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CRANSTON, RI — AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that they will feature their new AIM LUX™ Product Line at Hangjiatalk MiniLED, scheduled to take place on November 17th and 18th, 2022, at Crowne Plaza Shenzhen International Convention and Exhibition Center.

AIM designed its LUX solder materials to provide tier one manufacturers of LED, miniLED and hi-power LED assemblies with solder pastes and alloys to solve production challenges associated with these applications. AIM Solder’s Flopy Feng will present on the second day on MiniLED Assembly Material Considerations.

Designed to provide tier one manufacturers of LED, miniLED and hi-power LED assemblies with solder materials to solve production challenges associated with these applications, the LUX product line pairs ultra-fine SAC-based and silver-free Type 6, 7 and 8 alloy powders along with innovative flux chemistries. AIM’s NC259 series is proven to provide excellent soldering performance and high production yields. When combined with the SN100C® alloy, NC259 solder pastes eliminate silver migration concerns. AIM REL61™ is a low-silver alloy option that can lower peak reflow temperature requirements and improve mechanical strength over other low/no-silver alloys. For high-power LEDs, AIM's REL22™ doubles the service life under extreme thermal cycling conditions. AIM's Tacky Flux offers high tack forces, unlimited open time, and improved wetting for all mass transfer and high-speed dipping applications.

AIM Solder’s Flopy Feng will also present information on MiniLED Assembly Material Considerations on November 18th. MiniLED assemblers can learn from SMT applications because they share some similarities, but as technology progresses, it is apparent there are significant differences as well. Ultra-miniature print requirements, novel component placement techniques and low oxygen reflow environments require new and innovative materials to optimize production throughput and product quality. This presentation will discuss some of the material considerations for miniLED assembly and their implementation.

For more information about the AIM LUX Product Line and AIM’s services, visit us at Hangjiatalk MiniLED or visit www.aimsolder.com.

Indium Corporation is pleased to announce that Theo Ruas has been promoted to the role of Global Sales Manager, Metals and Compounds.

In his new role, Ruas leads all aspects of global sales for Metals and Compounds, including gallium tri-chloride, high-purity indium, and the reclaim of indium, gallium, and tin. He also supports product management with market information for the development of new technologies.

Ruas ensures a healthy sales opportunity funnel and progress, engages with the company’s largest customers, and manages pricing. He also leads and develops the global sales team and channel partners, works closely with product management and marketing on strategies and promotional activities, and collaborates with manufacturing teams to ensure that capabilities and capacity are in place to meet and exceed customer expectations.

Ruas joined Indium Corporation in 2020 as a Field Sales Representative based in Italy. He holds a mechanical engineering degree with a focus on surface plasma treatment from the Federal University of Santa Catarina, Brazil.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.

MENTOR, OH ― November 2022 ― Libra Industries, a privately-held systems integration and electronics manufacturing services (EMS) provider, today announced promotion of Patrick Mattingly to the position of Vice President Strategic Accounts.

Mattingly joined Libra in April 2021 in the role of Business Manager. Since joining Libra, he has effectively led the stabilization and growth of one of the company’s largest accounts. Mattingly and the team established processes and adopted tools that have been leveraged companywide, enabling growth in Libra’s other factories.

Libra has performed at exceptional levels during the past several quarters, and this has led to substantial new business opportunities. In his new role, Mattingly will be tasked with further building out the team, tools and capabilities.

Mattingly earned his BS in Applied Science, Manufacturing Engineering from Miami University, and MBA in IT and International Business from the University of Dayton. He holds a Master Certificate in Project Management from The George Washington University.

Libra Industries continues to invest to provide customized manufacturing solutions for its customers’ complex product requirements. Through its broad range of capabilities, Libra offers its customers the most capable manufacturing team in the industry. For more information about Libra Industries, visit www.libraindustries.com.

About Libra Industries

Libra Industries is a leading provider of Systems Integration & Electronic Manufacturing Services (EMS), serving OEMs with complex or technologically sophisticated manufacturing requirements in a broad range of industries including Medical, Mil/Aerospace, Industrial, Semiconductor, Robotics and Communications. Six world-class manufacturing facilities allow Libra Industries to provide customers with manufacturing flexibility including complete system build, module and subassembly production, as well as simple to complex PC board assembly. With an ongoing commitment to investment in people, quality systems, and the latest manufacturing equipment and processes, Libra Industries is committed to managing their clients’ products from initial design and prototype to full production; assisting their clients in their efforts to improve time to market, reduce total systems cost, and increase quality.

Irvine, California, USA - TopLine® Corporation will exhibit its latest technology solutions at Electronica in Munich, Germany, November 15 – 18, 2022, in Booth B4-332. The exhibit will include leading TopLine products including CCGA Solder Columns, IC Bonding Wire, Zero Ohm Jumpers, IC JEDEC Trays, and more. TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling, and practice. For more information, visit Booth B4-332 at Electronica.

