CLINTON, NY — Indium Corporation will share a variety of presentations on insightful topics ranging from artificial intelligence, the capabilities of gallium, advanced materials, and more, at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 30-Feb. 2, Kauai, Hawaii, U.S.

Monday, Jan. 30

• The Twin Paradox Explained by Senior Technologist Dr. Ronald Lasky

Tuesday, Jan. 31

• AI and Intelligent Transportation: Perception Versus Reality by Lasky

Wednesday, Feb. 1

• Experimental Analysis of the Effect of Void Area, Void Morphology, and Alloy Composition on the Total Thermal Resistance (Rth) of a Soldered Thermal Interface by Technical Support Engineer Ryan Mayberry
• Gallium: A Versatile Metal with Many Possible Applications by Lasky

Dr. Ronald Lasky is a Senior Technologist at Indium Corporation, as well as a Professor of Engineering at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Dr. Lasky has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, and has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Association’s (SMTA) Technical Distinction Award in 2021 for his “significant and continuing technical contributions to the SMTA.” He was also awarded SMTA’s Founder’s Award in 2003. Dr. Lasky holds four degrees, including a Ph.D. from Cornell University in materials science, and is a licensed professional engineer.

Ryan Mayberry is a Technical Support Engineer based at Indium Corporation’s global headquarters in Clinton, N.Y. He is responsible for providing technical assistance to resolve soldering process-related issues. This includes assisting customers with optimizing their use of Indium Corporation’s soldering materials, as well as providing product and process training to current and potential customers. Prior to joining Indium Corporation in 2021, Mayberry was an R&D scientist for a global metallization paste business, where he developed novel glass and paste metallization compositions tailored for emerging technologies. Mayberry holds a bachelor’s degree in materials science and engineering from Rutgers University, N.J. He is a Certified SMT Process Engineer (CSMTPE) and is certified as a Lean Six Sigma Green Belt.

BANNOCKBURN, IL — IPC recently convened a roundtable of electronics executives to discuss trends driving the industry’s migration to the factory of the future. The executives came to a shared conclusion that the transition to the factory of the future features many challenges and pitfalls but making the transition will be increasingly critical to any company seeking to compete in the global economy. A summary of the discussion is now available: “The Evolution of Factories of the Future: What You Need to Know.”

In reaching their conclusion, the roundtable participants discussed common barriers in adopting smart manufacturing technologies and skill disparities in the electronics manufacturing workforce. They also shared practices they believed to be important as companies work to increase digitization and enhance manufacturing operations. Among other topics, company leaders talked about creating a workplace culture that embraces change and innovation.

“Executives agreed that despite the challenges in transitioning to the factory of the future, they have recognized the value in doing so and are now looking to integrate solutions that will deliver measurable benefits to their company,” said Matt Kelly, IPC chief technologist.

To view report, visit www.ipc.org/F2report. IPC offers additional resources to assist and guide the electronics manufacturing industry through the next industrial revolution. For more information, visit www.ipc.org/solutions/ipc-factory-future or www.ipc.org/advocacy/industry-intelligence

SAN FRANCISCO — Tempo Automation Holdings, Inc. (Nasdaq: TMPO) (“Tempo Automation” or “Tempo”) announced today that Blur Product Development (“Blur”), a leading medical device design and development partner, has elected to leverage Tempo’s Accelerated Electronics Manufacturing Platform to speed up product development timelines for its clients.

Recognizing that delays can result in significant costs to their clients as a result of extra work and delayed or lost revenues, the team at Blur has opted to rely on Tempo’s first-time-right printed circuit board assemblies (“PCBAs”). The Tempo platform supports Blur’s acceleration efforts through prototyping and into production, ultimately bringing clients’ projects to market more quickly.

Blur recently ran the same 50-board project through both Tempo and another PCBA vendor that promised quick turn times. While both manufacturers were able to deliver boards quickly, Tempo’s quality stood out.

“With the other vendor, who was lower priced, we had almost 50% fallout on 50 circuit boards,” said Jeff Rosino, Partner at Blur. “We had 0% fallout when running the same order through Tempo.”

With exceptionally high acceptance rates and fast shipments, it is an easy decision to continue to partner with Tempo. “Tempo’s quality paired with speed blows us away,” said Rosino.

Additionally, Blur looks for flexibility in its partners, which comes down to the ability to make changes quickly. “We value Tempo’s ability to adapt purchase orders to meet changing needs, especially given current component availability constraints,” said Rosino.

Joy Weiss, CEO of Tempo Automation, said, “Tempo has focused its manufacturing platform to serve the unique needs of early stage electronic product development. Like Blur, our goal is to help get our customers’ products to market as quickly as possible.”

OSAKA — Nihon Superior Co. Ltd., a supplier of advanced joining materials, is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.

Nihon Superior’s TempSave™ series of low temperature soldering materials has been designed to address the industry’s goals of reduced peak reflow temperature to reduce defects contributing to package warpage, reduce energy consumption during the reflow process, and avoid potential damage to temperature sensitive devices. TempSave B58 is a eutectic SnBi alloy with a melting point of 139°C while TempSave B37 is a ductile hypoeutectic SnBi alloy and does not contain Ag.

High bismuth containing alloys are known to be brittle and therefore poor in drop shock performance. However, TempSave B37 has outstanding drop performance, even dramatically outperforming SAC305. The halogen-free P610 flux medium is specifically designed for Bi alloys. The TempSave B37 P610 solder paste can be reflowed with a peak temperature of 190°C. Additionally, a high speed jetting paste version is available, TempSave B37 P611 which provides consistent dot sizes.

LF-C2 P608 is a completely halogen free, lead-free, low voiding solder paste. The demand of the automotive industry for solder alloys that deliver long life in conditions of extreme thermal cycling has resulted in the development of alloys that are very hard. While these hard alloys are resistant to the plastic deformation that drives failure in thermal cycling, the trade-off is that their hardness means that they have a tendency to crack when exposed to the other stresses to which automotive electronics is subjected in service. Nihon Superior’s LF-C2 strikes a balance between these two requirements, delivering long life in thermal cycling but with a compliance that means that it is resistant to cracking under other loading conditions. With a liquidus temperature of 213°C it can be reflowed at a lower temperature than SAC305.

SN100CV ® P608 is a completely halogen free, lead-free, no-clean solder paste. Unlike silver- containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag 3 Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. Although silver-free, in tensile tests the SN100CV alloy matches the strength of SAC305.

The P608 flux medium provides wetting comparable with that of halogen containing paste even though it is completely halogen-free. SN100CV P608 and LF-C2 P608 both deliver excellent performance over a wide range of component types and process parameters.

Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new alloys, solder pastes and lead-free products, please visit us at www.nihonsuperior.co.jp/english