BANNOCKBURN, IL – In recognition of their leadership and their significant contributions of time and talent to IPC and the electronics manufacturing industry, three IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in San Diego, Calif on January 24, 2023. Recipients were Steven Bowles, Lockheed Martin; Stan Rak, SF Rak Company; and Savita Ganjigatti, Sienna ECAD Technologies Private Limited.

Steven Bowles is a member of more than 30 standards development committees, holding leadership roles as Chair of 3-10 Printed Board Base Materials, D- 13 Flexible Circuits Base Materials, D-15 Flexible Circuits Test Methods, and D-11 Flexible Circuits Design. He is the Chair Emeritus of 2-30 Terms and Definitions Committee. Bowles is also a member of the Committee Chairman’s Council and a Lifetime Member of IPC’s Technical Activities Executive Committee (TAEC). He is a member of the Lead-Free Electronics Risk Management, (PERM) Council, a Mentor in IPC’s Emerging Engineer Program, and was the very first recipient of IPC’s Rising Star Award in 2015. Winner of many committee leadership and committee service awards, Bowles also serves as an IPC standards committee A-Team leader.

Stan Rak is the chair of the IPC APEX EXPO 2023 Technical Program Committee (TPC) where he has served for six Technical Conferences in different roles, working closely with IPC staff and industry experts on program development. Developments include the expansion and strengthening of the TPC, the introduction of Special Sessions designed to stimulate audience participation in emerging fields and assisting with the transition to a digital document format for improved communications with authors. Rak has contributed to the inaugural releases of the standards, IPC-5262, IPC J-STD-001GA/IPC-A-610GA, and IPC-7093. He received the IPC Rising Star Award in 2016 for IPC-related contributions to the automotive electronics manufacturing industry.

Savita Ganjigatti has been involved in the industry for more than 30 years, and served as a steering committee member for the IPC 2022 Global Design Competition, representing the Asia Pacific region. A program panel member of the IPC Global Thought Leadership Program, she has also serves on the IPC India Technical Advisory Committee, was instrumental in starting the PCB competition in that region, and conducted many design contests. Ganjigatti was a critical in the development of the Women in India Electronics group, paper presentations, and standards reviews facilitated by IPC India. She helped to implement “PCB Design Engineering” as an elective at several Indian universities, and she is actively involved in skill development initiatives of the Indian central government.

“The leadership and expertise of Steven, Stan, and Savita sets the standard for building electronics better,” said John W. Mitchell, IPC president and CEO. “By presenting them with IPC President’s Awards, we are showing our appreciation for their significant contributions to IPC and the global electronics manufacturing industry.”

TORONTO – Bittele Electronics Inc., a Toronto-based PCB assembly company specializing in high quality prototype and low-to-mid volume printed circuit board assembly, announced today that it successfully renewed the ISO 9001:2015 quality management certification for its Markham, Ontario, facility. Bittele says the ISO 9001:2015 certification renewal demonstrates its commitment to quality and continuous improvement.

The ISO 9001:2015 certification is a quality audit and comprehensive process review that includes writing quality procedures and taking actions to improve a quality system. Bittele partnered with SGS Canada, a leading testing and certification company, to thoroughly audit and review its quality management system and verify compliance with the ISO 9001:2015 standard.

"The ISO 9001:2015 certification embodies our core values and reminds us of the importance of our strategic, winning partnerships with our customers and vendors," said Ben Yang, CEO of Bittele Electronics. "This certification demonstrates our belief in continually improving our processes. We want to thank our employees who worked with our Quality Department to achieve this monumental goal."

For more information about Bittele’s high-quality PCB Fabrication and Assembly Services, please email sales@7pcb.com for more information.

SEOUL, KOREA – For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place February 1-3, 2023, at COEX in Seoul, Korea. At the exhibition, Heraeus Electronics will show a wide range of innovative materials to enhance power modules and semiconductor device performance.

5G communication increases bandwidth, reduces latency and provides faster switching speed. RF amplifiers are critical for 5G high-speed switching. With WBG semiconductors, operating temperature increases above 175°C affecting reliability negatively. Higher temperature can have negative effects on efficiency and also can reduce both performance and reliability.

Heraeus Electronics will display three of its newest products that offer solutions to thermal dissipation, miniaturization, and defect challenges: mAgic® DA320, Welco AP520 and AP500X.

mAgic® DA320 is a high shear strength, non-pressure dispensing sinter paste for die attach of power applications. The new sinter paste, featuring fast sintering, high shear strength and high thermal conductivity, is ideal for Silicon Carbide (SiC), Gallium Nitride (GaN) and other top-of-the-line power devices.

Welco AP520 is a state-of-the-art water-soluble type 7 printing paste designed to solve the challenges of miniaturization, as it can create tiny and reliable joints with close to zero defects. With excellent paste release down to 90 µm pitch (55 µm stencil opening and 35 µm line spacing), no splashing and best-in-class low void performance, AP520 makes an excellent choice for fine-pitch components and flip chip attach for next-generation System-in-Package applications used in 5G communications, smart-wearables, and electric vehicles.

AP500X is a water-soluble, halogen-free tacky flux specifically engineered for ultra-fine bump-pitch flip chip attach and BGA attach applications. This new carefully designed flux plays an important part in eliminating defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, etc. in advanced semiconductor packages for high performance computing, memory, mobile and more.

As part of its drive to achieve greater sustainability, Heraeus Electronics offers an extended product portfolio with gold bonding wire made with 100 percent recycled gold and Welco solder paste series made with 100 percent recycled tin. Both gold and tin suppliers comply with Responsible Materials Initiatives (RMI) and IS014021:2016. Heraeus Materials Singapore also is certified with UL2809 in accordance with IS014021:2016.

With the latest materials portfolio and technical know-how, Heraeus Electronics is prepared to support customers in response to trends and challenges for EV (Electric Vehicles), 5G communications, IoT (Internet of things), AI (Artificial Intelligence), HPC (High Performance Computing) and environmental sustainability.

Visit Heraeus in booth C762 at SEMICON Korea to explore more.

To learn more about Heraeus Electronics, visit www.heraeus-electronics.com.

BALTIMORE, MD – Zentech Manufacturing Inc, an Electronic Manufacturing Services (EMS) company, is pleased to announce that it has been awarded the Stan Plzak Corporate Recognition Award. This award is named for former IPC Board Chairman Stanley Plzak and recognizes Zentech’s contributions to the electronics assembly industry and its support of the IPC through participation in technical and management programs. Zentech is proud to have actively worked with the IPC for many years to improve outcomes in our industry.

“Zentech is honored to be given an award named after one of the pioneers in the EMS industry,” said President and CEO Steve Pudles. “Over our 25-year history, Zentech has been involved in a wide range of IPC activities and was one of the first EMS companies to earn the IPC 1791 and IPC 610 certifications. We believe in the IPC’s mission to ‘build electronics better’ and encourage all member companies to participate in IPC programs and initiatives so together we can make our industry stronger and more successful.”

“IPC benefits tremendously from Zentech’s leadership, knowledge and expertise,” said John W. Mitchell, IPC president and CEO. “For many years, Zentech has consistently provided staff resources to standards development and other IPC programs and initiatives. IPC is privileged to have Zentech in our membership; their involvement in IPC has directly contributed to IPC’s global growth in the electronics industry.”