DURYEA, PA — SMT Tooling, a division of PSA Systems, today announced that it will showcase its Matrix™ Automatic SMT Support Tooling system on a Hanwha/ESE printer during the 2023 IPC APEX EXPO. The company will demonstrate Matrix on the Hanwha/ESE US-2000DXH1 Screen Printer in Booth #1813 at the San Diego Convention Center in California.

“SMT Tooling is proud to support Hanwha’s line of printers and pick-and-place machines, and has a close relationship with Hanwha to grow and develop our line of components to accommodate specific needs presented to us,” stated Jeffrey Pulaski – SMT Tooling. “We look forward to continued success for both Hanwha and SMT Tooling.”

The unique Hanwha/ESE US-2000DXH1 Screen Printer is truly one of a kind in the market. The back-to-back configurable printer allows dual-lane processing for higher throughput., bar code recognition for setup verification, paperless cleaning (with environmentally friendly quick change-out cartridges that can be replaced is less than 5- seconds), and optional auto paste dispensing.

The stable and user-friendly operator interface includes Windows 10 and a 500GB hard drive. The fast and accurate Hanwha/ESE vision system for a simultaneous recognition of PCB and stencil (3-stage lighting for PCB, 1-stage lighting for stencil); any mark can be recognized/registered; auto calibration equipped.

The Matrix system installs in minutes and includes SMT Tooling’s’ proprietary pneumatic connections for quick and easy product changeover utilizing “Smart Touch” operator interface with on-screen operator instructions and access to PSA downloadable process apps. Features include feather-lite setup force and the most rigid locking force of any system in the industry.

SMT Tooling recognized the need for a more evenly spaced pin pattern when designing the latest version and formed the support modules with a diamond shaped pin pattern that fills in the gaps that contribute to "soft spots" in the support. The Matrix diamond grid pattern is key to a more even support in turn yielding much lower rate of defects like bridging etc.

The new and improved Matrix SMT tooling solution installs on most screen printers and placers in about 30 minutes and offers fully automatic PCB support to each consecutive board.

For more information about PSA Systems, visit www.smttooling.com 

TOKYO — Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Automotive powertrain and electric drive systems play critical roles in tackling our world’s energy and climate change challenges. The demand for higher efficiency of electrical drives in e-mobility to generate more travel distance or higher speed per battery loading requires perfectly matched materials providing high-temperature stability and maximum reliability. Heraeus offers innovative materials such as the Die Top System (DTS®), PowerCu Soft copper bonding wires and ribbons, mAgic® sinter pastes, lead-free solder pastes and metal ceramic substrates. These materials are perfectly matched to provide high temperature stability to exceed device reliability demands.

Mega trends such as 5G, artificial intelligence and high-performance computing continue to play a part in revolutionizing the semiconductor market. New material solutions are needed to meet the increasing demands and challenges of semiconductor advanced packaging. Specifically, three new products will be introduced from Heraeus Electronics – offering solutions to meet thermal dissipation, miniaturization and defect challenges.

mAgic® DA320 is a high shear strength, non-pressure dispensing sinter paste for die attach of power applications. The new sinter paste, featuring fast sintering, high shear strength and high thermal conductivity, is ideal for Silicon Carbide (SiC), Gallium Nitride (GaN) and other top-of-the-line power devices.

Welco AP520 is a state-of-the-art water-soluble type 7 printing paste designed to solve the challenges of miniaturization, as it can create tiny and reliable joints with close to zero defects. With excellent paste release down to 90 µm pitch (55 µm stencil opening and 35 µm line spacing), no splashing and best-in-class low void performance, AP520 makes an excellent choice for fine-pitch components and flip chip attach for next-generation System-in-Package applications used in 5G communications, smart-wearables and electric vehicles.

AP500X is a water-soluble, halogen-zero tacky flux specifically engineered for ultra-fine bump-pitch flip chip attach and BGA attach applications. This new carefully designed flux plays an important part in eliminating defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, etc. in advanced semiconductor packages for high performance computing, memory, mobile and more.