TopLine recently announced the availability of new low-void CCGA solder columns, developed by TopLine engineers using new proprietary processes. The absence of voids in the column's high temperature core makes the columns structurally stronger and more reliable.

About TopLine

TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. To learn more, visit www.CCGA.tv or call (1+) 800 – 776-9888.

CalcuQuote, a supply chain solutions partner for the electronics industry, is pleased to announce an integration with WireMasters, a trusted source for Mil-Spec wire, cable, connectors, and harness management products.

“We’re excited to work with WireMasters,” says CalcuQuote Vice President of Growth Dustin Carlson. “Through this integration, CalcuQuote customers have increased access to meet their wire, cable, connector, and harness management needs. Additionally, this integration can be set up quickly and allows access to customer-specific pricing.”

Wiremasters is pleased to join forces with CalcuQuote and to support supply chain solutions for their mutual customers. As a global leader providing everything in your harness, WireMasters is always looking for ways to support and serve its thousands of customers and is looking forward to doing just that through this partnership.

CalcuQuote works with more than 200 electronics companies to solve complex problems with industry-leading solutions. WireMasters’ integration with CalcuQuote solutions will allow for seamless sourcing decisions in the future.

To learn more about CalcuQuote, visit www.calcuquote.com.

About WireMasters

With locations across the globe and 24/7 eCommerce capabilities, WireMasters is your trusted source for wire and cable, connectors and accessories, harness management products, and value-added services. WireMasters' mission and vision is, "To serve with integrity—our customers, teammates, families, and communities while being the premier partner in connecting the world's most extraordinary systems and platforms, powered by our people, products, and passion for service."

About CalcuQuote

CalcuQuote provides quoting and supply chain software for the electronics industry. With a focus on the future, CalcuQuote improves the speed, accuracy and efficiency of the quoting and supply chain process by optimizing operations and implementing sustainable digital solutions. Founded in 2014, CalcuQuote currently serves over 200 EMS companies and has a global customer base.

The Occam Process reverses traditional component assembly removing its greatest vulnerability

EL DORADO HILLS, CALIFORNIA --A Game-changing component assembly methodology will transform product confidence in the harshest environments.

Most electronic manufacturing defects are related to the soldering process and most field failures occur as a result of solder weaknesses such as fatigue due to shock and vibration and/or repeated thermal excursions in operations or rework.

The Occam Process is a game-changing solderless assembly technology that reorders the way electronic components are assembled, greatly improving reliability and performance, while significantly reducing product size and cost. With Occam, solder related failures are eliminated because solder itself is eliminated. The Occam approach bypasses the weakest link, inherently driving up product reliability while opening the door to a host of new capabilities and benefits for product designers.

Occam inventor Joe Fjelstad commented: “Occam isn’t just a new process but a reordering of current methods. It is an enabling technology allowing the industry to move toward a future where higher reliability, lower costs and less environmental impact are the norm. Occam will transform the industry into something substantially simpler and better.”

To learn more about The Occam Process download the ebook, SAFE, Solderless Assembly for Electronics

For more information on how to join the Occam revolution, visit the Occam website: theoccamgroup.com or contact managing partner, Ray Rasmussen at: ray@theoccamgroup.com, 916-337-4402

About The Occam Group

This group’s sole purpose is to find committed partners desiring to adopt and integrate the Occam Process into their businesses. The Occam team is composed of three seasoned electronics industry veterans from the US and Germany: Joe Fjelstad, Ray Rasmussen and Silvio Bertling. Collectively they have over a century of relevant experience.

Joe Fjelstad is the inventor of the Occam Process and has been active in electronics manufacturing since 1972 in various roles, including chemist, process engineer, and R&D manager. He holds nearly 190 U.S. Patents and numerous foreign ones. One of his patents for a low profile bottom leaded IC package presaged the QFN and is today cited in more than 550 other patents. He is an internationally recognized book and column author, electronics interconnection technology expert, inventor and lecturer in the field of interconnection technology and is as well a veteran of several startup companies beyond Verdant Electronics, including: Beta Phase, ELF Technologies, MetaRAM, Silicon Pipe, , Tessera (now the public company, Xperi where he was the first appointed company fellow.

Ray Rasmussen is a widely respected veteran PCB industry watcher, reporter and analyst and trusted source and sounding board for numerous industry executives. He was co-founder, editor and publisher of CircuiTree magazine, publisher of SMT Magazine and iConnect007.

Silvio Berling is a seasoned, innovative and accomplished electronics engineer with over 30 years of experience in the field specializing in printed circuit board materials, leading teams for major materials suppliers in the U.S. and Europe. T

he Occam Process, is aptly named in honor of 14th Century English Philosopher William of Occam, who taught his followers, “It is vanity to do with more, that which could be done with less,” an idea which was inspirational to the process as conceived.

Contact us at: The Occam Group

Media contact: ray@theoccamgroup.com

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