Press Releases
TOKYO – TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Group CEO: Koichiro Tanaka), which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced today that it is promoting business strategies in each country with the aim of establishing a "Global Recycling Network" to promote the widespread recycling of precious metals.
TANAKA will encourage the recycling of precious metals in each country at its main recovering and refining bases: Ichikawa Plant and Shonan Plant for Japan and Southeast Asia, Hukou Plant for Taiwan, Marin Plant for Europe, and North Attleborough Plant for North America.
As part of this expansion, Chengdu Guangming Paite Precious Metal Co., Ltd., TANAKA affiliate company in China, will establish a new company, Ya'an Guangming Paite Precious Metal Co., Ltd., in Sichuan Province, China, which will begin full-scale operations in the summer of 2024 or later. This new company will manufacture precious metal compounds for various catalysts and plating and will also recover and refine precious metals from production scrap and used catalysts by introducing TANAKA's precious metal recycling technology.
Of the approximately 5 billion yen invested in the establishment of Ya'an Guangming Paite Precious Metal, TANAKA Kikinzoku Kogyo will invest 40%.
Background of Precious Metal Recycling Business Development in China
Unlike in other countries and regions, the precious metals business in China should ideally be completely integrated with the recovery and refining of precious metals and the manufacture of industrial precious metals products. Until now, the cooperation between TANAKA Kikinzoku Kogyo and Chengdu Guangming Paite Precious Metal has allowed for limited integration, but some recoverable precious metals are still not being recovered. This new company will introduce the recycling process that TANAKA has cultivated over many years in the precious metal business in Japan to establish a system capable of recovering precious metals that have not been recovered up to now. Through the new company, TANAKA will establish a one-stop precious metal recycling scheme that can be completely integrated within China, further developing its precious metal recycling business.
TANAKA will contribute to sustainability by effectively utilizing limited precious metal resources in various businesses. TANAKA also believes that precious metal recycling will help reduce the use of mined precious metals in industrial products, thereby helping to reduce environmental impact.
LOUISVILLE, KY – LogicMark, Inc. (NASDAQ: LGMK) (the “Company”), creator of innovative personal safety and security technology for the care economy, today announced an agreement with All Quality and Services, Inc. (AQS) to engineer and manufacture new hardware devices, the first product of which is scheduled to launch next year.
“Having an additional contract manufacturer based in the U.S. helps us diversify our risk and minimize supply chain disruptions, ensuring our customers have the products they need. Our customers are also requesting products that are ‘Made in USA’. With existing tariffs on imported products, manufacturing in the USA is now more competitive, which allows us to increase the number of cost effective customer solutions. We look forward to partnering with AQS to help us introduce new products into the marketplace, which will supplement life saving products already in our pipeline expected for launch in 2023 and 2024,” said LogicMark CEO, Chia-Lin Simmons.
“For more than three decades, we’ve provided our customers with a one-stop solution for all their needs in high-quality electronics manufacturing and engineering services so that they can thrive in any dynamic competitive environment,” said Bruce Lee, Vice President of Operations with AQS. “We’re looking forward to working with LogicMark to deliver the most innovative personal safety and security technology to the aging population, in a timely manner.”
Today’s aging population deserves fast and reliable access to the most innovative personal safety and security technology available. AQS – which is ISO 13485 certified – is one of the most highly respected and experienced full-service contract manufacturers in the electronics manufacturing sector. The LogicMark partnership with AQS is expected to provide added flexibility to the Company’s product manufacturing operations as well as capacity to fulfill the needs of a growing care economy.
For more information about LogicMark’s devices and accessories, visit logicmark.com
FARNBOROUGH, UK – Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimization equipment, is excited to announce its participation at the 24th European Microelectronics & Packaging Conference (EMPC) taking place Sept. 11-14, 2023 at the Wellcome Genome Campus, Hinxton, near Cambridge, UK.
At the conference, Sascha Lohse, from Finetech, Gen3's principal will be presenting a paper titled 'Fine Pitch Micro Indium Bump Interconnect Flip Chip Bonding.' The presentation will delve into the challenges faced in producing large format, high-density IR thermal imaging FPA devices, Quantum processors, and micro LED displays using fine pitch micro Indium bump array interconnections that meet the rigorous industry requirements of today.
