CLINTON, NY — Indium Corporation® will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 1‒3 in Miami, Florida. In addition, Indium Corporation’s Principal Engineer and Manager for the Thermal Interface Materials Applications, Dr. Andy Mackie, will chair a technical session on interconnects and lead attachments on February 2.

Amongst the company’s award-winning portfolio of proven products for power electronics, Indium Corporation will feature:

• InFORMS® are reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
• InTACK™ is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution without compromising soldering quality.
• QuickSinter® is a high metal content paste, redefining sinter technology for power electronics. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs.
• Durafuse™ HT features a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse™ HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.

Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication and assembly materials and processes. His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet the emerging thermal interface material requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master’s of Science (MSc) in colloid and interface science from the University of Bristol, UK.

REDMOND, WA — Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for security ICs, microcontrollers and memory devices will demonstrate significant performance improvements on the Lumen ® X programming platform for automotive grade Universal Flash Memory (UFS) devices with VerifyBoost™ and the latest evolution of the ConneX Service software platform for connected factory enablement in booth number 1334 at the IPC APEX Expo in San Diego, California from January 24th -26th.

About LumenX Programming Platform & VerifyBoost

VerifyBoost delivers rapid verify performance up to 750 MBps High-speed Gear3 x 2-Lane support for UFS devices for a massive 4.5x increase in performance. This enables our customers to immediately leverage existing production capacity for significant throughput gains, reduce the total cost of programming by up to 39% and maximize their existing investment in Data I/O’s programming technology. High-throughput PSV programming systems using LumenX programmers with high socket capacity and VerifyBoost enable manufacturers to use one PSV system to program what previously required multiple systems to produce. Learn more about VerifyBoost for LumenX programmers at www.dataio.com/VerifyBoost.

About ConneX Service Software

Electronics manufacturers, focused on operational efficiency to drive down costs and increase production capacity, are expanding their smart factory initiatives to integrate offline pre- programming processes into their Manufacturing Execution Systems (MES). ConneX enables customers to directly integrate data programming and security provisioning inputs and outputs between a Data I/O PSV programming system and an external application such as MES systems and analytics or web dashboards via industry standard protocols, to enable traceability, process analysis and two-way communication that improves factory efficiency and quality.

To show the power of ConneX, Data I/O will display an example of a factory monitoring application with samples of dashboards a customer can build by accessing key areas of data collected during the programming process including system status, availability, utilization, socket adapter usage statistics and more. Learn more about ConneX at www.dataio.com/Solutions/ConneX.

Customers attending the IPC APEX Expo in San Diego, California can visit Data I/O’s booth #1334 to see a demonstration of VerifyBoost for LumenX displaying up to 750 MBps performance, the ConneX Service Software with system monitoring dashboards and the PSV7000 and PSV5000 automated programming systems.

NEWARK, N.J. — Panasonic Connect North America will showcase its manufacturing solutions, including its newest NPM-GP/L screen printing machine and Auto-Setting Feeder at IPC APEX EXPO 2023. These new solutions allow the company to further aid manufacturing customers in their digital transformation processes and increase efficiency across their operations.

With the passing of the CHIPS Act, which includes $39 billion in manufacturing incentives, companies are reinvigorating their investments in their North American manufacturing plants so they can keep up with global demand. To do so, companies must implement emerging technologies, such as automation, into their production lines. Panasonic’s NPM-GP/L screen printing machine and Auto-Setting Feeder allow manufacturers to keep up with demand and future-proof their production lines by fixing issues in real- time.

At the Panasonic Connect booth #933, attendees have an opportunity to interact with several Panasonic manufacturing solutions, including:

• NPM-GP/L, a screen-printing machine that can be completely changed over in approximately four minutes, compared to the 10-minute industry standard. The NPM-GP/L can automatically implement production line changes with precise accuracy. An optional function can create a fully automatic printing process, supplying and collecting solder, reconfiguring pin support of the substrate, and undertaking a range of other processes required for production line changes. With this automation, production line changes can happen within a cycle time of approximately 12 seconds and with a printing accuracy of ±3.8 µm.
• Auto-Setting Feeder, an automated component supply system which offers the flexibility of easily fitting tape reels from 8mm up to 104mm in width. The Auto-Setting Feeder is the industry’s first feed mechanism that can automatically peel the cover on surface mount component tape between 4 mm and 104 mm wide. This enables the automatic supply of mounting components without requiring skilled workers. Further, when a reel of tape is finished, a loading unit automatically — and instantly — supplies the next reel. This facilitates full autonomy for the component supply process. Moreover, the use of a dedicated cart means that the current NPM and NPM-X series can support the Auto-Setting Feeder without restructuring the entire line.

