MADISON, AL – STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototype development and contract PCB assembly, announces Gina Ploeg has been added to the STI Team as SMT Assembly Technician.

Ploeg brings with her 14 years of experience in electronics assembly and manufacturing. She will be a tremendous asset to the STI Team using her experience & knowledge for the Engineering Services Division.

AUSTIN, TX – TechSearch International’s latest analysis examines strategies for the adoption of chiplets and current products. While the market is small today in unit volume, a 103% CAGR is projected from 2022 to 2026. Challenges, including design and test, are discussed.

The report includes OSAT financials and examines economic trends impacting the industry. The North American OSAT market is examined with a focus on advanced packaging capability. Future plans for North American OSATs are discussed. The report also highlights packaging and assembly in Mexico. TechSearch International analyzes the supply and demand for build-up substrates used for flip chip BGAs. The sharp decline in the PC and other markets have lowered demand and the industry has excess capacity. Some unused capacity is being released this year and a few substrate makers are slowing capacity expansion. Substrate companies are facing price pressure, creating an unhealthy condition for the industry.

The latest Advanced Packaging Update is a 47-page report with full references and an accompanying set of more than 40 PowerPoint slides. View the report at https://www.techsearchinc.com/ 

CLINTON, NY – Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen will present a technical paper at SEMI-THERM, taking place March 13–17 in San Jose, CA.

The presentation, titled Innovative Next Generation Metal TIM Technology for HPC Applications, will address the use of solder thermal interface materials (sTIMs) for heat dissipation in high-performance computing (HPC) applications. sTIMs have been used as a TIM1 solution for a limited set of server packages for over 20 years. A sTIM interface has the potential to provide extremely high amounts of heat dissipation. Because of increasing power and functionality of HPC packages, many of the traditional polymer TIM materials are reaching their physical limits for heat dissipation and are no longer adequate. This is creating an interest in using metal TIMs in a broader array of applications.

At Indium Corporation, Jensen leads a matrixed team focused on engaging customers and commercializing new technology for our Thermal Interface Material products, including technology for 5G and AI. He is responsible for ensuring the product line is poised for long-term success by developing technologies that best meet the current and future needs of customers. He has authored numerous technical papers on soldering and thermal technology. In addition to his responsibilities at Indium Corporation, Jensen also serves on the SMTA’s Board of Directors. In this role, he is part of the Strategic Development Committee where he leads the effort on international expansion. He has a bachelor’s degree in chemical engineering from Clarkson University and an MBA from Syracuse University.

MILPITAS, CA – SEMI, the industry association serving the global electronics manufacturing and design supply chain, today announced that members of its Supply Chain Management (SCM) Initiative have formed an Industry Advisory Council (IAC), a group of industry leaders that will guide the initiative in its mission to advance an agile and resilient global electronics supply chain. The Council will develop solutions to help SEMI members better withstand supply chain disruptions and make proactive decisions to protect their businesses and supplier networks.

Strategic partners DHL, McKinsey & Company, and Resilinc will work to accelerate and scale the initiative. The Council will establish 2023 priorities and deliverables and convene at least quarterly to ensure the SCM Initiative is on track to fulfill its vision.

Founding members of the SCM Industry Advisory Council:

• Sanchali Bhattacharjee, Strategy and Program Office, Google
• Hans Ehm, Senior Principal Supply Chain Management, Infineon
• Mark Liu, Director of Technology Capability, Intel
• Gregory Blanchette, Vice President, Strategic Supplier Management, KLA
• Hans-Joachim Neumann, Head of Integrated Supply Chain Electronics, Merck KGaA, Darmstadt, Germany
• S.S. Fu, Director Corporate Planning Organization, TSMC

The IAC will expand to up to 20 member companies across a diverse range of segments and geographies this year. The Council will then form regional councils and working groups to produce tangible solutions.

“Geopolitical, natural and other global electronics supply chain disruptions in recent years have made clear the time is now to better prepare for future crises,” said Bettina Weiss, Chief of Staff and Corporate Strategy at SEMI. “Industry Advisory Council founding members will immediately begin to define priorities, objectives and strategies for the SEMI Supply Chain Management Initiative that lead to actions aimed at strengthening continuity across the entire value chain and supporting semiconductor industry growth.”

“SEMI applauds these industry leaders and their commitment to ensuring that the supply chain is better prepared to seize the tremendous opportunities ahead and minimize the impact of disruptions,” Weiss said.

IAC founding members are committed to working toward the following pillars and objectives:

• Engagement: Establish global and regional Industry Advisory Councils to guide priorities and bolster end-to-end electronics supply chain continuity
• Collaboration: Create platforms for information exchange, education and thought leadership
• Data collection: Conduct quarterly SCM pulse surveys with McKinsey & Company to remain current on industry trends and benchmark best practices
• Industry alignment: Establish conventions for SCM visibility and transparency through the SEMI International Standards Program
• Inclusion: Develop a SCM roadmap to 2025 and beyond for all key supply chain segments to help ensure better preparedness for future disruptions

What founding members and strategic partners have to say

Infineon – Hans Ehm, Senior Principal Supply Chain Management
”Semiconductor supply chains and supply chains containing semiconductors are global. As part of Industry Advisory Council of the SEMI Supply Chain Management Initiative, we have the ability to collectively reduce the bullwhip effect in our supply chains and mitigate future chip shortages in a sustainable way.”

Intel – Mark Liu, Director of Technology Capability
“A transparent semiconductor supply chain is a vital first step towards improved resiliency to ensure our industry’s future growth. The SEMI Supply Chain Management Initiative serves as a critical platform to achieve this objective collectively and collaboratively.”

Resilinc – Bindiya Vakil, CEO and Co-founder
“As a strategic partner to the SEMI Supply Chain Management Initiative, Resilinc looks forward to providing a decade’s worth of supply chain mapping and risk monitoring data to help advance the Council’s mission of creating a more agile and resilient electronics supply chain.”

For more information on the SEMI Supply Chain Management Initiative or to become a member, please contact SCM@semi.org