Lohse is an esteemed expert in microsystems technology, having graduated in the field in 2006 from the University of Applied Science in Berlin. He has acquired extensive experience in both frontend and backend processes while working at the Hahn Schickard Gesellschaft and the Fraunhofer IZM. Presently, Sascha leads the product management, application, and technical documentation teams, and he serves on Finetech's executive board. His profound knowledge of multiple bonding technologies has allowed him to tackle various packaging challenges throughout his career.
The EMPC conference provides an ideal platform for Gen3 to showcase its advanced microelectronics solutions to a diverse audience of industry professionals, researchers, and decision-makers. Gen3's cutting-edge technology addresses the industry's evolving needs, enabling customers to achieve exceptional results in their microelectronics projects.
Gen3 looks forward to engaging with conference attendees, networking with industry peers, and demonstrating its commitment to advancing microelectronics technologies.
WATERBURY, CT – MacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Asia, held at Shanghai New International Expo Center - SNIEC, 29 - 31 August 2023. MacDermid Alpha’s experts and product portfolio will be on display in hall W2, booth 2F08. Our team of experts look forward to welcoming visitors and sharing innovative solutions for increased power, range, and reliability in EVs (Electric Vehicles).
Save the date –August 29, 2023, The Power Electronics - Product Overview, Processes, and Technical Roadmap
Zhao Yu, Business Development Manager at MacDermid Alpha will introduce our latest products and process technologies for power electronics. These include both sintering and soldering materials, the application of those processes, and our new product development direction to meet the evolving power electronics technology trends.
Zhao Yu has over 13 years of experience in semiconductor packaging and electronic assembly fields, specializing in silver bonding and soldering technologies. His team assists customers in the successful implementation of these sintering and soldering technologies in large-scale production.
Innovative technology to aid new-generation inverter design
MacDermid Alpha is powering the path to enhanced reliability of power inverters. This is achieved by improving the consistency of sintered joints and enabling higher operating temperatures. Highlighted at the show will be:
- Argomax® 2141, a recent addition to the portfolio, is ideal for sintering large packages or components on gold or silver substrates. A key advantage is its firm attachment to the inverter, and ability to cope with marginal component surfaces. Utilizing a pure silver bond line, the dispensable silver sintering paste exhibits excellent bond line thickness and adhesion. Argomax 2141, delivers excellent performance and reliability for inverters in extreme temperature swings.
- The ATROX® range offers superior reliability and performance with rapid heat dissipation for higher efficiencies and operating temperatures. The ATROX 800HT series, are thermosetting conductive die attach adhesives with high thermal conductivity (>70 W/m- K) are designed for the no-pressure assembly of high-power exposed pad semiconductor packages. The ATROX die attach and clip attach process provides low modulus materials for large die sizes as well as superior adhesion to copper clip surfaces. A leading high thermal film with excellent bond line control, ATROX CF200-1D, is an electrically conductive die attach film with thermal conductivity of >20 W/m-K with no die tilting resulting in a high-yield assembly process.
Today, China’s new energy vehicle market accounts for almost 25% of all automotive sales. This will continue to increase. MacDermid Alpha is in a unique position, being the only material supplier for all electronics manufacturing, to support this trend. Speaking recently at the opening of the MacDermid Alpha China Electronics Center (CEAC) in Pudong New Area, Shanghai, Tom Hunsinger (Vice President of Semiconductor Assembly) commented, “At the heart of an electric vehicle is the power inverter. Our materials, and our presence in China, help OEMs and Tier 1s develop the next-generation designs.”
Established global product brands in the electronic industry are part of MacDermid Alpha Electronic Solutions. These include Alpha ® , Compugraphics™, Electrolube ® , Kester ® , and MacDermid Enthone ® , bringing manufacturers a fully integrated ‘start to finish’ electronics roadmap. Discover how we can elevate your process and make a difference to your application by visiting www.macdermidalpha.com
PLYMOUTH, WI – Kurtz Ersa Inc., a leading supplier of electronics production equipment, is excited to announce its participation in EPTECH Calgary, scheduled to take place Tuesday, Sept. 26, 2023 at the Best Western Premier Calgary Plaza Hotel & Conference Centre. Representatives from Comtree, a trusted partner of Ersa, will be available at the event to discuss Ersa's comprehensive range of solutions tailored for the electronics manufacturing industry.
