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Press Releases

GURUGRAM,INDIA – VVDN Technologies, a global provider of Engineering, Manufacturing and Digital services and solutions, has been continuously expanding its manufacturing footprint with a lot of emphasis on vertical integration and design led manufacturing.

VVDN's 7 Manufacturing facilities, 6 in Manesar, Haryana, and 1 in Pollachi, Tamil Nadu, house best-in-class 8 SMT Lines, Molding & Tooling Factory, Injection Molding, High Pressure Die Casting, Extrusion, Metal Stamping facility, Product Assembly facilities, and Product Environment/Reliability Test Certifications labs. VVDN's wide product portfolio include vision products including AI Cameras, Surveillance cameras, Automotive Vision Systems, ADAS, Automotive Clusters/Infotainment, 5G radio units, 4G/5G Antennas, Wi-Fi 6/6E and Wi-Fi 7 based access points, Backhaul Radios, ONT, Switches, Hearables & Wearables, HPC/Telecom Servers, Laptops, tablets, EV Chargers, infotainment systems, etc.

The recent additions to VVDN's Infrastructure are the new manufacturing facility in Pollachi, Tamil Nadu, as well as a dedicated Antenna manufacturing and assembly facility in Manesar. The Pollachi factory is a precursor to a massive 100 acres manufacturing plant that VVDN will set up in Pollachi as per the MoU signed with the TN Govt. and the commitment to invest $100M over the next 5 years in the country.

VVDN's unique strength of integrated Design and Manufacturing for Hi-Tech products is enabling large global customers to work with VVDN for their product design and manufacturing. VVDN's major business regions include North America, India, Canada, Japan, S. Korea and Europe. VVDN is planning to further increase its export significantly in these regions over the next three years.

Company stated that its strategy of vertical Integration has given it a unique competitive edge. VVDN with its capability to do PCB assembly, mechanical, tooling and molding, complete PTS, pre-compliance certification is able to mass manufacture the products with increased local BOM value addition up to 40%-50%. Company is successfully manufacturing products for Global Markets.

Puneet Agarwal, CEO – VVDN Technologies, "With a lot of business potential, we are continuously adding to our infrastructure for design led manufacturing to serve our global customers and their local demands. We are pressing forward with vertical integration and have so far successfully integrated Testing, Mechanical, PCB Assembly and Engineering services. We are also working on our plan to add PCB fabrication in the next 1 to 2 years. These infrastructural expansions are the foundations to ensure top notch product delivery which meets world standards in quality and efficiency. VVDN's strong design and manufacturing capabilities sets us apart and makes the company a natural choice of customers from all over the world."

With its ever growing manufacturing and engineering capabilities, VVDN intends to further extend its base to global customers across regions including North America, Europe, APAC.

CLINTON, NY – Indium Corporation is pleased to announce that Amanda Hartnett has joined the company as Product Manager for Engineered Solder Materials (ESM).

In this role, Hartnett pursues market opportunities for ESM products, developing competitive knowledge, and utilizes her experience to encourage customers to adopt Indium Corporation’s thermal interface material (TIM) products. She also plays a key role in the ongoing management of key customer relationships.

Hartnett is not new to Indium Corporation; she previously worked with the company as an Applications Engineer from 2006 to 2013. Since that time, she has worked as a science teacher with Remsen and Sauquoit Valley school districts. Hartnett holds a bachelor’s degree in chemistry from Utica University and a master’s of business administration degree from The State University of New York Polytechnic Institute. She is a certified NYS Master Teacher and a Lean Six Sigma Green Belt.

FREMONT, CA – Datest, a leading provider of advanced, efficient and mission-critical in-circuit testing, test engineering, X-ray inspection and nondestructive failure analysis solutions, and a six-time winner of CIRCUITS ASSEMBLY’s Service Excellence Award, announced a representative agreement with Global SMT’s award-winning Rep of the Year for 2022, Don Dennison of PIT Equipment Services, LLC on the east coast. Dennison will represent Datest in the states of New York, Pennsylvania, New Jersey, Maryland and Virginia.

Dennison commented, “I’m very excited to be working with the Datest team as a service provider of support and testing of PCB assemblies. Our clients have been searching for help as a value-added solution for some time. Datest will provide assistance and back-up support with flying probe and bed of nails testing. This certainly will improve quality and production time.”

PIT started in 1988 with a mission to assist electronic assembly companies in the New York / New Jersey / Eastern Pennsylvania metropolitan area. Their extensive product knowledge and strategic customer relationships have made them a key supplier and long-term partner to companies down the east coast. The key to their long-term success is their service and support of each product sold.

Robert Boguski, President of Datest, remarked, “We are very pleased to partner with a representative of the caliber of Don Dennison and PIT. We’ve admired PIT from a distance for some time, and we’re delighted to partner now with Don and his team to serve the markets in his five-state area. We look forward to years of success providing imaging, test engineering, failure analysis, and analytical services in our unique way to customers and clients in New York, New Jersey, Pennsylvania, Maryland and Virginia.”

With more than 39 years of expertise, Datest offers in-circuit testing (ICT), flying probe testing, X- ray inspection, boundary scan/JTAG testing, functional testing, failure analysis and other related analytical and laboratory services, to OEMs and EMS companies throughout the US, North America, and the world. Datest is an ISO9001:2015, ITAR and AS9100D-certified company, and a member of IPC, IEEE, EIPC and ASNT. Datest is a proud and active member of SMTA.

For more information about PIT Equipment Services, visit www.pit-equipmentservices.com.

For more information about Datest or to view the company’s complete service lineup, visit www.datest.com, or call (510) 490-4600.

