AUSTIN, TX – High Density Packaging (HDP) User Group announces the Jack Fisher Technical Excellence Award to honor the memory of Jack, who passed away on January 20, 2023.

Jack served as an HDP Facilitator for more than 18 years and was a major contributor to the growth of HDP over the course of his tenure. “Jack was a printed circuit board industry icon, which was recognized by his election to the IPC Hall of Fame in 2006. His expertise and experience will be missed by members and staff alike”, said Larry Marcanti, Executive Director of HDP User Group.

The Jack Fisher Technical Excellence Award will be awarded to HDP members who best exemplify the standards set by Jack over the course of his stellar career.

The eulogy given by Larry can be seen here: https://youtu.be/lZGMvZP5FDU 
Jack’s obituary: https://www.pressconnects.com/obituaries/bps136484 

NUREMBERG – True to its motto "Driving manufacturing forward", the SMTconnect taking place from 9 – 11 May in Nuremberg, Germany, will offer the European electronic production community a forum for inspiration and exchange as a basis for the further development of key technologies for the future.

Two months before the exhibition will open its doors, numerous well- known key players in the industry, including ASYS, Ersa, Essemtec, FUJI, JUKI, Panasonic, SMT Wertheim and Viscom, have confirmed their participation as exhibitors. They will present products and solutions from all areas of electronics manufacturing at the Nuremberg exhibition grounds, and exchange ideas on current industry issues such as increased energy costs, component and raw material shortages and obsolescence management, as well as the current re-shoring trend to Europe with peers and practitioners.

Highlights of the event once again include IPC’s hand soldering competition for young professionals as well as the Future Packaging production line presented by Fraunhofer IZM, this year on the topic of "Trust the Line" - Competitiveness through Trust, Sustainable Tool and Supply Chain.

The topic of supply chains will also be addressed at the "EMS Park" special showcase area. Offering impulse and best practice presentations (e.g. from Uhlmann & Zacher on the topic of EMS selection, specification creation and collaboration), this will highlight the benefits of close collaboration between EMS providers and OEMs for both sides and provide a platform for personal exchange that builds trust to delegate development issues and optimize the supply chain. Among other EMS companies, Assel, Elhurt and Coronex are participating, presentation topics include “The power of trust and dedication – Elhurt EMS way of navigating through components shortage reality” (Elhurt) as well as a number of relevant German-language contributions.

Furthermore, the "PCB meets Components" joint booth enjoys a high level of participation, with Würth Elektronik among the exhibiting companies.

With contributions on current topics such as "Operating AI use cases integrated into electronics manufacturing lines" (Dr. Sebastian Mehl, Siemens AG) on May 10 and the topics "Promoting young talent" and "Women in mechanical engineering - change in the company" on May 11, the trade fair forum promises an exciting program. This year, in addition to the ZVEI and Fraunhofer IZM, the VDMA and the German Association for Electronics Design & Manufacturing, FED e.V., are also participating, each with several program items.

Further information on the exhibition, topics and exhibiting companies is available at smtconnect.com. Interested parties are encouraged to purchase their tickets in advance via the event website.

CLINTON, NY – Two Indium Corporation experts are set to present at APEC 2023, March 19-23, in Orlando, FL. Senior Research Chemist Dr. Sihai Chen will present a technical poster titled Highly Reliable Silver Sintering Joints for Power Module Applications, while Product Manager Joe Hertline will deliver a presentation titled A Novel Material Technology that Reduces Tooling Dependency and Process Complexity in Power Module Soldering and Sintering Applications.

Dr. Chen’s poster presentation will address the development of silver sintering for high-reliability power modules necessitated by the large-scale production of EVs. Currently used high-lead solder bonding materials cannot meet the criteria for power module assembly, especially under high CTE mismatch conditions. However, silver sintering paste bonded between materials with different CTE mismatches achieved high reliability tested by TST (-65ºC–150ºC, 3min./3min., liquid-to-liquid).

Hertline will present on a novel material technology which, applied during assembly, provides robust tacking strength to reduce the dependency on customized fixturing. The technology reduces process time, energy input, and tooling complexity while minimizing up-front thermal stress applied to the dev ice components, yielding an overall manufacturing cost of ownership reduction for high-reliability power modules. It provides a solution to the growing reliance on complex, costly alignment fixturing as power module designers seek repeatable manufacturing and to achieve high-reliability performance.

Dr. Chen specializes in silver sintering paste product development and has authored several of Indium Corporation’s patents for silver sintering paste, thermal interface materials, heat dissipating paint, and indium bump bonding. Dr. Chen has been published in many of the world’s leading scientific journals, including the Journal of the American Chemical Society, Nano Letters, Langmuir, and The Journal of Physical Chemistry. He has also been a reviewer for some of these publications. Dr. Chen obtained his doctorate in chemistry from the Chinese Academy of Sciences with a focus on metal and semiconductor nanomaterial synthesis. Prior to joining Indium Corporation, he conducted research at Clemson University and Duke University. Dr. Chen also has extensive research experience in nanomaterials in Germany (Max-Plank Gesellschaft scholarship recipient) and Japan (JSPS fellow), as well as in the U.S. He holds a Six Sigma Green Belt and is certified as an IPC Specialist for IPC-A-610.

Hertline is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).

To learn more about Indium Corporation’s innovative products for EV and power electronics, visit us at booth #859 at APEC or online at indium.com.

NEWMAN LAKE, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, component lead tinning and solderability testing equipment, is pleased to announce the addition of WepcoVintek as their exclusive sales representative for their entire product line for the territory of Arizona, New Mexico, and Southern Nevada. “We are pleased to have Kevin Colvin of WepcoVintek join our sales team”, stated Tom Baro, North American Sales Manager for Hentec Industries/RPS Automation. WepcoVintek has a wealth of experience in the electronic assembly industry including stencil printing, component placement, AOI and SPI inspection, vapor phase, selective and wave soldering, in-line and batch cleaners, as well as flying probe testers, and X-ray inspection systems.

“We are confident that Kevin and WepcoVintek will advance our complete line of Vector and Valence selective soldering systems, Odyssey component lead tinning machines, as well as our Pulsar solderability testing and Photon steam aging equipment throughout their sales territory”, added Baro.