As part of its drive to achieve greater sustainability, Heraeus Electronics offers an extended product portfolio with gold bonding wire made with 100 percent recycled gold and Welco solder paste series made with 100 percent recycled tin. Both gold and tin suppliers comply with Responsible Materials Initiatives (RMI) and IS014021:2016. Heraeus Materials Singapore also is certified with UL2809 in accordance with IS014021:2016.

With the latest materials portfolio and technical know-how, Heraeus Electronics is prepared to support customers in response to trends and challenges for EV (Electric Vehicles), 5G communications, IoT (Internet of things), AI (Artificial Intelligence), HPC (High Performance Computing) and environmental sustainability.

Visit Heraeus Electronics at booth #25-36 at 24th IC & Sensor Packaging Technology Expo at NEPCON Japan to explore more.

To learn more about Heraeus Electronics, visit www.heraeus-electronics.com

TOKYO — Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, today announced the promotion of Craig Brown to General Manager of the company's US-subsidiary Saki America Inc. With over 25 years’ technical sales and leadership experience in the SMT industry, Craig will assume responsibilities as General Manager immediately and will lead the expansion of Saki’s business in the North American region.

Craig joined Saki in May 2022 as Sales Manager USA & Canada from his previous role of Sales Director at a global manufacturer and supplier of SMT equipment, where he managed sales teams and representatives both nationally and internationally in the USA, Canada, Mexico, Brazil, etc. Prior to that he acted as Sales Manager for North and South America at a screen-printing solutions provider.

"Craig's appointment strengthens our proposition both in the USA and internationally," said Norihiro Koike, President and CEO of Saki Corporation. "With his deep expertise in the SMT industry, an excellent track record in electronics manufacturing and sales & revenue operations and his proven experience in cultivating and growing territories, he will empower Saki to reach its full potential as a leading inspection solutions provider in North America. Offering the best AOI, AXI and SPI solutions in order to better serve our customers is a priority for Saki, and I'm excited to see what the future holds for our US-based operations with Craig leading the charge."

For more information about Saki visit www.sakicorp.com/en/ 

SINGAPORE — Novo Tellus, a leading private equity fund focused on building industrial and technology companies, has completed an investment in SP Manufacturing.

Headquartered in Singapore, SP Manufacturing is an Electronics Manufacturing Services provider for total manufacturing solutions from design concepts to full production. Focused on high-mix, high-performance mission critical electronics, SP has 6 locations strategically located across the globe in Southeast Asia, Europe, and China, with more than 60 years of manufacturing experience under its belt.

SP has grown considerably over the years due to its laser focus on customer service and innovative manufacturing techniques as a Reliable Solutions Partner. SP believes that the customer is at the heart of all that they do, and prides itself as being an extended manufacturing arm for all the key customers whom they serve.

With the investment from Novo Tellus, SP seeks to embark on the next chapter of the company's journey through active expansion, to meet the customers' needs and drive results through supply chain efficiencies. SP also intends to leverage upon NT's expert network and portfolio of companies, which would serve to open doors to new business opportunities and technological capabilities.

"We're indeed very pleased to partner with Novo Tellus to build the future of SP", noted Philip Ong, CEO of SP. "Having spent significant time with Novo Tellus, I feel that they deeply understand the many pressure points of operating a manufacturing business. Specifically, like us, they see the importance of adopting a long-term view on business relations, as well as customer centricity. Also, we've been most impressed with Novo Tellus' track record of growing industrial companies globally, and we are very excited to accelerate growth for our customers and to chart SP's future together.'

"We've been impressed with SP's specialised approach to building long-lived partnerships with global customers," said Keith Toh and Peishan Wong at Novo Tellus. "As a result, SP has grown 2 to 3 times faster than the global electronics manufacturing for over a decade now. We believe SP's ability to serve customers closely onshore in Europe and the United States, but also provide engineering and manufacturing services offshore in Southeast Asia and China, reflect the best strengths of where the modern global production network is evolving in the coming decade."

With the investment, Novo Tellus would acquire a controlling stake in SP, with the Company's family owners retaining a meaningful and active stake in the business.

To discover how SP Manufacturing can advance your mission critical electronics production and engineering, visit sp-manufacturing.com or contact SP directly below:

sales@sp-manufacturing.com