SAN JOSE, CA – SHENMAO Technology is proud to commemorate its 50th anniversary. Founded in 1973, SHENMAO has witnessed the evolution of Taiwan’s electronics industry, playing a pivotal role in shaping the landscape of solder materials and setting new industry standards.

During the early days in Taiwan, the electronics industry predominantly relied on processing supplied materials. Raw materials, such as tin, were acquired and melted using molds at high temperatures, resulting in the production of primarily industrial solder bars. The shift towards soldering materials only transpired as electronic components progressively reduced in size.

In 2004, SHENMAO seized a remarkable opportunity for internationalization and growth. With the European Union's mandate to transition to non- toxic, lead-free manufacturing processes for consumer electronics, driven by environmental concerns, SHENMAO took proactive measures. The company secured non-toxic, lead-free manufacturing technology from the Japanese company THERESA, paving the way for lead solder paste technology and earning HP certification under its own brand.

Following the success with HP, SHENMAO established collaborative partnerships with prominent electronics manufacturers such as Dell, Lenovo, Acer, and Asus. Gradually, SHENMAO captured approximately 18% of the global tin material market, ranking as the world's third-largest solder materials supplier, trailing only behind Japanese and American manufacturers.

In 2016, Intel invited SHENMAO to develop low-temperature solder paste products, addressing the challenge of circuit board warpage when exposed to high temperatures. This marked a significant milestone in the company's pursuit of sustainable growth.

To further support its commitment to innovation, SHENMAO inaugurated an advanced materials research and development center in 2016. This move allowed the company to expand its scope into diverse applications, including advanced semiconductor packaging, low-orbit satellites, and electric vehicles. Notably, SHENMAO entered the low-temperature tin product sector in collaboration with Intel, aligning with energy conservation and carbon reduction initiatives.

Looking ahead, the demand for low-temperature solder paste is expected to extend beyond processors to encompass memory on motherboards, NB displays, and power supplies, all driven by green manufacturing processes.

In addition to low-temperature solder paste, SHENMAO has ventured into producing recycled solder paste through a specialized recycling process. This sustainable approach is used in Apple iPhone chargers, aligning with the growing trend of energy conservation and carbon reduction.

SHENMAO's efforts in the recycled solder paste sector have captured Apple's attention. Both companies are now collaborating on mobile phone chargers, successfully completing the UAL product certification through Delta. Additionally, SHENMAO has forged a long-term partnership with Microsoft, with the aspiration of using recycled solder paste in the mainboards of the XBOX game console.

In a significant strategic move, SHENMAO followed in the footsteps of Wistron by acquiring a factory in Mexico. Construction is set to commence in October of this year, with plans to provide automotive solder paste to Tesla and make a strategic entry into the electric vehicle market.

SHENMAO is resolute in embracing the ESG (Environmental, Social, and Governance) trend, driving sustainable growth, and identifying new opportunities to shape the next 50 years.

For more information, please visit www.shenmao.com 

PHARR, TX – ROCKA Solutions is pleased to announce its official status as a USA-based company, headquartered in Texas, to better serve its valued customers in the United States and Canada.

As part of this expansion initiative, ROCKA Solutions has significantly increased its warehouse capacity in its Pharr, TX location, growing from 6,000 square feet to an expansive 15,000 square feet. Additionally, the company has established a new warehouse in El Paso, TX, spanning 5,000 square feet.

The decision to establish a USA-based company reflects ROCKA Solutions' commitment to providing top-notch service and support to its growing customer base in North America. The facilities in Texas allow for efficient distribution and quick response to the needs of clients across the region.

Looking ahead, ROCKA Solutions has ambitious plans for further expansion and is actively exploring opportunities to add more warehouse capabilities in key locations. This expansion strategy aligns with ROCKA Solutions' customer-centric approach, aiming to follow the footprint of its clients and enhance accessibility to its cutting-edge products.

"As part of our ongoing commitment to providing top-notch service to our customers in North America, we are excited to announce ROCKA Solutions' official presence as a USA-based company. Our expanded warehouse facilities in Pharr and El Paso demonstrate our dedication to meeting the growing needs of our clients with increased efficiency and faster delivery times," said Rodrigo Cacho, ROCKA President & CEO.

The expansion and localization of operations in the USA will empower ROCKA Solutions to provide even more agile and responsive services to its growing customer base in North America.

iNEMI Packaging Tech Topic Series Webinar
LSI/PKG/PCB Co-Design to Support 3D-IC/Chiplet Design
Guest Speaker: Kazunari Koga, Zuken Inc.
November 28, 2023

Chips and packages have different manufacturing methods and data sizes, so the design tools are also different. This webinar will introduce new software technology that can handle — in one tool —two types of design data. This technology connects design data for different technologies in a hierarchical structure and allows all data to be edited simultaneously. It also addresses the issues of designing a package that implements chiplets. This includes the challenges of large-scale design data (due to increasing nets between chips), device implementation of heterogeneous technologies with a mixture of substrate and silicon, and I/O design complexity.

About the Speaker
Kazunari Koga
Zuken Inc.

Mr. Koga has been working with development of an LSI/package/board (LPB) co-design environment since 2007. He joined the JEITA LPB working group in 2010, and participated in the development of LPB formats, which became an IEEE standard in 2015. He was also involved in the Semiconductor Technology Academic Research Center’s (STARC’s) development of a design methodology for 3D ICs, and the New Energy and Industrial Technology Development Organization’s (NEDO’s) development project for a 3D integrated design and verification platform.

Registration

This event is open to industry; advance registration is required (see link below). If you have any questions or need additional information, please contact Masahiro Tsuriya (m.tsuriya@inemi.org).

November 28, 2023
8:00-9:00 a.m. EST (US)
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan)
Register for this webinar

SAN JOSE, CA – Zero Defects International [ZDI] has announced their participation as an exhibitor at the SMTA Silicon Valley Expo and Tech Forum. It will be held at Building 3 on the FLEX campus located at 727 Gibralter Drive, Milpitas, CA. Expo time and date: 8:30 AM, Thursday December 7th.

Foremost among the PCBA test and inspection products to be shown will be Viscom's AOI, X-Ray and SPI inspection equipment. The Viscom display will include updates on the very latest enhancements for each of these products. Also, ZDI will have information on their flying-probe test services as well as their reverse engineering and failure analysis services. Additional ZDI partners, for which information will be available, include Europlacer [PCBA assembly equipment], Velan [PCB and PCBA engineering services], Tagarno [digital microscopes], Epoch International [PCBA functional test fixtures] and Pacific Trinetics Corporation [smart component storage and inventory control cabinets]. ZDI personnel will be in attendance along with Europlacer and Viscom sales management representatives.