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HARROGATE, UK ―  Robotas Technologies Ltd., a pioneer of THT component placement and clinching systems, today announced plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will demonstrate its full line up of smart production technology including the Mascot Clinch SMEMA Conveyor system, Board Handling, Intelligent Carousels and Dynamic Pick to Light (DPL) for Component Storage, and more in Booth #1100.

Robotas’ Mascot conveyor workstation automates and streamlines PCB assembly via its laser guided component placement and visual work instructions. Mascot systems are ESD safe, electronically height adjustable and provide parts storage via carousel and DPL arrays. Storage is mounted on articulated arms for enhanced ergonomics. Mascot guides the operator through the complete build process, improving product quality, increasing throughput and virtually eliminating set up time and rework.

If you are familiar with the aging Contact Systems Clinch Technology, then a show highlight will be the Mascot Flowline Clinch system with IPC CFX compliance. It offers an enhanced replacement for the CS400, CS600, CS900 family of products.

Robotas’ Mascot Software allows users to easily create, edit and sequence assembly programs from existing Contacts Systems Data, PCB CAD or Gerber data which can all be produced offline without needing to access the hardware.

Partnering with Robotas, Swiss manufacturer Polyver will also be presenting their high-precision lead-forming and cutting systems. They deliver a 0.1mm accuracy in the forming and cutting of axial and radial components for THT Assembly.

The ultimate goal for Robotas Technologies is to deliver smart technology into the hands of production staff. The team work with their customers to organize and optimize factory-wide manual assembly processes. Robotas delivers a total end-to-end solution for hand assembly. To learn more, please visit www.robotas.com

PLYMOUTH, WI — Kurtz Ersa Inc., a leading supplier of electronics production equipment, will exhibit in Booth #1301 at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. Ersa will give customers in depth and personalized equipment demonstrations for wave soldering, reflow soldering, selective soldering, rework equipment, hand soldering, additive manufacturing, I4.0 connectivity and more. The company will highlight the i-CON Trace soldering station , VERSAFLOW ONE selective solder system , EXOS 10/26 reflow soldering system with vacuum , HR550 XL with auto scavenging and ALPHA 140.

Ersa's award winning i-CON TRACE, the world´s first IoT soldering station that enables seamless traceability during manual soldering. With integrated WLAN, Bluetooth and network card on board, the i- CON TRACE already offers 100 % connectivity in digitally networked manufacturing processes when delivered. The possible MES connection allows the integration and storage of soldering parameters used in complex, networked manufacturing processes that already run via an MES. The i-CON TRACE impresses with maximum performance and minimum operating costs. With 150 watts of power, it heats up quickly, reheats even faster and can be controlled extremely precisely.

The Ersa VERSAFLOW ONE now complements the Ersa range of inline selective soldering machines as an entry-level model. It incorporates decades of know- how in the form of proven hardware and intuitive software (ERSASOFT 5). Set up, switch on, solder – optimal selective soldering could not be faster or easier. With the highest demands on quality, throughput and ease of maintenance. In addition, the VERSAFLOW ONE scores with the highest availability world-wide and a delivery time of about two to four weeks.

The HR 550 XL features a 1,800 W high-performance hybrid heating element that can be used to desolder and solder SMT components up to the size of 70 x 70 mm. The 6,400 W infrared bottom heater with eight zones ensures homogeneous heating of the entire assembly. The hybrid rework system is for all users who place the highest demands on precision and safety when reworking large assemblies.

For more information about Kurtz Ersa Inc., visit www.ersa.com

REDONDO BEACH, CA ― Surfx Technologies, LLC, the most trusted name in atmospheric plasma, will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The STA-10iL Automated Plasma Machine will be on display in Booth #1235.

Surfx argon plasma systems clean and activate a wide variety of material surfaces, including glass, ceramics, polymers, semiconductors and metals. Cleaning and activating the material surfaces prior to bonding is key to achieving defect-free manufacturing. Surfx’s automated, in-line plasma systems are designed for this application. Whether for gluing, soldering, printing or coating, in-line plasma cleaning will increase yield on the factory floor and reduce defects in the field for years to come.

The STA-10iL features a three-axis gantry that selectively applies the most advanced atmospheric plasma to substrates. Surfx’s Atomflo™ controller operates with low voltage, radio frequency (RF) power, and generates a uniform, particle free and electrically neutral plasma that is safe on the most sensitive electronics. Surfx Technologies’ versatile conveyor design allows for rapid surface preparation of electronics, including all types of IC packages.

Surfx’s STA-10iL Automated Plasma Machine offers a slim footprint, fast lead times and flexible configurations, leaving no excuse to skip plasma surface preparation for critical processes. The system can be easily configured for any job with a working volume of 550 x 760 x 60 mm.