The NPM-GP/L printer and the Auto-Setting Feeder provide a new level of speed, accuracy, and automatic process control for manufacturers. By implementing cutting-edge technologies which increase productivity, manufacturers can invest more time building a skilled workforce to handle higher level tasks. And with an estimated 2.1 million jobs expected to go unfilled by 2030, filling this talent pipeline is crucial.

Panasonic Connect is helping customers and industry professionals understand – and see – how automation enhances the future of manufacturing. Visit Panasonic Connect at IPC APEX EXPO 2023 booth #933. For more information visit: https://na.panasonic.com/us/event/apex-2023 

ARLINGTON, VA -- Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, and JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, announce a new collaboration to establish a framework for the transfer of technology captured in an OCP-approved specification to JEDEC for inclusion in one of its standards. This alliance brings together members from both the OCP and JEDEC communities to share efforts in developing and maintaining global standards needed to advance the electronics industry.

Under this new alliance, the current effort will be to provide a mechanism to standardize Chiplet part descriptions leveraging OCP Chiplet Data Extensible Markup Language (CDXML) specification to become part of JEDEC JEP30: Part Model Guidelines for use with today’s EDA tools. With this updated JEDEC standard, expected to be published in 2023, Chiplet builders will be able to provide electronically a standardized Chiplet part description to their customers paving the way for automating System in Package (SiP) design and build using Chiplets. The description will include information needed by SiP builders such as Chiplet thermal properties, physical and mechanical requirements, behavior specifications, power and signal integrity properties, testing the Chiplet in package, and security parameters.

“One of the key efforts at the OCP is centered around the need for specialized computation for AI and ML workloads driving the need for specialized silicon. To deliver on the need for specialized silicon while enabling a rapid pace of innovation, we believe a new open Chiplet economy with a low barrier to entry is needed and will require collaboration and standardizations on multiple dimensions, ensuring that companies are able to interact in an open efficient and scalable manner. The OCP has been investing in being a catalyst for an open Chiplet economy for several years through its Open Domain Specific Architecture (ODSA) Project and are pleased to establish this alliance with JEDEC to allow work done in ODSA to become part of a global international standard that advances the industry," said Cliff Grossner, Ph.D., VP Market Intelligence & innovation at the Open Compute Project Foundation.

There are many opportunities to create additional standardization efforts bringing together JEDEC’s strength in setting global standards for the microelectronics industry with OCP’s expertise in specifying system level devices seeding emerging technologies and markets, to set new global standards for novel device components in emerging markets eliminating market fragmentation and wasteful duplication of efforts by market participants.

“JEDEC is delighted to collaborate with the OCP to support our common goal to provide standards that serve the industry and move the market forward,” said John Kelly, President, JEDEC. “JEDEC and the OCP are united in our belief that standards developed in an open community and industry collaboration are essential to help foster efficient markets”.

“The silicon supply chain is diverse. It has to serve many vertical electronic equipment segments including Automotive, Personal Data Processing, Data Center and Enterprise Data Processing, Communications and Infrastructure, Medical, Defense, Aerospace and Industrial. Each market includes different value and application-specific requirements that need to be served. Processor suppliers have turned to highly heterogeneous chip platforms to remain competitive. This approach is becoming increasingly complex and costly to manufacture. In response to these challenges, chip builders have begun to adopt the use of chiplets. However, the same diversity that created the demand for chiplets, also makes it unlikely that any one supplier has the broad expertise to serve all these markets. Thus, many different Chiplet supply chains will emerge and no one solution will serve all markets. The emerging market around Chiplets will need many players and a low barrier to entry allowing for rapid innovation. Open communities sharing the effort for building common tools, prototypes, business workflows and standardizations are critical to accelerate a Chiplet Economy,” said Tom Hackenberg, Principal Analyst, Computing & Software Semiconductor, Memory and Computing Division, Yole Group