CONKLIN, NY — Universal Instruments will feature its Precision Automation solutions on Booth 1749 at the 2023 IPC APEX EXPO, held at the San Diego Convention Center on January 24–26. On the booth, Universal will showcase its Uflex® modular automation platform and IQ360™ Factory Software Suite. Uflex is the ultimate flexible multi-process assembly cell, eliminating the need for hard-tooled systems. Universal’s IQ360 software suite integrates all facets of factory operations for optimal productivity.

Uflex accommodates an array of process modules, as well as a wide variety of feeding options to perform virtually any automation task. It supports up to four independent process modules on a single gantry, including vacuum or pneumatic placement, screw driving, UV curing, or dispensing. This unique architecture offers investment protection versus single-task custom cells and can lower the cost per insertion by more than 95% versus manual assembly processes while improving quality and yield.

The IQ360 Software Suite is a full complement of smart factory modules designed to control, monitor and improve production efficiency. Comprised of Design & NPI, Material Management, Production Control, and Monitoring & Analytics modules, IQ360 offers individual capability bundles that meet specific factory requirements, providing a true “connected factory” production environment.

“Automating can be challenging for even a single product, but our customers need automation solutions that can adapt from one complex product to another,” noted Universal Instruments Vice President of Marketing, Glenn Farris. “Many of these products enlist a multitude of processes, such as high-accuracy alignment, flex handling, cutting and forming, inspection, and bonding. These precision automation applications are where we deliver the most value by leveraging our automation experience and breadth of technologies.” Farris added, “These applications are proliferating across markets including server/network infrastructure, IoT, high-reliability industrial, medical, mil-aero, mobility and automotive.”

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com.

REDDITCH, UK — As the first exhibition of 2023, Altus Group is looking forward to welcoming visitors to its stand at the Southern Manufacturing and Electronics 2023, from 7 – 9th February 2023. The team will be available to discuss their range of innovative equipment and solutions to optimise electronic manufacturing processes and improve production through turnkey solutions.

Showcasing the latest technology, Altus will demonstrate a range of equipment including 3D AOI inspection solutions and robotic soldering platforms. Altus is also pleased to announce they will welcome a representative from Essemtec to the stand who will demonstrate the latest smart sized modular pick-and-place machine, the ‘Fox MFC’. Their high-tech SMT assembly solutions can be easily configured to a wide variety of application needs and is dedicated to high-mix production to meet customers’ flexible requirements.

Joe Booth, CEO at Altus said: “We are supporting many of our equipment manufacturers at the show including Koh Young, YJ Link, and Promation USA. As principle distributors in the UK and Ireland for these companies, the exhibition is the perfect opportunity for Altus to not only meet with our suppliers but also the customers who will be using this equipment.

“We have an impressive range of products across SMT, conventional production, post production processes, and full component management to help customers implement full turnkey lines. The Altus team are looking forward to demonstrating the best-in-class equipment and discussing how we can assist in end-to-end processes.”

To view the most innovative technology for electronics production, and speak to our knowledgeable team, visit Altus on stand J130.

AUBURN HILLS, MI — The Murray Percival Company, the award-winning leading supplier to the Midwest's electronics industry, is pleased to announce their sales force will be in attendance at the IPC APEX EXPO 2023 and representing SCHUNK at the show. SCHUNK is widely regarded as the leading provider of depaneling solutions, clamping technology, and gripping systems.

SCHUNK depaneling machines, both inline and batch, are well known and highly thought of in the industry. With the World’s most precise stand-alone depaneling machines, SCHUNK systems meet the most demanding requirements in today’s PCB industry. SCHUNK is the world’s only manufacturer to offer depaneling machines and flexible workpiece holder solutions from one source.

“As a courtesy, our sales team likes to arrange appointments for customers at key exhibits on the show floor,” said MARCOM Manager Mark Percival Jr. “One of the sales people from our experienced team will ensure that you speak to the right people and see the newest technologies to get the most out of your show experience, so please feel free to reach out to us to set up an appointment at APEX this year.”

Recently The Murray Percival Company was awarded Distributor of the Year by the Global Technology Awards for the second year in a row by Global SMT & Packaging at SMTA International in Minnesota, MN. At the IPC APEX Expo, The Murray Percival Company will represent about 30 of the most prestigious companies in the electronics industry, including MIRTEC, SCHUNK, MacDermid Alpha, Kurtz Ersa, KYZEN, ITW EAE, Hanwha, Cluso, JBC, IDENTCO, Apollo Seiko, EVS International and many more!

CLINTON, NY — Indium Corporation®, through coordination with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Jan. 24‒26 in San Diego, Calif., U.S.

Live@APEX is a collaboration between Indium Corporation and its industry partners. The program benefits all participants, including Indium Corporation, partners, and, most importantly, the customers, who get to experience the equipment and materials in a live-action environment.

This year’s program will highlight Indium Corporation materials, including:

• CW-807 – electronics soldering cored wire
• CW-818 – no-clean, high-reliability flux-cored wire
• FP-500 – no-clean flux pen
• Indium8.9HF – no-clean solder paste formulated for the higher processing temperatures of the electronics industry
• Indium9.88HF – no-clean solder paste for use in package-on-package (PoP) applications
• Indium12.8HF – jetting and microdispensing solder paste
• PicoShot® – jetting paste series with exceptional jetting performance
• Sn995 – low-maintenance, low-cost, Pb-free soldering alloy
• TACFlux® 007 – leading die-attach flux for the light-emitting diode (LED) industry

You can see these products at the following partner booths:

• AIR-VAC Engineering (booth #3033)
• Apollo Seiko (booth #2345)
• Essemtec (booth #3001)
• Finetech (booth #1534)
• Hakko USA (booth #2306)
• ITW EAE (booth #1106)
• JBC Tools (booth #1741)
• Juki Automation Systems (booth #2700)
• Koh Young Technology (booth #1116)
• KYZEN (booth #1545)
• MicroCare (booth #2901)
• Mycronic (booth #1339)
• Nano Dimension - Essemtec (booth #3001)
• PARMI USA (booth #2147)
• Pillarhouse USA (booth #923)
• PVA (booth #3133)
• Smart Sonic (booth #1227)
• Trans-Tec America (booth #3109)
• Universal Instruments Corporation (booth #1749)
• VERMES Microdispensing - NSW Automation (booth #1605)
• Yamaha Motor Corporation (booth #2722)
• ZESTRON Corporation (booth #1941)

By demonstrating Indium Corporation products on live equipment at the IPC APEX Expo, attendees get an accurate and honest depiction of the material’s performance. If you see an Indium Corporation product running in a booth, be sure to Tweet and tag @IndiumCorp or use the hashtag #LiveatAPEX.

To learn more about the Live@APEX program, contact Product Development Specialist Miloš Lazić.