CLINTON, NY – Advanced materials innovator Indium Corporation today announced they have joined the American Semiconductor Innovation Coalition (ASIC). ASIC recently expanded its membership to include representatives from all stages of the chip fabrication supply chain, including packaging (interconnection and protection of the semiconductor chip). Indium Corporation will be joining fellow technology innovators focused on advancing U.S. leadership in the research and development of semiconductor technology.

ASIC is a coalition of more than 170 organizations developing a proposal to utilize CHIPS and Science Act funding to serve as the main technical driver for the National Semiconductor Technology Center (NSTC) and the National Advanced Packaging Manufacturing Program (NAPMP). ASIC supports the research, development, prototyping, and manufacturing transfer goals of the NSTC and NAPMP and is developing strategies to ensure they are met.

“Indium Corporation is proud to join ASIC, and its members, in the pursuit of strengthening U.S. technology leadership and expanding domestic semiconductor production and packaging capabilities,” said Ross Berntson, COO and President of Indium Corporation. “ASIC’s work to create technology hubs and develop U.S. supply chains and production for our future economic prosperity aligns perfectly with our goals. Continued development of our technology alongside industry leaders in co-materials, tools, and manufacturing will help strengthen America’s leadership in technology supply chains, increase production, and grow jobs in the U.S.”

Founded in 1934 in upstate New York, Indium Corporation has a nearly 90-year history of materials innovation in electronics assembly, thermal interface materials, high-purity and ultrahigh purity metals, metal salts, and oxides used in a wide variety of electronics applications. It also has strong current and expanding capabilities in materials sustainability. Together with ASIC, Indium Corporation seeks to support advancements in both wafer fabrication and packaging in the U.S.

By joining ASIC’s growing membership of companies, universities, startups, and nonprofits, Indium Corporation will have access to both high-volume wafer fabs through NSTC, and packaging prototyping lines through the Centers of Excellence under development by NAPMP. Through co-development of materials and their associated cutting-edge usages in advanced applications, Indium Corporation will be able to fine-tune the company’s technology to volume production, alongside its current high-volume electronics materials.

“Indium Corporation is a long-standing New York-based leader in innovative materials technology and is a great example of continuity of U.S.-based innovation,” said Douglas Grose, Ph.D., spokesperson for ASIC. “The company’s unique expertise and input will be great assets to our efforts to strengthen U.S. leadership in semiconductor and advanced packaging R&D and bolster microelectronics manufacturing in America.”

MARKETHILL, UNITED KINGDOM – Just a week before Christmas, the team at Lenalea Electronics received an early festive present in the form of a brand new 3D AOI system delivered by Europlacer on 19th December 2022 directly to its factory in Markethill, Co. Armagh. The new system went straight into production.

Having been delighted with more than eight years of use from its 2D AOI system, and with the business expanding, the Lenelea production engineering team decided to invest in the latest 3D AOI solution from Europlacer. The objective was to boost productivity by reducing programming time. The latest AOI software enables a much higher level of automatic programming, which reduces operator decisions and consequently reduces false calls. This investment was imperative due to the increasing volume of new customer business coming through the company’s doors.

3D AOI substantially reduces the effects of component shadowing that can sometimes be flagged up as possible errors, requiring an operator to make a fault or no-fault assessment. In addition, 3D technology distinguishes solder on a pad more effectively, providing a greater level of post-reflow assembly confidence.

“False calls are now very infrequent,” claims Lenalea director David Foster. Where potential errors are highlighted, the Lenalea operators benefit from a clearer perspective of the board thanks to a built-in microscope function with next level resolution graphics.

Lenalea wisely involved its assembly operators in the AOI evaluation and purchase decision, with the Europlacer solution favoured due to the company’s multi-award-winning customer support and AOI expertise. “The transition from 2D to 3D proved straightforward thanks to Europlacer’s applications support, with our team getting up to speed quickly,” Foster says. “We are very pleased with our investment and the new AOI is already making a positive impact on our productivity and helping to drive our expansion.”

NASHVILLE – KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Dallas Expo & Tech Forum on Tuesday, March 28, 2023, at the Plano Event Center in Plano, TX, and the SMTA Houston Expo & Tech on Thursday, March, 30, 2023, at the Stafford Centre in Stafford, TX.