REDDITCH, UK – Since establishing a dedicated Irish business division less than two years ago, Altus Group, a leading distributor of capital equipment for electronics assembly, is continuing its growth path within the region. With strong sales predicated for the year and an increase in staff planned, progress within this region is expected to increase further in 2023.

Although Altus has always covered the UK and Ireland in its 21-year history, it wasn’t until 2021 that the company made specific investment in the Irish territory with a new facility and dedicated staff to cover the region. These business activities were important growth drivers and are classed as one of the company’s most significant achievements.

Joe Booth, Altus CEO explains: “Seeing the progression of Ireland for Altus has been one our biggest success stories and an area that I am most proud of. What makes it even more exciting is that we have only just begun this epic journey.

“We have made huge progress in Ireland, developed new growth potential and continue to build our customer base within the region. Our dedicated Irish team, which includes Sales Manager Gareth Fenton and Senior Applications Engineer Michal Ostrykiewicz have been instrumental in building on existing relationships and nurturing new ones to establish Altus Ireland as a front runner in its field.

“In Michal and Gareth, we have found great people with a close alignment with our mission and long-term ambitions. Our success is due to their hard work and determination to be the best at what we do for the customers we serve. Because of their determination and wins, we are ahead of our business plan schedule, and we are looking to bolster our team with another engineering support expert this year.

“For Altus it is important that the service our customers receive does not diminish as we become more successful. Investing in new staff will mean that we can continue to be a high-quality provider but continue to grow to our organisation’s potential in this special region.”

Altus is pursuing its purposeful growth in Ireland with a clear strategic growth plan which ensures the company continues to be the ‘go to’ partner for capital equipment projects. They will achieve this by focusing on developing the sales and support infrastructure in the region to help maximise the tier one brands within the portfolio.

The first event of the year where Altus will meet its Irish customers en-masse is at the Manufacturing and Supply Chain exhibition in Dublin in May. The team will connect key stakeholders across the full spectrum of British manufacturing and present its innovative range of equipment. To find out more visit www.altusgroup.co.uk

ISLE OF WIGHT, UNITED KINGDOM – EVS International, the leader in solder recovery, is pleased to announce its 20-year anniversary. The company attributes its contribution to reducing the carbon footprint and providing a rapid ROI as the main drivers of its success over the past 20 years.

EVS International develops and manufactures environmentally friendly and innovative solutions to address the production of dross created by all wave solder machines. The EVS range of environmentally friendly Solder Recovery Systems enhances its customers’ ISO 14001 credentials by recovering pure solder from dross, therefore reducing their carbon footprint. The company has won more than 25 international awards, including best product, best environmental product, and most innovative product.

“EVS is proud of its 20 years in the business and over these 20 years our customers have saved millions of dollars in solder and helped reduce waste, which is good for the environment,” stated Simon Norman, Business Director. “Solder prices are at an all-time high and EVS is going from strength to strength developing new machines to recover solder and save our customers money.”

EVS International works closely with its customers so that a complete understanding of manufacturing requirements results in a support service tailored to shop floor requirements. Being number one in its market segment gives EVS an advantageous insight into its customers’ need of fast ROI and user- friendly operation.

For more information about EVS International’s industry-leading systems, visit www.solderrecovery.com.

ROME, NY – The EOS/ESD Association, Inc. (ESDA) announces the release of ESD and Latch-up Challenges – An Outlook until 2030, a white paper focused on four essential areas to enable the technical advances of the coming years. EOS/ESD Association, Inc. provides a vision and roadmap for research and development (R&D) and education in the field of ESD and latch-up. The document guides academic institutions and research centers toward the relevant topics in ESD and latch-up. The white paper further provides a framework and the background for successful applications for R&D funding by academic institutions. Each topic is introduced together with the individual research challenges that need to be solved in the coming years to advance the knowledge in ESD and latch-up.

The European Union (EU) commission and the United States (US) government are stimulating their home-grown semiconductor manufacturing capabilities and capacities. For this effort, they strongly support the expansion of European and American semiconductor manufacturing, including constructing new semiconductor production facilities in the EU member countries and the US.

The White Paper identifies research challenges, provides an industry outlook, and establishes collaborations across industry and academia in the field of electrostatic discharge (ESD) and latch-up. In support of digitalization and decarbonization in a transforming worldwide economy, the white paper addresses essential areas necessary for these critical technical advances.

Executive Director Lisa Pimpinella of EOS/ESD Association, Inc. said, “The EOS/ESD Association, Inc. is the independent association with the technical expertise to provide the roadmap for research and development (R&D) and education in electrostatic discharge (ESD) and latch-up. We support academia in their funding efforts as they define proposals addressing the topics named in this White Paper. As an association that combines representatives from all of the major semiconductor companies in the world, we want to highlight the criticality of research, development, education, and funding to ensure electrostatic discharge is recognized and the major thrust behind reliability.”

The White Paper consists of four focus areas essential for technological advances of the future. Advances in CMOS technologies, applications of new materials such as III/V compound semiconductors, Electrical Design Automation (EDA), and an outlook on challenges in ESD manufacturing control and testing.

EOS/ESD Association, Inc., founded and located in Rome, NY, in 1982, focuses on providing electrostatic discharge awareness, education, controls, and prevention.

Details of the White Paper can be found at https://www.esda.org/store/white-papers/product/379/eosesd-association- inc-white-paper-esd-and-latch-up-challenges-an-outlook-until-2030. For more information please refer to www.esda.org, or contact Lisa Pimpinella, Executive Director via e-mail at lpimpinella@esda.org, or call (315) 339-6937.

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