TEMPE, AZ – Benchmark Electronics, Inc. (NYSE: BHE), a global provider of engineering, design, and manufacturing services, today released its annual Sustainability Report. The report can be found on the company's website and outlines Benchmark's continued progress on environmental, social and governance (ESG) initiatives, including specific achievements across the company's global presence.

"I am pleased to release Benchmark's second annual Sustainability Report, detailing our ESG efforts and results in 2022 and providing our targets for the future." Jeff Benck, president and CEO, Benchmark. "Further, I am proud that, in 2022, Benchmark received a rating of AA in the MSCI ESG Ratings assessment which we believe recognizes our efforts and commitment to this important set of initiatives."

The report highlights Benchmark's sustainability efforts and achievements over the past year and provides insight into future plans guided by the company's commitment to reduce environmental impact, while increasing social and economic value, and further promoting ethical business practices.

In 2022, Benchmark achieved several key milestones in its ESG/Sustainability mission including maintaining a "Silver Sustainability" rating from EcoVadis. In addition, the company has set ambitious goals for 2023 and beyond related to diversity, equity, and inclusion (DEI) and reducing greenhouse gas (GHG) emissions.

"Benchmark is taking another important step forward this year in setting DEI and climate related targets," said Steve Beaver, senior vice president, general counsel, chief legal officer, and ESG/Sustainability Council Chair for Benchmark. "In doing so, we will be reinforcing our commitment to ESG as a strategic and operational imperative across the organization."

To learn more about Benchmark's sustainability efforts, visit the company website at https://www.bench.com/sustainability

NEW COLUMBIA, PA – Blue M, a global manufacturer of industrial and laboratory ovens, announced the shipment of a burn in oven to the electronics industry.

This burn in oven has a temperature range of 15°C above ambient to 300°C and interior chamber dimensions of 48" W x 25" D x 48" H. The unit is designed with a stainless-steel interior, specially perforated plenum side walls, and 4” of fiberglass insulation to minimize heat loss during operation. Eight (8) mesh trays were included in lieu of the solid trays to optimize airflow distribution around the product.

The exterior dimensions of the oven are 66” W x 37” D x 84” H which saves the customer valuable floor space by requiring a minimal footprint. This unit is customized with removable solid back panels to give the customer the option to add devices or make their own ports in the future. The oven also has the capability for upgraded power components inside the chamber in the event the customer’s application requires the installation of a power source on the oven to power capacitors inside the oven while heating the product.

The burn in oven utilizes horizontal airflow and a Watt Watcher™ airflow system that automatically compensates for load variations caused by wattage dissipation. An airflow switch is also included to shut off the heating elements in the event of a blower system failure. The oven temperature is controlled by a Watlow F4T controller which offers the flexibility of a modular I/O controller, Ethernet connectivity, and an easy-to-use color touch panel with high-resolution, graphical user-interface.

“This burn in oven is specially designed with a removable back so the customer has the option to add devices or make their own ports as needed. Another customizable feature on these ovens is they are designed to be upgraded to power components inside the chamber.”
– Jonathan Young, Blue M Product Manager

Unique features of this Blue M oven include:

• Programmable controller with Ethernet connectivity
• Over temperature protection
• Removable back panel for future upgrades
• Airflow switch to shut off heating elements in the event of a system failure
• Horizontal airflow system
• Watt Watcher™ airflow system automatically compensates for load variations

HAVERHILL, MA – The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use lead-free solder alloys containing low melting point elements such as tin, cadmium, or indium. In this white paper, Circuit Technology Center discusses a number of critical considerations when using an automated robotic hot solder dip process to mitigate tin whiskers before circuit board assembly.

See the full paper at: https://www.circuitrework.com/features/1037.html 

DALLAS – CalcuQuote, a supply chain solution provider for the electronics industry, is pleased to announce that it has partnered with MaRC Technologies as its representative in Washington, Oregon, Idaho, and Texas.

MaRC Technologies is a specialized supplier of tools and supplies for the electronics manufacturing and high-tech industry. Established in 1995, Mike Gunderson and the team at MaRC Technologies provide world-class service and products to its customers.

"We're honored to have MaRC introduce our supply chain solutions to customers across two major electronics manufacturing regions," said CalcuQuote CEO, Chintan Sutaria.

CalcuQuote works with EMS and OEM companies to solve complex problems with industry-leading solutions. The company optimizes the supply chain process by enabling customers to make more informed decisions, work faster, be more accurate, and ultimately, be more competitive. CalcuQuote’s investment in machine learning is helping to bring clarity to disjointed part numbering across the industry.

For more information about this partnership, contact MaRC Technologies at (503) 723-0962 or visit www.marctechnologies.biz 

CalcuQuote’s software solutions offer seamless integration with supply chain partners, ERPs and other information systems. To learn more about CalcuQuote, visit www.calcuquote.com