A key highlight of Kurtz Ersa’s offerings is its patented IR rework technology. This innovative technology has garnered acclaim for consistently delivering outstanding results, even in the most challenging rework applications. Its proven track record has benefited countless users around the globe, cementing its reputation as a game-changer in electronics rework solutions. Ersa's systems stand out for their remarkable cost-to-performance ratio, establishing them as the preferred choice for electronics manufacturers seeking reliability, efficiency, and unmatched performance.
Visitors to the EPTECH Calgary event can expect to explore a range of Ersa’s rework and soldering systems, all of which exhibit the brand's signature superiority and adaptability. Kurtz Ersa takes pride in its legacy of over 30 years in the industry, setting the benchmark for high-end reflow ovens. The latest addition to their lineup, the HOTFLOW series, continues to redefine excellence in the field. Notably, the HOTFLOW series boasts impressive energy savings of up to 25 percent, coupled with a remarkable 20 percent reduction in N2 consumption. This series underscores Ersa’s commitment to driving efficiency, sustainability, and optimal performance.
Comtree represents Ersa throughout Canada. For more information about Comtree, e-mail Ernesto Provenzano at ernesto@comtreeinc.com, Graham Gibson P.Eng. at graham@comtreeinc.com, or call 905 673-7777.
For more information about Kurtz Ersa Inc., visit www.ersa.com
CHATSWORTH, CA – NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is thrilled to announce the expansion of their state-of-the-art failure analysis lab at their Agave manufacturing site in Juarez, Mexico to provide customers with enhanced levels of product quality assurance. As a leader in electronic manufacturing of advanced high-tech products for OEMs, NEOTech continues to offer best-in-class services by showcasing their commitment to investing in state- of-the-art equipment. This commitment to quality ensures NEOTech’s customers keep their products ahead of their competitors.
NEOTech is well known in the industry for its reputation to provide high-quality and high- reliability electronic manufacturing services with the continued investment in cutting-edge manufacturing equipment. Having their failure analysis lab integrated as part of their inspection and manufacturing process at their largest production facility in Mexico, NEOTech can locate supplier or production defects in microscopic details to avoid unexpected problems with products in the field. The success of the failure analysis lab in Mexico blazes the trail for similar labs to be implemented at NEOTech’s other manufacturing sites in Mexico and the US.
“Our team of engineers and technicians, all experts in product failure analysis, and our investment in top-of-the-line analysis equipment, gives our customers the advantage that we can analyze and identify design or manufacturing defects before they effect production volumes,” stated Kunal Sharma, President and Chief Operating Officer. “With decades of combined experience in multiple engineering disciplines, our product failure analysis team uses equipment like our Scan Electron and Elemental Analysis Microscope to quickly and thoroughly locate mechanical anomalies and inconsistent chemical compositions. Along with the detailed analysis, our team also contributes to finding creative solutions that work best for everyone, ensuring our customers’ product quality stays at the top of the industry.”
Along with their manufacturing capabilities in the US, NEOTech provides options for high-tech electronics manufacturing in Mexico with four strategically located plants. The Tijuana sites, situated in the greater Baja California region, include top-of-the-line PCBA manufacturing along with NEOTech’s Interconnect Center of Excellence. The Tijuana sites, in conjunction with NEOTech's two state-of-the-art locations in Juarez, Mexico, boast cutting-edge manufacturing technologies and supply chain management capabilities, elevating NEOTech to the forefront of the EMS industry.
NEOTech’s Interconnect Center of Excellence represents innovation and excellence in custom cable manufacturing solutions, wire harness manufacturing, and wire harness assembly. The three additional manufacturing sites provide industry-leading PCBA manufacturing, custom testing stations, and high-level assembly capabilities for some of the world’s most advanced products. With a mere five-minute drive from the US border to all four facilities, the facilities embody NEOTech’s commitment to proximity, efficiency, and quality. By seamlessly merging their diverse expertise in building printed circuit board assemblies and intricate systems integration, NEOTech stands out as the premier end-to-end, one-stop destination for delivering innovative products that set new industry standards.
With more than 40 years of heritage in electronics manufacturing, NEOTech specializes in high- reliability programs in the Aerospace and Defense industry, Medical Products, and High-Tech Industrial markets. NEOTech is well recognized as a premier EMS provider with in-depth experience manufacturing high-tech products and managing stringent US government requirements. For more information about NEOTech services, visit the company’s website at www.NEOTech.com
Press Releases
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