The KYZEN team will highlight the KYZEN Process Control System (PCS), the first and only concentration monitoring and control system in the world, and the newest addition to the award-winning AQUANOX product line: AQUANOX A4626.

KYZEN products and cleaning experts have always been focused on the process so you can be sure the newest AQUANOX product will fit into your production line. Adding KYZEN's Process Control System or the KYZEN Analyst will complete the optimization and provide you with a worry- free process.

The KYZEN PCS monitors and automatically reacts to the dynamic changes in the wash bath concentration. More than 20 years ago, KYZEN PCS was designed to maximize high-quality output from inline cleaning systems, and its capabilities have continuously improved and advanced.

The environmentally friendly AQUANOX A4626 is designed to quickly remove the latest polymeric no-clean flux residues while providing superior results on traditional lead-free and eutectic tin lead residues as well. It has a long tank life and is safe for multi-pass applications.

For more information, visit www.kyzen.com 

BLAUBEUREN, GERMANY – When productronica China opens its doors once more in Shanghai from 13 to 15 April 2023, Rehm Thermal Systems – an expert in thermal system solutions and active on the Chinese market for over 15 years – will also be presenting the highlights of its latest product portfolio. As the leading platform for innovative electronics production, the international trade fair is one of the most important events of its kind throughout the entire Asian region.

At the company stand in Hall N4, Stand Number 4518 of the Shanghai New International Expo Centre (SNIEC), Rehm will be presenting the VisionXP+ convection soldering system with vacuum chamber, the Condenso condensation soldering system, the Nexus contact soldering system and the Protecto dispensing and coating system this year.

The convection soldering systems belonging to the Vision series are efficient, powerful and – depending on the respective version – suitable for different batch sizes in the automotive, consumer electronics or power electronics sectors. The VXP+ with vacuum chamber, which Rehm will be exhibiting at productronica, is the “best-in-class” reflow convection soldering system from the manufacturer based in the southern German town of Blaubeuren, and is not only characterised by increased process stability, but also greater energy efficiency, reduced emissions and operating costs, all thanks to integrated EC motors. A separate vacuum module enables convection soldering processes with negative pressure in just one process: Pores, gas pockets and voids are reliably removed directly after the soldering process. There is no need for the assembly’s time-consuming processing by an external vacuum system; instead, the workpieces are transferred from the peak zones directly into the vacuum process. The high- end system also offers effective residue management by means of pyrolysis in the preheating zone, as well as minimal downtimes, low maintenance and intelligent traceability solutions.

In reflow condensation soldering or vapour phase soldering, the soldering process is carried out with the aid of hot steam. As the heat transfer is up to ten times higher than with convection soldering, the Condenso systems brought to you by Rehm are particularly suitable for large or high-mass boards. The systems of the Condenso series can be integrated into the most diverse production environments with the highest degree of process reliability – be it batch operation, inline connection or soldering in a continuous process. A vacuum option for void-free soldering also enables series production in power electronics. The system series highlights also include the patented injection process, which makes the soldering process individually controllable, or the control of the reflow profile reproducible – and thus ensures better control of the condensation phase.

With the Nexus contact soldering system, Rehm, in turn, promises the best results through reflow soldering processes with contact heat under vacuum. Suitable areas of application can be found in advanced packaging, and especially in the fields of power electronics, semiconductors and wafer technology, which are increasingly being used for railway operations, wind turbines, battery storage and, last but not least, in the automotive industry. Due to its minimal dimensions and high degree of user- friendliness, the system is particularly suitable for use in small to medium series production, and in the laboratory sector.

Optimal coating processes for high-quality electronics are available with the Protecto series from Rehm. The dispensing and coating systems protect electronic assemblies from aggressive environmental influences such as moisture, corrosion, chemicals, dust or vibration, and deliver safe, automated processes, as well as precise results in the application of a wide range of materials. Up to four simultaneously usable applicators give their users numerous options: In addition to dispensing, these include the ability to create freely definable, three-dimensional housing shapes by simple application, the immediate curing of UV varnishes and the casting or bonding of different materials.

With ViCON, Rehm offers a software solution for all systems being presented at productronica China. Tailored to a wide range of manufacturing processes, the plant software delivers an impressive performance with its intuitive operation, optimal process control, convenient product management and smooth connection to higher-level manufacturing management systems (MES).