AUSTIN, TX ― Cetec ERP, a leading cloud ERP software provider, is pleased to announce that Jordan Jolly, Director of Sales and Implementation, will host a round table during the Wiring Harness Manufacturer’s Association (WHMA) Conference. The event is scheduled to take place Feb. 14-16, 2023 in Albuquerque, New Mexico.

Jolly will host the round table discussion entitled, ‘Making ERP Less Evil: An ERP Best Practices on Wednesday, Feb. 15th . ERP systems might be described as a "necessary evil". If they are necessary, in what ways do you think they could be made less evil? What lessons have you learned over the years?

Jolly has been directing ERP implementations for the electronics industry for more than 10 years, and has seen numerous different situations, successes and failures. He would love to share those experiences with a round table and potentially learn from others’ experiences as well.

Over the past 30 years, the WHMA Annual Wire Harness Conference has become one of few investments that give an opportunity to learn, grow, share, and discover new approaches to many aspects of the wire harness industry. The conference features a number of timely presentations on topics important to wire harness manufacturers, OEMs and suppliers. It also includes peer-to-peer networking, best-practices roundtables, a technical education workshop and an Exhibit Hall with industry leading suppliers. It’s a conference you do not want to miss! Cetec ERP’s leading-edge system helps customers handle stringent regulatory requirements and track dynamic production environments, all from a single, friendly web interface. All modules, support, maintenance and upgrades are included in the monthly subscription.

To learn more about Cetec ERP, visit http://cetecerp.com/ 

HELSINKI — Incap Estonia upgraded its two current SMT production lines and added a third SMT line to its factory in Kuressaare. The EUR 1.35 million investment increases the factory’s overall SMT production capacity by more than 50%.

According to Margus Jakobson, the Interim Managing Director of Incap Estonia, the investment in SMT (surface-mount technology) supports the company’s rapid growth and flexibility in customer service. New electronics equipment in the Kuressaare factory was acquired from SMT Renting on a long-term lease agreement.

“We decided to upgrade two existing production lines to make the production process faster. The third 30-meter long line will help to increase our SMT production capacity and increase it by more than 50%,” Jakobson explained. The new production machinery will contribute significantly to the production of the most important part of electronic devices.

Incap Estonia is part of Incap Corporation, which is an international contract manufacturer. Electronics manufactured by Incap Estonia can be found for example in smart meters, in light electric vehicles on the streets, in smart led lights in different regions in Estonia as well as in the machinery of the world’s most famous maritime company.

CLINTON, NY — Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicles, at NEPCON Japan, January 25‒27 in Tokyo, Japan.

With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature:

• InFORMS® are reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
• Heat-Spring® is a soft metal alloy (SMA) thermal interface material (TIM) that reduces thermal resistance and enhances cooling by utilizing two key properties of indium metal—superior thermal conductivity and malleability. As added benefits, indium metal will not dissolve in immersion fluids and is considered an environmentally friendly TIM because it can be re-used, reclaimed, and re-formed.
• Indium Corporation’s new GalliTHERM™ family of liquid metal pastes (LMPs) is a true liquid metal-based TIM solution, based on proprietary technologies, that can handle challenging heat dissipation issues and maintain long-term reliability. Unlike traditional gallium-based liquid metals which are prone to pump-out and typically require specialized spreading processes, LMPs offer higher viscosity and predictable spreading characteristics for scalable high-volume applications, with a reduced risk of pump-out, at a lower total cost. LMPs are fully automation-ready in jetting, dispensing, and printing applications. They require no backside metallization and exhibit superior surface wettability resulting in extremely low contact resistance and offer stable thermal impedance through accelerated aging tests.
• QuickSinter® is a high metal content paste, redefining sinter technology for power electronics. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs.
• Durafuse™ LT is an award-winning low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. It delivers improved drop shock performance more than two orders of magnitude better than Bi-containing low-temperature materials and helps reduce energy consumption by 15%, depending on process.
• Durafuse™ HT features a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse™ HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
• Indium Corporation’s Au-based precision die-attach (PDA) preforms—also available in off-eutectic formulations—offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. A leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision.

FREDERICK, MD — In the role of Vice President of Sales, Tom will be responsible for the leadership of the ACDi sales team that includes direct and in-direct sales personnel, developing new business opportunities that strategically align with the long-term goals of senior management.

Tom is a well-known figure in the electronics manufacturing services/contract manufacturing industry with over (35) years of experience. The last 20 years of his career was spent in various capacities where he was instrumental in the growth of the companies he worked for. Within the industry, Tom has also held Vice President of Sales positions with Sanmina and most recently with Libra Industries.

In addition, Tom has a proven record of facilitating long-term business relationships with both customers and industry luminaries. His strong winning attitude and personality are assets that will complement and enhance ADCi’s ability to meet the needs of our customers.

“We are all well aware of the challenges the electronics manufacturing industry has faced over the past couple of years,” said Bill Hornbaker, President & CEO at ACDi “We are especially excited about Tom joining the team and expanding our footprint as a true end-to-end trusted partner with our customers.”