing and currently serves as the chair of the IPC e-Mobility Quality & Reliability Advisory Council. In addition to regular technical conference participation, O'Leary co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption and a high-profile industry stakeholder as a guest. In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape.
NEUSS, GERMANY – Yamaha Motor Robotics SMT Section is bringing its 1 STOP SMART SOLUTION to SMTconnect 2023 in Nuremberg, May 9-11, with innovations to ease program generation, cut cycle time, and accelerate product changes.
Promoting its collaboration with ANS-ANSWER ELEKTRONIK, the appointed regional distributor for Germany, Yamaha will be at booth 245, hall 4. The presentation showcases the YSP10 printer, YSi-SP solder-paste inspection system, YRM20 mounter, and YRi-V Automatic Optical Inspection (AOI) system. A special software area will highlight YSUP tools for machine control, smart factory management, and AOI programming.
“SMTconnect is a valuable opportunity to make new connections and strenghten our bonds with existing customers and contacts,” said Daisuke Yoshihara, Sales General Manager at Yamaha Motor Europe, Robotics Division. “We’re pleased to extend cooperation with our distributor by sharing space this year. As always, our experts will be there to help visitors discover how Yamaha’s solutions save labour, raise quality, and increase productivity.”
The YSP10 printer combines Yamaha’s proven technologies for superior accuracy with advanced features including the fully automated stencil mechanism for faster, easier product changeovers. The YRM20 is Yamaha’s latest-generation high- speed mounter, with up to 115,000 cph placement speed, dual-head capability, and automated features for non-stop changeovers. The YRi-V inspection system handles modern, densely populated boards, with enhanced lighting, 4D camera algorithms to spot hard-to-find defects, and high-speed image processing, for superior speed and accuracy.
In the software area, visitors can see how Yamaha’s YSUP tools maximise the value of the 1 STOP SMART SOLUTION. Powerful features include the state-of- the-art 3D graphical interface and the richly featured dashboard for tracking equipment status and process performance. Yamaha’s advanced AOI software generates inspection programs automatically and leverages AI to simplify component recognition and enhance image analysis.
For more information, please visit the website at https://smt.yamaha-motor-im.de/
REDMOND, WA – Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for microcontrollers, security ICs and memory devices, and Nuvoton Technology Corporation Japan partner to enable security deployment services for Nuvoton’s M2354 Series-based IoT Security Microcontroller (MCU) series using Data I/O’s SentriX® security deployment platform. The collaboration enables OEMs designing solutions such as building automation, metering, medical and many other applications with high-security requirements to simplify the deployment of IoT security using Data I/O’s SentriX Product Creator TM software tool.
New connected device-based revenue models require trusted data and trusted devices to enable data-driven services and to protect physical systems. Protecting and securing device firmware and data requires robust hardware-based security. Traditionally, defining provisioning and deploying IoT device security in mass production has been complex and required disparate tools and processes. The SentriX Product Creator tool simplifies IoT security by delivering pre- configured security deployment profiles for the most popular IoT use cases such as device identity, cloud onboarding, secure boot, firmware encryption, mutual authentication and more. The SentriX Product Creator pre-configured profiles present the most popular security features of the M2354 Series. Nuvoton’s M2354 Series inherits the security features of the M2351 Series that have PSA Certified Level 1, Level 2, and PSA Functional API Certified. The M2354 Series is an Arm® Cortex®-M23 based IoT Security MCU that leverages Armv8-M TrustZone hardware-enforced isolation. Nuvoton and Data I/O are partnering to enable security deployment services starting with Nuvoton M2354 Series support. With SentriX support, OEMs can leverage M2354 Series and quickly and cost-effectively deploy the security capabilities through robust provisioning in mass production. The predefined use cases streamline the security product definition process for OEMs by presenting the most common security use cases for connected device security in an intuitive user interface.
“As new services and applications for IoT markets expand, OEMs require a simplified process to define and deploy hardware-based security into their products during manufacturing. We are excited to collaborate with Nuvoton to support the M2354 Series on the SentriX platform,” said Michael Tidwell, vice president of marketing and business development at Data I/O Corporation. “The SentriX security deployment platform enables OEMs to easily define security profiles and provision M2354 Series at the chip level before the device goes to the manufacturing line for board assembly. Because the SentriX platform is scalable and is supported globally through SentriX service provider partners, OEMs with low or high volume can cost-effectively deploy robust IoT security in their products.”
“The M2354 Series is designed to support high-security requirements that are essential for even the most demanding IoT solutions,” said Tomohiro Shimo, vice president at Nuvoton Technology Corporation Japan. “Our collaboration with Data I/O enables our customers to leverage the extensive security features of the M2354 Series. SentriX Product Creator enables our OEM customers to define and build hardware-based security into their products more easily and in less time.”
SentriX GO pre-defined use cases through the SentriX Product Creator tool will be made available for M2354 Series through SentriX Service providers globally by the third quarter 2023. Data I/O and Nuvoton plan to collaborate and announce support on SentriX Product Creator with pre-defined use cases on additional devices in the future.
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