Save money and improve quality with turnkey systems configured for your application. For more information, visit www.surfxtechnologies.com

SARASOTA, FL – WPI Vision, a division of World Precision Instruments, today announced plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will showcase its 3D SPECTASCOPE Enhanced Reality Microscope in Booth #3315.

The new 3D SPECTASCOPE brings a new dimension of accuracy and speed to electronic assembly and inspection throughout the PCBA Industry. With a range of new patent-pending technologies, 3D SPECTASCOPE sets a new precedent for workstation throughput.

Moving away from the traditional models of using multiple microscopes, the state-of-the-art 3D SpectaSCOPE is a fully digital, three-dimensional viewer. It offers a variable working distance, wide panning, large depth of field and self- focusing zoom to help decrease time spent in the assembly and inspection process and increase the accuracy of your circuit board assembly.

For the first time, the 3D SPECTASCOPE has increased return on investment (ROI) by solving some of the problems in the PCBA process. With patent-pending technology and intuitive copyrighted software, the 3D SpectaSCOPE inspection microscope utilizes enhanced reality screen technology with high resolution cameras.

The ergonomic 3D inspection microscope features an incredible working distance of 300 mm, automatic self-focusing, integrated image capture and true 3-dimensional viewing. The 3D SpectaSCOPE lets users increase throughput while achieving greater accuracy at the highest detail. The 3D SpectaSCOPE is optimal for rework, through-hole assembly and inspections, and it is available in multiple configurations.

Reduce time and errors and increase ROI by adding the 3D SpectaSCOPE into your inspection process. Available with a free 14-day try before you buy, 3D SPECTASCOPE can be tested out to prove its effectiveness on your inspection bench. For more information, visit www.wpiinc.com/vision

PALO ALTO, CA — Arch® Systems, the leading provider of machine data and analytics for electronics assembly operations, will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will showcase the ArchFX Platform and the Production Insights Suite in Booth #3123.

At the show, Arch will provide demonstrations of the ArchFX Platform, including the ArchFX Production Insights Suite, for which Arch won multiple awards this year, including the 2022 Global Technology award for Best Product - North America. This smart suite of analytics highlights some of the common, and yet surprisingly often undiscovered, areas of valuable production losses for manufacturers. These insights are providing millions of dollars in ROI for manufacturing customers and are fundamentally changing the way manufacturers look at their data. The platform also includes ArchFX Global KPIs, React downtime tracking and OEE, and the Action Management System, a smart alerting and resolution system for manufacturers.

The ArchFX Platform combines direct-to-machine connectors, globally scalable data brokers, cloud-based analytics, and action monitoring capabilities for an end-to-end solution that achieves record speed from project conception to analytics-driven actions. Millions of data points from all over the globe are sent every hour through ArchFX’s advanced AI/ML technologies. With the largest library of SMT machine connectors in the world, Arch FX extracts and processes data in just days and weeks, not years, all without disrupting existing operations.

Arch has built the largest collaboration of industry domain experts working hand-in-hand with data scientists to constantly map new signals from the noisy data, adding them to the ever-growing library of actionable insights. These insights are changing how manufacturers tackle their most complex problems, allowing them to simplify and align actions both on the shop floor and the top floor. Arch is also a recipient of a 2022 Mexico Technology Award, and a 2022 SMT China Vision Award. The ArchFX Platform provides the machine connectivity, data management, and advanced insights needed to achieve digital transformation across the manufacturing organization. For more information, visit archsys.io or follow us on LinkedIn or Twitter.

MINNEAPOLIS, MN — SMTA announced that the program is finalized for the 27th Annual Pan Pacific Microelectronics Symposium. The event will take place from January 30 to February 1, 2023 at the Sheraton Kauai Resort on Kauai, Hawaii. The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.

In addition to several inspiring keynotes, this program features ground-breaking research from global experts on Advanced Packaging, Advanced Processing, Advanced Materials, Business Strategies, Reliability and more.

On the afternoon of Monday, January 30, a plenary session will kick off the event followed by a Keynote presentation by Eric R. Fossum, Ph.D., Dartmouth College, titled “Cultivating a Culture of Innovation Should be Easy in a University, Right?”

On Tuesday, January 31, Dan Feliciano, OpEx 90, will deliver the keynote lunch talk on “Benford's Law: Helping to Minimize Financial Fraud, Among Other Things.”

On Wednesday, February 1, Rolf Aschenbrenner, Fraunhofer Institute for Reliability and Microintegration, will give the lunch keynote on “Advanced Packaging Technologies - Key Enablers for Electronic Systems.”

To conclude the symposium, Shintaro Yamamichi, IBM Japan, will provide his keynote presentation about “Neural Networks and Quantum Computing.”

View the complete program and register at: https://www.smta.org/panpac. Promotional packages are available for companies wishing to gain exposure for their products and services. Please contact Karlie Severinson, karlie@smta.org or +1-952-920-7682, with questions.

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