NEWMAN LAKE, – Hentec Industries/RPS Automation is pleased to announce that Tyvak Nano Satellite has completed the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.

The Odyssey 1325 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys. Designed to tin component leads for re- conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling. The Odyssey 1325 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF- 38524E and ANSI-J-STD-002 standards.

MENTOR, OH ― Libra Industries, a privately-held systems integration and electronics manufacturing services (EMS) provider, today announced the appointment of its new Vice President of Sales. Nathan Whipple brings business development experience spanning more than 37 years in multifaceted manufacturing environments.

A hands-on decision maker, Whipple is armed with a rich mixture of operations management and strategic sourcing experience. He is a proven leader with a demonstrated ability to maintain focus on strategic goals, while at the same time effectively leading the tactical activities to achieve those goals.

In his previous role as Director of Channel Partnerships, he established a network of 22 active representative organizations. His responsibilities included creating, leading and managing key strategic partnership programs with manufacturers’ representatives and key suppliers. Whipple brings his strong leadership, operations liaison and strategic account support skills to Libra.

Libra Industries continues to invest to provide customized manufacturing solutions for its customers’ complex product requirements. Through its broad range of capabilities, Libra offers its customers the most capable manufacturing team in the industry. For more information about Libra Industries, visit www.libraindustries.com.

SAN JOSE, CA — NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today announced $8.45 million in funding (including $4.25M in cost-share contribution from participants) for nine new projects as part of its Project Call 7.0 to further promote FHE development and adoption throughout the U.S. advanced manufacturing sector.

Project Call 7.0’s awarded projects represent a diverse and innovative set of companies and universities that are jointly focused on maturing the industry’s capabilities while leveraging the strong foundation established in prior Project Calls. Several projects in this latest round of funded projects focus on advancing additive manufacturing approaches for hybrid electronics and addressing critical needs in domestic advanced semiconductor packaging capabilities, which directly aligns with the needs described in the recently passed Creating Helpful Incentives to Produce Semiconductors (CHIPS) Act.

Project Call 7.0 also focuses on using hybrid electronics manufacturing processes and materials to improve environmental sustainability in electronics manufacturing. This will include using water-based inks and lower temperature processing, as well as assessing the manufacturing reshoring of low-cost single use medical devices that utilize more environmentally sustainable manufacturing approaches and materials.

This latest round of funding brings the total amount invested in FHE developments to more than $124M, including cost share contributions from Project Call participants.

“I am pleased to announce these important new projects, which will enhance the state of the art in hybrid electronics, support national efforts for semiconductor package manufacturing, and help to transition an increasing number of new capabilities into the U.S. industrial manufacturing sector for further advancement of the industry,” said Malcolm J. Thompson, PhD, Executive Director. “The NextFlex member community is accelerating FHE and additively manufactured electronics toward commercialization in a number of critical application areas addressed in these projects.”

Project Call 7.0’s awarded funding will go to:

• Development led by Lockheed Martin Advanced Technologies Laboratories for creation of FHE interposers for heterogeneous integration of a high-density fiber optic Multi-chip Module (MCM) for thinner interposers with finer feature capabilities.
• Development led by GE Research and Binghamton University for Radio Frequency (RF) Multi-chip Module (MCM) with embedded die, printed substrates, antennas, and interconnects for fast turn low loss, high thermal conductivity.
• Development led by Raytheon Missiles & Defense for printed interconnect solutions for microwave multichip packaging for improved die density.
• Development led by General Dynamics Mission Systems for additively manufactured, doubly curved multilayer circuits with active and passive components for embedded RF functionality in complex structures.
• Development led by Auburn University for sustainable, additively printed electronics through water-solvent inks, FHE repairability, and low temperature processing with high reliability.
• Development led by Auburn University for in-mold electronics interconnection and thermoforming for 3D-integrated applications including automotive, aerospace, and medical components and devices.
• Development led by GE Research and Binghamton University for manufacturing approaches for low-cost, sustainable single-use medical devices with cost and environmental life cycle assessment.
• Development led by UES, Inc. for creation of scalable manufacturing systems for ELMNT liquid metal inks for highly stretchable electronics applications.
• Development led by Sentinel Occupational Safety, Inc. for safety assessments of FHE wearable chemical and voltage sensors for risk-reduced industry adoption.

For more information about NextFlex and the Project Call program, please visit https://www.nextflex.us/project-call/

WATERBURY, CT — MacDermid Alpha Electronics Solutions, a global leader of integrated solutions for high performance electronics materials, design, and manufacturing, will highlight its latest polymer and solder paste offerings designed to meet the increasing demands for high reliability performance and protection at the upcoming SMTA Silicon Valley Expo taking place on December 8 at the Juniper Dome in Sunnyvale, California.

Featured solutions include MacDermid Alpha’s expanding portfolio of Electrolube and HiTech polymer materials engineered to meet the requirements for high reliability and protection for increasingly complex circuit boards. The Electrolube line of encapsulation resins, conformal coatings and thermal interface materials and the ALPHA HiTech line of underfills, adhesives and edgebonds are designed to deliver enhanced protection for assembled chip components for a broad range of applications including automotive, camera module and mobile.

Additionally MacDermid Alpha will promote ALPHA OM-565 HRL3, its latest low temperature solder paste which enhances electro-chemical performance over and above existing low melt point solders. This paste enables a reduction in peak reflow down to 175°C in order to mitigate common warpage induced defects such as Head-in-Pillow and Non-Wet-Open to improve assembly yields. Discover more about these and all the MacDermid Alpha product and services that support all steps of device manufacturing within every segment of the electronics supply chain at SMTA Silicon Valley on December 8 and visit MacDermidAlpha.com.